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News tagged book-to-bill ratio
  • Last update: Wednesday 27 August 2014 [65 news items]

PV book-to-bill ratio at 1.16 in 3Q10, says Solarbuzz

Dec 3, 11:20

In the third quarter of 2010, the book-to-bill ratio of photovoltaic (PV), manufacturing equipment fell after posting an eight-quarter high during the second quarter, to a three-month...

Japan chip gear book-to-bill continues to slide on-month

Nov 22, 13:41

The book-to-bill ratio for Japan-based semiconductor equipment manufacturers slipped to 1.12 in October 2010 from 1.14 in the prior month, according to the Semiconductor Equipment...

SEMI book-to-bill ratio drops below parity in October 2010

Nov 19, 16:09

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in October 2010 from 1.03 in the prior month.

SEMI book-to-bill ratio drops to 1.03 in September 2010

Oct 22, 14:07

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 1.03 in September 2010, compared to 1.17 in August and 1.23 in July.

North America chip gear book-to-bill ratio up in July 2010, says SEMI

Aug 20, 15:27

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.23 in July 2010, compared to 1.18 in June, according to SEMI. The book-to-bill of 1.23...

SEMI, SEAJ book-to-bill ratios stay strong in May 2010

Jun 21, 10:37

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.13 in May 2010, up from 1.07 in April, according to the Semiconductor Equipment Association...

North America chip-gear orders up 8% in April 2010, says SEMI

May 21, 14:01

North America-based manufacturers of semiconductor equipment posted US$1.44 billion in orders in April (three-month average basis), up 8.1% from the revised level of US$1.33 billion...

North America chip gear book-to-bill ratio at 1.19 in March 2010, says SEMI

Apr 21, 11:50

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.19 in March 2010, having been above parity for nine months in a row.

Japan chip gear book-to-bill ratio at 1.17 in March 2010, says SEAJ

Apr 20, 11:12

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.17 in March 2010, down from 1.34 in February but up significantly from the record level of 0.30...

Japan chip gear book-to-bill ratio jumps in January 2010, says SEAJ

Feb 23, 15:22

Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 1.36 in January 2010 compared to 1.3 in the prior month and 0.55 a year earlier, according to Semiconductor...

North America chip equipment orders top US$1 billion in January 2010, says SEMI

Feb 22, 10:12

North America-based manufacturers of semiconductor equipment posted US$1.13 billion in orders in January 2010 (three-month average basis) and a book-to-bill ratio of 1.20, according...

North American chip-gear industry posts book-to-bill ratio of 1.03 in December 2009, says SEMI

Jan 22, 12:15

North America-based manufacturers of semiconductor equipment posted US$863.3 million in orders in December 2009 (three-month average basis) and a book-to-bill ratio of 1.03, according...

Japan chip gear book-to-bill slips to 1.18 in November 2009

Dec 18, 14:09

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.18 in November 2009 compared to the prior month's level of 1.28, according to Semiconductor Equipment...

North America chip gear book-to-bill ratio at 1.06 in November 2009

Dec 18, 10:19

North America-based manufacturers of semiconductor equipment posted US$790.5 million in orders in November 2009 (three-month average basis) and a book-to-bill ratio of 1.06, according...

North America chip-gear book-to-bill remains above 1.0 in October, says SEMI

Nov 20, 10:49

North America-based semiconductor equipment manufacturers posted US$756.2 million in orders in October 2009 and a book-to-bill ratio of 1.10, according to SEMI. A book-to-bill of...

Japan chip-gear book-to-bill flat in October 2009, says SEAJ

Nov 19, 16:51

Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 1.28 in October 2009, similar to the prior month's level, according to data gathered by the Semiconductor...

North American chip equipment orders return to on-year growth track in September 2009, says SEMI

Oct 21, 10:18

September 2009 appears the first time since May 2007 that on-year bookings have risen and is in-line with the gradually improving capital spending outlook for the remainder of this...

Japan chip equipment orders down 22% on year in September 2009, says SEAJ

Oct 20, 16:27

Japan-based semiconductor equipment manufacturers received 61.567 billion yen (US$682.92 million) in orders in September 2009, down 22.2% from the same period in 2008, according to...

Japan chip equipment orders continue sequential growth in August 2009, says SEAJ

Sep 18, 16:55

Japan-based semiconductor equipment manufacturers posted about 55.46 billion yen (US$608 million) in orders in August 2009 (three-month average basis), and a book-to-bill ratio of...

Chip equipment bookings up for fifth consecutive month, says SEMI

Sep 18, 10:28

North America-based manufacturers of semiconductor equipment posted US$599 million in orders in August 2009 (three-month average basis) and a book-to-bill ratio of 1.03, according...

North America chip equipment orders up 62% sequentially in July, says SEMI

Aug 19, 12:04

North America-based manufacturers of semiconductor equipment posted US$569.7 million in orders in July 2009 (three-month average basis) and a book-to-bill ratio of 1.06, according...

Japan chip equipment bookings rise 37% in June, says SEAJ

Jul 23, 17:00

Japan-based semiconductor equipment manufacturers posted about 35.58 billion yen (US$377.32 million) in orders in June 2009 (three-month average basis) and a book-to-bill ratio of...

North American chip equipment orders continue recovery in June, says SEMI

Jul 22, 12:19

North America-based manufacturers of semiconductor equipment posted US$323.4 million in orders in June 2009 (three-month average basis) and a book-to-bill ratio of 0.77, according...

Chip equipment market bogged down by used equipment, says The Information Network

Jun 26, 16:15

Rises in the book-to-bill ratio for the North America and Japan semiconductor equipment sectors is giving optimism the industry downturn has bottomed out, but The Information Network...

North American chip equipment orders continue rising, says SEMI

Jun 19, 12:27

North America-based manufacturers of semiconductor equipment posted US$288.5 million in orders in May 2009 (three-month average basis) and a book-to-bill ratio of 0.74, according...

Japan chip equipment bookings up 45% sequentially in May, says SEAJ

Jun 18, 12:04

Japan-based semiconductor equipment manufacturers posted about 25.97 billion yen (US$268.76 million) in orders in May 2009 (three-month average basis) and a book-to-bill ratio of...

Japan chip equipment bookings end sequential drops in April

May 22, 16:06

Japan-based semiconductor equipment manufacturers posted 17,945 million yen (US$556.7 million) in orders in April 2009 (three-month average basis) and a book-to-bill ratio of 0.44,...

Flexible PCB shipment book-to-bill ratio drops to 0.87 in North America in March, says IPC

May 8, 09:47

Rigid PCB shipments were down 30.5% and bookings were down 39.8% in March 2009 from March 2008, according to IPC. Year to date, rigid PCB shipments were down 24.6% and bookings were...

Japan semiconductor equipment industry book-to-bill ratio reaches lowest ever in March

Apr 22, 10:10

The Japan semiconductor equipment book-to-bill ratio reached another new low in March, breaking the record level of 0.35 generated in February 2009 (three-month average), data gathered...

Japan semiconductor equipment industry book-to-bill ratio drops to new low

Mar 23, 10:18

Japan-based manufacturers of semiconductor equipment posted 13.68 billion yen (US$143 million) in orders in February 2009 (three-month average) and a book-to-bill ratio of 0.35, according...

65 items [2/2]
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