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News tagged ASE
  • Last update: Tuesday 16 December 2014 [351 news items]

PowerASE Technology to delist from stock market

Dec 13, 01:05

PowerASE Technology, a Taiwan-based provider of IC packaging/testing services belonging to the Advanced Semiconductor Engineering (ASE) Group, will withdraw its listing on the Emerging...

ASE revenues down 5% in November

Dec 7, 16:44

Advanced Semiconductor Engineering (ASE) has reported its core ATM (assembly test and material) division generated revenues of NT$10.7 billion (US$356 million) in November 2011, down...

TSMC gearing up for via-first TSV

Dec 5, 15:38

While major IC packagers have already devoted resources on TSV (via-last) development, Taiwan Semiconductor Manufacturing Company (TSMC) is also eyeing the market with its front-end...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

AKM to outsource more backend processing, says president

Nov 24, 15:52

Japan-based Asahi Kasei Microdevices (AKM), a supplier of mixed-signal ICs for consumer, automotive and communications applications, is looking to raise its backend orders to partners...

AKM president Hideki Kobori

ASE to acquire 100% stake in Power ASE

Stockwatch - Nov 11, 11:54

IC packager Advanced Semiconductor Engineering (ASE) has announced plans to acquire up to 107 million shares of Power ASE Technology, a joint venture with memory chipmaker Powerchip...

October revenues up slightly for IC packaging firms

Nov 8, 01:00

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Sigurd Microelectronics, four Taiwan-based providers of IC packaging/testing...

ASE to see lower 4Q11 shipments, flat margin

Oct 31, 10:11

IC packager Advanced Semiconductor Engineering (ASE) has forecast shipments for the fourth quarter of 2011 will decrease 3-4% sequentially, due to weak demand from Europe- and Japan-based...

ASE CFO Joseph Tung

Integration a must for packaging and testing industry, says ASE chairman

Oct 24, 15:04

If an industry like the semiconductor packaging and testing sector has more than 10 companies involved, only 3-4 of them can actually generate profits, according to Jason Chang, chairman...

ASE chairman Jason Chang

ASE opens new plant in Taiwan, outlines effort to expand operations

Oct 24, 11:27

IC packaging and testing firm Advanced Semiconductor Engineering (ASE) on October 23 opened a new plant, named K12, in Kaohsiung, southern Taiwan. During a ceremony marking the opening...

(Right to left) Taiwan president Ma Ying-jeou and ASE chairman Jason Chang

Packaging and testing firms see flat growth in 4Q11

Oct 21, 01:05

The global semiconductor packaging and testing industry will only see flat sequential growth in the fourth quarter of 2011, as it continues to feel the effects of the economic downturn,...

ASE seeking US$200 million syndicated loan, says paper

Newswatch - Oct 17, 15:53

Advanced Semiconductor Engineering (ASE), Taiwan's largest IC packaging and testing firm, is applying for a US$200 million syndicated loan to fund its operations in China, according...

ASE to open US$460 million plant

Oct 14, 01:05

IC packager Advanced Semiconductor Engineering (ASE) is scheduled to open its new US$460 million plant in Kaohsiung, southern Taiwan, on October 23. Chairman Jason Chang will host...

SPIL outperforms fellow backend firms in 3Q11

Oct 11, 12:13

Silicon Precision Industries' (SPIL) consolidated revenues for the third quarter of 2011 rose 10.8% sequentially, beating the firm's targeted 2-6% growth. But Advanced Semiconductor...

ASE, Amkor expanding to compete for IDM orders

Oct 7, 01:25

In view of increased outsourcing demand by IDM companies, IC packagers Advanced Semiconductor Engineering (ASE) and Amkor Technology has been expanding their operations to vie for...

Qualcomm reportedly starts shipping baseband chips for Mango phones

Sep 29, 01:25

Qualcomm has secured orders for baseband chips from Nokia and Samsung Electronics for their upcoming Windows Phone (Mango)-based smartphones with shipments kicking off in September,...

ASE looks to expand

Sep 23, 01:05

IC packaging and testing service provider Advanced Semiconductor Engineering (ASE) expects its consolidated revenues to top US$30 billion in 2020, and is eyeing a 30% global market...

ASE breaks ground on China headquarters

Sep 22, 01:00

Advanced Semiconductor Engineering (ASE) broke ground at the site of a regional headquarters in Zhangjiang, Shanghai on September 21. Operations are scheduled to commence in 2012,...

ASE announces another share buyback

Stockwatch - Sep 21, 14:28

Advanced Semiconductor Engineering (ASE) has announced a share buyback program, under which the company will repurchase up to 30 million of its common shares from the open market...

ASE to open China regional headquarters

Sep 20, 11:34

Packaging and testing firm Advanced Semiconductor Engineering (ASE) will hold a groundbreaking ceremony for a regional headquarters in Shanghai on September 21, and is also expected...

ASE to sell CNY-denominated bonds, says paper

Stockwatch - Sep 14, 16:38

Taiwan-based Advanced Semiconductor Engineering (ASE) plans to issue Chinese yuan-denominated bonds worth a total of CNY650 million (US$102 million) in Hong Kong with an aim to boost...

ASE, SPIL post sequential growth in August sales

Sep 8, 01:25

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential growth of 2.9% and 6.7%, respectively, in consolidated revenues...

ASE plans another share buyback

Stockwatch - Sep 2, 01:05

Advanced Semiconductor Engineering (ASE) on August 29 announced that the company executed its fourth share buyback program ahead of schedule. Two days later, ASE issued a filing with...

MediaTek places additional orders with UMC on emerging market demand

Aug 31, 14:48

IC design house MediaTek, in view of increasing orders for its handset SoC solutions from China, India and other emerging markets, has released additional orders to United Microelectronics...

MediaTek

IC production value to grow modestly through 2014, says ASE

Aug 30, 12:17

The production value of the global semiconductor industry will achieve a CAGR of at least 7% for 2011-2014, IC packager Advanced Semiconductor Engineering (ASE) has commented, adding...

ASE to compete for orders for low pin-count packaging from IDMs

Aug 30, 01:00

Taiwan-based Advanced Semiconductor Engineering (ASE), viewing that global outsourced production value for wire-bonding packaging of low pin-count ICs, including logic and discrete...

More firms reducing exposure in DRAM packaging and testing market

Aug 22, 12:00

The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

ASE and SPIL look to continued growth in copper wire bonding business in 3Q11

Aug 15, 15:15

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...

ASE, SPIL report revenue gains for July

Newswatch - Aug 9, 12:09

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) both have reported sequential revenue gains for July. Revenues of ASE's core IC ATM (assembly...

ASE sees 3-6% growth in 3Q11 shipments

Aug 5, 01:00

IC packager Advanced Semiconductor Engineering (ASE) expects shipments to rise only 3-6% sequentially in the third quarter of 2011, well below seasonal patterns.

ASE CFO Joseph

ASE core ATM business likely to post 2% sales growth in 3Q11

Aug 4, 01:35

Advanced Semiconductor Engineering (ASE) is expected to see sales of its ATM (assembly test and material) division increase about 2% sequentially in the third quarter of 2011, according...

ASE, SPIL to post up to 5% growth in 3Q11 sales

Jul 22, 01:20

Judging from Intel's revenue outlook, market watchers expect Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) to see revenue growth of up to 5%...

Strong growth for semiconductor equipment in advanced packaging market, says Information Network

Jul 20, 10:28

Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...

ASE, SPIL reiterate 2011 capex outlook

Jul 14, 01:10

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have said they currently have no plans to adjust planned capex for 2011. Meanwhile, both IC packagers...

351 items [5/11]
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