Taipei, Sunday, August 30, 2015 01:36 (GMT+8)
light rain
Taipei
25°C
News tagged book-to-bill ratio
  • Last update: Friday 21 August 2015 [78 news items]

Japan chip gear book-to-bill ratio at 1.06 in January 2012, says SEAJ

Feb 20, 11:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.06 in January 2012, down from 1.20 in December but up from 0.99 a year earlier, according to...

SEMI book-to-bill ratio grows three months in a row

Jan 30, 10:25

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.88 for December 2011, up for the third consecutive month, according to SEMI. A book-to-bill...

Japan chip gear book-to-bill ratio rises in October, says SEAJ

Nov 21, 16:22

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.83 for October 2011, up from 0.75 in September, according to new figures from the Semiconductor...

North America October chip-gear orders up 1%, says SEMI

Nov 18, 14:51

North America-based manufacturers of semiconductor equipment posted US$939.4 million in orders in October 2011 (on a three-month average basis), up 1.4% from the revised September...

PV equipment book-to-bill ratio drops below parity in 2Q11, says SEMI

Sep 22, 15:55

SEMI has reported that worldwide photovoltaic manufacturing equipment billings reached US$2.03 billion for the quarter ended on June 30, 2011. Billings increased 17% sequentially,...

SEMI book-to-bill ratio slips to 0.80 in August

Sep 16, 16:06

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.80 for August 2011, down from 0.85 in July, according to new figures from SEMI. A book-to-bill...

North America chip-gear orders slip in June, says SEMI

Jul 21, 01:00

North America-based manufacturers of semiconductor equipment posted US$1.55 billion in orders in June 2011 (three-month average basis), down 4.4% from the revised level of US$1.62...

SEMI book-to-bill ratio slips to 0.97 in May

Jun 17, 16:07

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for May 2011, down from 0.98 in April, according to new figures from SEMI.

Solar equipment book-to-bill ratio hits 1.13 in 4Q10

May 31, 14:47

According to research reports by international PV associations, the book-to-bill ratio for solar equipment was 1.13 in fourth-quarter 2010 indicating an expansion of the solar mark...

SEMI book-to-bill ratio rises to 0.95 in March

Apr 22, 10:45

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for March 2011, up from 0.87 in February, according to new figures from SEMI.

SEMI book-to-bill ratio stays below parity in February 2011

Mar 18, 15:49

North America-based manufacturers of semiconductor equipment posted US$1.58 billion in orders in February 2011 (three-month average basis) and a book-to-bill ratio of 0.87, according...

SEMI book-to-bill ratio slips again

Feb 23, 14:48

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.85 in January 2011, compared to 0.90 in December 2010 and 0.97 in November, according...

SEMI, SEAJ book-to-bill ratios slip in December 2010

Jan 21, 14:06

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.90 in December, down from 0.97 in November, according to SEMI. Meanwhile, data gathered...

PV book-to-bill ratio at 1.16 in 3Q10, says Solarbuzz

Dec 3, 11:20

In the third quarter of 2010, the book-to-bill ratio of photovoltaic (PV), manufacturing equipment fell after posting an eight-quarter high during the second quarter, to a three-month...

Japan chip gear book-to-bill continues to slide on-month

Nov 22, 13:41

The book-to-bill ratio for Japan-based semiconductor equipment manufacturers slipped to 1.12 in October 2010 from 1.14 in the prior month, according to the Semiconductor Equipment...

SEMI book-to-bill ratio drops below parity in October 2010

Nov 19, 16:09

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in October 2010 from 1.03 in the prior month.

SEMI book-to-bill ratio drops to 1.03 in September 2010

Oct 22, 14:07

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 1.03 in September 2010, compared to 1.17 in August and 1.23 in July.

North America chip gear book-to-bill ratio up in July 2010, says SEMI

Aug 20, 15:27

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.23 in July 2010, compared to 1.18 in June, according to SEMI. The book-to-bill of 1.23...

SEMI, SEAJ book-to-bill ratios stay strong in May 2010

Jun 21, 10:37

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.13 in May 2010, up from 1.07 in April, according to the Semiconductor Equipment Association...

North America chip-gear orders up 8% in April 2010, says SEMI

May 21, 14:01

North America-based manufacturers of semiconductor equipment posted US$1.44 billion in orders in April (three-month average basis), up 8.1% from the revised level of US$1.33 billion...

North America chip gear book-to-bill ratio at 1.19 in March 2010, says SEMI

Apr 21, 11:50

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.19 in March 2010, having been above parity for nine months in a row.

Japan chip gear book-to-bill ratio at 1.17 in March 2010, says SEAJ

Apr 20, 11:12

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.17 in March 2010, down from 1.34 in February but up significantly from the record level of 0.30...

Japan chip gear book-to-bill ratio jumps in January 2010, says SEAJ

Feb 23, 15:22

Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 1.36 in January 2010 compared to 1.3 in the prior month and 0.55 a year earlier, according to Semiconductor...

North America chip equipment orders top US$1 billion in January 2010, says SEMI

Feb 22, 10:12

North America-based manufacturers of semiconductor equipment posted US$1.13 billion in orders in January 2010 (three-month average basis) and a book-to-bill ratio of 1.20, according...

North American chip-gear industry posts book-to-bill ratio of 1.03 in December 2009, says SEMI

Jan 22, 12:15

North America-based manufacturers of semiconductor equipment posted US$863.3 million in orders in December 2009 (three-month average basis) and a book-to-bill ratio of 1.03, according...

Japan chip gear book-to-bill slips to 1.18 in November 2009

Dec 18, 14:09

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.18 in November 2009 compared to the prior month's level of 1.28, according to Semiconductor Equipment...

North America chip gear book-to-bill ratio at 1.06 in November 2009

Dec 18, 10:19

North America-based manufacturers of semiconductor equipment posted US$790.5 million in orders in November 2009 (three-month average basis) and a book-to-bill ratio of 1.06, according...

North America chip-gear book-to-bill remains above 1.0 in October, says SEMI

Nov 20, 10:49

North America-based semiconductor equipment manufacturers posted US$756.2 million in orders in October 2009 and a book-to-bill ratio of 1.10, according to SEMI. A book-to-bill of...

Japan chip-gear book-to-bill flat in October 2009, says SEAJ

Nov 19, 16:51

Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 1.28 in October 2009, similar to the prior month's level, according to data gathered by the Semiconductor...

North American chip equipment orders return to on-year growth track in September 2009, says SEMI

Oct 21, 10:18

September 2009 appears the first time since May 2007 that on-year bookings have risen and is in-line with the gradually improving capital spending outlook for the remainder of this...

Japan chip equipment orders down 22% on year in September 2009, says SEAJ

Oct 20, 16:27

Japan-based semiconductor equipment manufacturers received 61.567 billion yen (US$682.92 million) in orders in September 2009, down 22.2% from the same period in 2008, according to...

Japan chip equipment orders continue sequential growth in August 2009, says SEAJ

Sep 18, 16:55

Japan-based semiconductor equipment manufacturers posted about 55.46 billion yen (US$608 million) in orders in August 2009 (three-month average basis), and a book-to-bill ratio of...

Chip equipment bookings up for fifth consecutive month, says SEMI

Sep 18, 10:28

North America-based manufacturers of semiconductor equipment posted US$599 million in orders in August 2009 (three-month average basis) and a book-to-bill ratio of 1.03, according...

North America chip equipment orders up 62% sequentially in July, says SEMI

Aug 19, 12:04

North America-based manufacturers of semiconductor equipment posted US$569.7 million in orders in July 2009 (three-month average basis) and a book-to-bill ratio of 1.06, according...

Japan chip equipment bookings rise 37% in June, says SEAJ

Jul 23, 17:00

Japan-based semiconductor equipment manufacturers posted about 35.58 billion yen (US$377.32 million) in orders in June 2009 (three-month average basis) and a book-to-bill ratio of...

78 items [2/3]
High-brightness LED market trends and forecast, 2015
Wireless broadband developments in Southeast Asia markets

28-Aug-2015 markets closed

 LastChange

TAIEX (TSE)8019.18+194.63+2.49% 

TSE electronic307.57+6.94+2.31% 

GTSM (OTC)107.6+2.04+1.93% 

OTC electronic133.75+3.46+2.66% 

The transition to 4k TV - UHD TV market forecast, 2014-2017
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.