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News tagged capacity
  • Last update: Friday 20 October 2017 [1760 news items]

Hiwin expects to run at full capacity through 2Q18

Sep 7, 11:03

Mechanical motion control component maker Hiwin Technologies has obtained orders that will keep its production capacity fully occupied until second-quarter 2018, according to company...

Hiwin chairman Eric Chuo (left)

Winbond to set up new fab in southern Taiwan

Sep 6, 11:14

Taiwan's Ministry of Science and Technology (MOST) has approved specialty DRAM and flash maker Winbond Electronics' plan to set up a new fab at the Kaohsiung Science Park (KSP), southern...

Apple reportedly books up Largan capacity at new factory

Sep 5, 11:29

Apple reportedly has booked up the production capacity for above 12-megapixel lens modules at a new factory being built by smartphone lens module maker Largan Precision in central...

Largan Precision CEO Lin En-ping (right)

Digitimes Research: Taiwan top-3 foundries combined revenues to rise 13% in 3Q17

Sep 4, 14:14

Combined revenues of Taiwan's top-3 foundries - Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) - are...

Global PV installation capacity hikes to over 90GWp in 2017

Sep 4, 11:32

International research organizations originally forecast total installation capacity for PV power stations and distributed systems established around the world in 2017 at 70-80GWp,...

Most of 2017 capital spending will go to foundry and flash memory, says IC Insights

Sep 1, 11:28

Following a substantial increase in semiconductor capital expenditures during the first half of 2017, IC Insights raised its annual semiconductor capex forecast to a record high of...

Samsung seeking long-term supply contracts with wafer firms

Aug 30, 13:34

Samsung Electronics is striving to sign long-term supply contracts with multiple wafer makers to ensure sufficient silicon wafer supplies for the manufacture of memory chips and logic...

A new Samsung fab in Pyeongtaek to focus on 64-layer 3D NAND flash production

Taiwan passive component firms bracing for seasonal demand pickup

Aug 30, 13:08

Taiwan-based suppliers of capacitors, chip resistors, MLCCs and power inductors, as well as suppliers of materials for manufacturing these passive components, are bracing for a seasonal...

Taiwan passive component firms brace for seasonal demand pickup

LGD to double OLED TV panel production capacity by 2019

Aug 29, 15:26

LG Display will double its OLED TV panel production capacity to 120,000 substrates a month in 2019, when its new 8.5G production line in Guangzhou, China comes online, according to...

LG Display doubling its OLED TV panel production

Samsung to expand NAND chip capacity in China

Aug 29, 13:57

Samsung Electronics has disclosed plans to expand production capacity at its NAND flash memory wafer fab in Xian, northwest China for a total of US$7 billion over the next three ye...

Lite-On Semi obtains GPP diode orders from major China smartphone vendors

Aug 28, 10:58

Lite-On Semiconductor with its GPP (glass passivated package) bridge rectifiers has entered the supply chain of major China-based smartphone vendors including Huawei, Oppo, Vivo and...

Lite-On Semi and its subsidiary On-Bright are set to post strong 3Q17 results

Opto Tech to expand sensor chip capacity by 10%

Aug 25, 12:17

Opto Tech will invest NT$200-300 million (US$6.6-9.9 million) to expand production capacity for semiconductor-based sensor chips by 10%, with the expansion to be completed by the...

Distributed systems take up 50% of July PV installation capacity in China, says CEC

Aug 24, 15:30

The total installation capacity for PV power stations and distributed systems completed and on grid around China in July 2017 was estimated at 10.5GWp, equally shared by the two segments,...

BOE to catch up with LGD in large-size LCD panel unit shipments

Aug 24, 14:14

China-based BOE Technology will see unit shipments of its large-size LCD panels reach nearly those shipped by LG Display in 2017, and is also likely unseat LGD to become the world's...

LG Display will remain the top large-size panel vendor in terms of area shipments

Winbond announces equipment purchases

Aug 23, 15:05

Winbond Electronics, a memory chipmaker specializing in specialty DRAM and flash memory chips, has disclosed two purchases of machinery equipment from Lam Research and Tokyo Electron...

Copper foil maker Co-Tech net profits hit record for 4th consecutive quarter

Aug 23, 12:03

Rising copper foil prices continued to buoy Co-Tech Copper Foil's profitability in the second quarter of 2017, which hit a record high for the fourth consecutive quarter.

China PCB firms step up capacity expansion

Aug 22, 12:09

China-based PCB manufacturers including Suzhou Dongshan Precision Manufacturing (DSBJ) and Jiangxi Holitech Technology have moved to expand their production capacities eyeing a bigger...

China PCB firms expanding production capacity

Global 2Q17 NAND flash market posts 8% growth, says DRAMeXchange

Aug 22, 10:51

The worldwide NAND flash memory market posted revenues of US$13.22 billion in the second quarter of 2017, up 8% sequentially, according to DRAMeXchange.

Global DRAM revenues increase 17% in 2Q17, says DRAMeXchange

Aug 21, 11:34

Sales in the global DRAM market surged 16.9% sequentially to US$16.51 billion in the second quarter of 2017, when PC DRAM contract prices rose over 10%, according to DRAMeXchange...

China July PV installation estimated at 10.5GWp

Aug 21, 10:34

The PV power stations and distributed systems completed and on grid in China in July 2017 had an estimated total installation capacity of 10.5GWp, according to China Electricity Council...

Wafer Works expects wafer prices to continue rising on strong demand

Aug 18, 14:05

Taiwan-based Wafer Works, which makes small- to medium-size semiconductor-grade wafers, expects silicon wafer prices to continue rising on strong demand.

Getac shipping video solution products to US

Aug 17, 15:38

Ruggedized PC vendor Getac has successfully tapped into the police and law enforcement equipment market in the US with its Getac video solution (GVS) products.

James Hwang, Getac chairman

VGA RAM prices hike over 30% in August

Aug 16, 14:06

August quotes for RAMs used in VGA graphics cards have risen to US$8.50, up by 30.8% from US$6.50 in July. Both RAM industry leaders Samsung Electronics and SK Hynix have allocated...

VGA RAM in serious shortages

Taiwan Chelic 2Q17 revenues rise 58% sequentially

Aug 15, 16:03

Pneumatic automation component maker Taiwan Chelic has reported its second-quarter 2017 consolidated revenues reached NT$418 million (US$14.09 million), up 58.33% sequentially, with...

Chilisin to expand capacity for mini molding chokes

Aug 15, 13:58

Inductor and power choke maker Chilisin Electronics will expand production capacity for mini molding chokes with the new capacity to come online in September, while production efficiency...

SPIL to invest US$25 million in China

Aug 15, 10:27

Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...

Powerchip posts EPS of NT$1.59 for 1H17

Aug 15, 10:09

Contract chipmaker Powerchip Technology has announced net profits increased 17.6% on year to NT$3.63 billion (US$119.7 million) in the first half of 2017. EPS for the six-month period...

GCS optimistic about VCSEL demand for data centers

Aug 14, 11:09

Pure-play compound semiconductor wafer foundry Global Communication Semiconductors (GCS) has expressed optimism about gallium arsenide (GaAs) demand for vertical cavity surface-emitting...

Hiwin sees tight capacity as orders increase

Aug 11, 15:14

Mechanical motion control component and robot maker Hiwin Technologies have obtained orders far exceeding its existing production capacity and therefore has to delay shipments and...

Hiwin Technologies chairman Eric Chuo

Lite-On Semi reports EPS of NT$0.84 for 1H17

Aug 11, 15:03

Lite-On Semiconductor, a maker of discrete and analog IC components, saw its EPS for the second quarter of 2017 reach about the total for the first half of 2016. EPS for the first...

Sumco to expand production capacity for 300mm silicon wafers

Aug 9, 14:09

Sumco has announced plans to expand production capacity for 300mm silicon wafers by 110,000 units per month. The additional capacity is expected to come online in the first half of...

TSMC approves new capex spending for capacity expansion

Aug 9, 12:26

Taiwan Semiconductor Manufacturing Company (TSMC) has approved the appropriation of around US$3.15 billion, which includes funding for new facilities construction with costs estimated...

SMIC expects up to 3% revenue growth in 3Q17

Aug 9, 11:24

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post revenue growth of up to 3% sequentially in the third quarter of 2017, with gross margin...

China installs 24.4GWp PV power capacity in 1H17, says NEA

Aug 8, 15:00

PV power stations with total installation capacity of 17.29GWp and distributed systems with 7.11GWp were completed and on grid around China in first-half 2017, respectively decreasing...

Taiwan passive component makers post record July revenues

Aug 8, 10:53

Major Taiwan-based passive component makers including Yageo, Walsin Technology and Chilisin Electronics have reported record-high revenues for July 2017, thanks to a pick-up in customer...

Capacitor
1760 items [2/51]
  • Samsung+PM1633a+SSD

    Samsung PM1633a SSD

    Samsung Electronics has announced the PM1633a, a 15.36 terabyte (TB) drive. First revealed at the 2015 Flash Memory Summit in August, the 15.36TB SSD is based on a 12Gb/s Serial...

    Photo: Company, Mar 14.

  • Samsung+PRO+Plus+128GB+microSD+cards

    Samsung PRO Plus 128GB microSD cards

    Samsung Electronics has unveiled its PRO Plus 128GB microSD card series, which is built with company's MLC NAND flash solution. With the introduction of its new 128GB microSD card,...

    Photo: Company, Dec 23.

  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • Samsung+12Gb+LPDDR4+DRAM

    Samsung 12Gb LPDDR4 DRAM

    Samsung Electronics has announced that it is mass producing 12Gb LPDDR4 (low power, double data rate 4) mobile DRAM chips based on its 20nm process technology. The new LPDDR4 is...

    Photo: Company, Sep 18.

  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

20-Oct-2017 markets closed

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OTC electronic217.69+0.04+0.02% 

Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.