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News tagged BGA
  • Last update: Friday 21 December 2012 [14 news items]

Intel likely to figure a way to keep LGA design for CPUs, says Asustek executive

Dec 21, 14:40

Commenting on Intel's reported plans of abandoning CPU socket designs and changing to directly soldered CPUs after two years, Asustek Computer vice president and general manager of...

Digitimes Insight: Japan earthquake impact on IC packaging industry

Mar 22, 14:10

Though several major IC packaging material suppliers have resumed operations at their earthquake-affected plants, there is still growing concern that production will be hampered by...

Global IC packaging production value, 2002-2010

Nanya PCB to slash capex in 2011

Jan 7, 01:05

Nanya PCB (NPC) plans to drop its capital spending from NT$5 billion (US$171 million) in 2010 to less than NT$1 billion in 2011, as most of its investment for expanding capacity for...

PTI seeking clarity on ITC ruling in Tessera DRAM case

Mar 9, 14:27

Despite receiving a favorable ruling in a US International Trade Commission (ITC) over a patent infringement lawsuit brought by Tessera, memory packaging and testing service provider...

Solder material supplier Shenmao enjoys sequential revenue growth in January

Feb 10, 14:01

Shenmao Technology, a solder bumping paste supplier, has announced consolidated revenues for January 2010 grew 8.27% sequentially and 132.06% on year to NT$534 million (US$17 million)...

ChipMOS loses DRAM packaging patent lawsuit against Walton

Dec 24, 10:20

Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...

Solder material maker Shenmao expects revenues in 2010 to grow 20% on year

Nov 19, 16:41

Taiwan-based solder material maker Shenmao Technology expects its revenues in 2010 to grow 20% and reach a record high compared to 2009.

Solder sphere maker Shenmao sees revenues hit year-high in September

Oct 8, 14:41

Taiwan-based ball-grid array (BGA) solder sphere maker Shenmao Technology saw its consolidated revenues increase 6.4% sequentially to hit a year-high of NT$575 million (US$17.86 million)...

Shenmao expands BGA solder sphere capacity by 70%

Sep 11, 16:12

Shenmao Technology has expanded its production capacity of ball-grid array (BGA) solder spheres, its main product line, by 70% to meet orders from new clients, according to the com...

AMD adds new dual-core CPUs to embedded BGA client platform

Aug 12, 16:57

AMD has announced immediate availability of two new dual-core, 18W TDP processors for the scalable ASB1 BGA embedded client platform, the Turion Neo X2 processor Model L625 and the...

Nanya PCB expects strong 2H09 on CE demand

Jun 24, 14:42

Nan Ya Printed Circuit Board (NPC) has forecast its revenue ratio between the first and second halves of 2009 may be between 30:70 and 40:60, according to company president Otto Chang...

chang

KYEC 3Q09 sales may grow by double-digits, says CEO

May 19, 14:42

IC testing house King Yuan Electronics Company (KYEC) stands a good chance of enjoying double-digit sales growth sequentially in the third quarter of 2009, thanks to improved order...

Solder paste supplier Shenmao expected to see 40-50% revenue growth in 2Q09

Newswatch - May 12, 09:58

Shenmao Technology is optimistic about its second-quarter outlook, and market watchers expect its revenues to grow 40-50% in the quarter, with strong sales of solder paste and ball-grid...

Material supplier Shenmao adds two customers for BGA solder spheres

Mar 30, 17:04

Material supplier Shenmao Technology received orders for ball-grid array (BGA) solder spheres from two connector customers earlier in March and will begin volume shipments in April,...

  • Greenliant+NANDrive+GLS85LS

    Greenliant NANDrive GLS85LS

    Greenliant Systems has started volume production of its SATA interface NANDrive solid state drives (SSDs). The GLS85LS product family has the same pin-out across all capacities -...

    Photo: Company, Oct 6.

  • Cypress+EZ%2DUSB+FX3

    Cypress EZ-USB FX3

    Cypress Semiconductor has introduced its first USB 3.0 controller, the EZ-USB FX3 targeted at video and imaging, printing, scanning and a variety of applications that need higher...

    Photo: Company, Apr 14.

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