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News tagged ASE
  • Last update: Friday 11 April 2014 [332 news items]

ASE to open China regional headquarters

Sep 20, 11:34

Packaging and testing firm Advanced Semiconductor Engineering (ASE) will hold a groundbreaking ceremony for a regional headquarters in Shanghai on September 21, and is also expected...

ASE to sell CNY-denominated bonds, says paper

Stockwatch - Sep 14, 16:38

Taiwan-based Advanced Semiconductor Engineering (ASE) plans to issue Chinese yuan-denominated bonds worth a total of CNY650 million (US$102 million) in Hong Kong with an aim to boost...

ASE, SPIL post sequential growth in August sales

Sep 8, 01:25

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential growth of 2.9% and 6.7%, respectively, in consolidated revenues...

ASE plans another share buyback

Stockwatch - Sep 2, 01:05

Advanced Semiconductor Engineering (ASE) on August 29 announced that the company executed its fourth share buyback program ahead of schedule. Two days later, ASE issued a filing with...

MediaTek places additional orders with UMC on emerging market demand

Aug 31, 14:48

IC design house MediaTek, in view of increasing orders for its handset SoC solutions from China, India and other emerging markets, has released additional orders to United Microelectronics...

MediaTek

IC production value to grow modestly through 2014, says ASE

Aug 30, 12:17

The production value of the global semiconductor industry will achieve a CAGR of at least 7% for 2011-2014, IC packager Advanced Semiconductor Engineering (ASE) has commented, adding...

ASE to compete for orders for low pin-count packaging from IDMs

Aug 30, 01:00

Taiwan-based Advanced Semiconductor Engineering (ASE), viewing that global outsourced production value for wire-bonding packaging of low pin-count ICs, including logic and discrete...

More firms reducing exposure in DRAM packaging and testing market

Aug 22, 12:00

The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

ASE and SPIL look to continued growth in copper wire bonding business in 3Q11

Aug 15, 15:15

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...

ASE, SPIL report revenue gains for July

Newswatch - Aug 9, 12:09

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) both have reported sequential revenue gains for July. Revenues of ASE's core IC ATM (assembly...

ASE sees 3-6% growth in 3Q11 shipments

Aug 5, 01:00

IC packager Advanced Semiconductor Engineering (ASE) expects shipments to rise only 3-6% sequentially in the third quarter of 2011, well below seasonal patterns.

ASE CFO Joseph

ASE core ATM business likely to post 2% sales growth in 3Q11

Aug 4, 01:35

Advanced Semiconductor Engineering (ASE) is expected to see sales of its ATM (assembly test and material) division increase about 2% sequentially in the third quarter of 2011, according...

ASE, SPIL to post up to 5% growth in 3Q11 sales

Jul 22, 01:20

Judging from Intel's revenue outlook, market watchers expect Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) to see revenue growth of up to 5%...

Strong growth for semiconductor equipment in advanced packaging market, says Information Network

Jul 20, 10:28

Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...

ASE, SPIL reiterate 2011 capex outlook

Jul 14, 01:10

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have said they currently have no plans to adjust planned capex for 2011. Meanwhile, both IC packagers...

ASE core ATM business posts 4.5% growth in 2Q11 sales

Jul 8, 01:05

Advanced Semiconductor Engineering (ASE) saw sales of its ATM (assembly test and material) division decrease 3.7% sequentially to NT$10.55 billion (US$367 million) in June, due to...

SPIL 2Q11 sales miss guidance

Jul 6, 15:12

IC packaging and testing house Siliconware Precision Industries (SPIL) has reported consolidated revenues of NT$5.1 billion (US$176 million) for June, up 5.1% on month. Consolidated...

ASE says clients working through inventory

Jun 29, 16:47

Clients have slowed down their pace of orders since June, and are working through their chip inventories that were piled up over the previous two months, according to Tien Wu, COO...

ASE aims at global market share of 25-30% in 2014

Jun 29, 01:00

IC packaging/testing service provider Advanced Semiconductor Engineering (ASE) aims to hike its global market share from 17-18% in 2010 to 25-30% in 2014, COO Tien Wu said at the...

Major Taiwan IC backend firms developing copper pillar bumping

Jun 27, 13:54

Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...

ASE subsidiary sells DRAM testing equipment to PTI

Jun 27, 11:30

Power ASE Technology, a subsidiary of Advanced Semiconductor Engineering (ASE) specializing in DRAM packaging and testing, has announced that the company has sold some of its high-speed...

IC packagers post slight growth in May revenues

Jun 8, 10:19

Advanced Semiconductor Engineering (ASE) has announced that sales of its ATM (assembly test and material) division grew 1.8% sequentially to NT$10.95 billion (US$382 million) in May...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

ASE, SPIL April sales down slightly on-month

May 9, 16:11

Chip packaging and testing firms Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential drops of 2.5% and 5.1%, respectively, in...

ASE sees 7-9% growth in 2Q11 shipments; copper wire bonding sales rising

May 2, 14:01

Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...

IC packager ASE steps up investment in China

Apr 21, 01:20

Taiwan-based IC packaging and testing firm Advanced Semiconductor Engineering (ASE) has revealed plans to invest a total of US$1.2 billion on manufacturing facilities in Shanghai,...

IC backend 2Q11 sales likely affected by material shortages

Apr 14, 15:18

IC packaging and testing firms including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to provide a cautious outlook for the second...

ASE core ATM unit posts 5% sales drop in 1Q11; SPIL also down

Apr 8, 14:30

Advanced Semiconductor Engineering (ASE) has announced that sales of its ATM (assembly test and material) division slid 5.3% sequentially to NT$30.88 billion (US$1.07 billion) in...

ASE mulls plant expansion, says paper

Newswatch - Apr 6, 15:04

IC packager Advanced Semiconductor Engineering (ASE) has submitted an application to Taiwan's Ministry of Economic Affairs (MOEA), seeking approval to invest US$800-900 million to...

ASE to deal out dividend of NT$1.80 for 2010

Stockwatch - Mar 31, 01:30

Advanced Semiconductor Engineering (ASE) will deal out a dividend of NT$1.80 (US$0.06), including NT$1.15 in stocks and NT$0.65 in cash, for 2010, according to a decision made by...

ASE shipments affected by material supply interruptions, says paper

Newswatch - Mar 30, 15:02

Major IC packaging house Advanced Semiconductor Engineering (ASE) will have to postpone a portion of its shipments scheduled for the second quarter of 2011 to the third quarter, due...

Outsourced IC backend growth accelerating, says Digitimes Research

Mar 25, 15:11

The total market for semiconductor packaging and testing services grew 17.7% to US$44.755 billion in 2010, according to Digitimes Research. This represents the largest growth since...

ASE February sales down 11% sequentially

Mar 9, 10:53

Advanced Semiconductor Engineering (ASE) has announced consolidated revenues of NT$13.87 billion (US$471.5 million) for February 2011, down 11.1% sequentially. However, February sales...

SPIL January sales down 5% on-month

Feb 11, 14:54

IC packager Siliconware Precision Industries (SPIL) has announced consolidated revenues of NT$5.01 billion (US$172 million) for January 2011, down 5.6% on month. Sales also dropped...

332 items [5/10]
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