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News tagged ASE
  • Last update: Thursday 7 August 2014 [341 news items]

Packaging and testing firms see flat growth in 4Q11

Oct 21, 01:05

The global semiconductor packaging and testing industry will only see flat sequential growth in the fourth quarter of 2011, as it continues to feel the effects of the economic downturn,...

ASE seeking US$200 million syndicated loan, says paper

Newswatch - Oct 17, 15:53

Advanced Semiconductor Engineering (ASE), Taiwan's largest IC packaging and testing firm, is applying for a US$200 million syndicated loan to fund its operations in China, according...

ASE to open US$460 million plant

Oct 14, 01:05

IC packager Advanced Semiconductor Engineering (ASE) is scheduled to open its new US$460 million plant in Kaohsiung, southern Taiwan, on October 23. Chairman Jason Chang will host...

SPIL outperforms fellow backend firms in 3Q11

Oct 11, 12:13

Silicon Precision Industries' (SPIL) consolidated revenues for the third quarter of 2011 rose 10.8% sequentially, beating the firm's targeted 2-6% growth. But Advanced Semiconductor...

ASE, Amkor expanding to compete for IDM orders

Oct 7, 01:25

In view of increased outsourcing demand by IDM companies, IC packagers Advanced Semiconductor Engineering (ASE) and Amkor Technology has been expanding their operations to vie for...

Qualcomm reportedly starts shipping baseband chips for Mango phones

Sep 29, 01:25

Qualcomm has secured orders for baseband chips from Nokia and Samsung Electronics for their upcoming Windows Phone (Mango)-based smartphones with shipments kicking off in September,...

ASE looks to expand

Sep 23, 01:05

IC packaging and testing service provider Advanced Semiconductor Engineering (ASE) expects its consolidated revenues to top US$30 billion in 2020, and is eyeing a 30% global market...

ASE breaks ground on China headquarters

Sep 22, 01:00

Advanced Semiconductor Engineering (ASE) broke ground at the site of a regional headquarters in Zhangjiang, Shanghai on September 21. Operations are scheduled to commence in 2012,...

ASE announces another share buyback

Stockwatch - Sep 21, 14:28

Advanced Semiconductor Engineering (ASE) has announced a share buyback program, under which the company will repurchase up to 30 million of its common shares from the open market...

ASE to open China regional headquarters

Sep 20, 11:34

Packaging and testing firm Advanced Semiconductor Engineering (ASE) will hold a groundbreaking ceremony for a regional headquarters in Shanghai on September 21, and is also expected...

ASE to sell CNY-denominated bonds, says paper

Stockwatch - Sep 14, 16:38

Taiwan-based Advanced Semiconductor Engineering (ASE) plans to issue Chinese yuan-denominated bonds worth a total of CNY650 million (US$102 million) in Hong Kong with an aim to boost...

ASE, SPIL post sequential growth in August sales

Sep 8, 01:25

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential growth of 2.9% and 6.7%, respectively, in consolidated revenues...

ASE plans another share buyback

Stockwatch - Sep 2, 01:05

Advanced Semiconductor Engineering (ASE) on August 29 announced that the company executed its fourth share buyback program ahead of schedule. Two days later, ASE issued a filing with...

MediaTek places additional orders with UMC on emerging market demand

Aug 31, 14:48

IC design house MediaTek, in view of increasing orders for its handset SoC solutions from China, India and other emerging markets, has released additional orders to United Microelectronics...

MediaTek

IC production value to grow modestly through 2014, says ASE

Aug 30, 12:17

The production value of the global semiconductor industry will achieve a CAGR of at least 7% for 2011-2014, IC packager Advanced Semiconductor Engineering (ASE) has commented, adding...

ASE to compete for orders for low pin-count packaging from IDMs

Aug 30, 01:00

Taiwan-based Advanced Semiconductor Engineering (ASE), viewing that global outsourced production value for wire-bonding packaging of low pin-count ICs, including logic and discrete...

More firms reducing exposure in DRAM packaging and testing market

Aug 22, 12:00

The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

ASE and SPIL look to continued growth in copper wire bonding business in 3Q11

Aug 15, 15:15

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...

ASE, SPIL report revenue gains for July

Newswatch - Aug 9, 12:09

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) both have reported sequential revenue gains for July. Revenues of ASE's core IC ATM (assembly...

ASE sees 3-6% growth in 3Q11 shipments

Aug 5, 01:00

IC packager Advanced Semiconductor Engineering (ASE) expects shipments to rise only 3-6% sequentially in the third quarter of 2011, well below seasonal patterns.

ASE CFO Joseph

ASE core ATM business likely to post 2% sales growth in 3Q11

Aug 4, 01:35

Advanced Semiconductor Engineering (ASE) is expected to see sales of its ATM (assembly test and material) division increase about 2% sequentially in the third quarter of 2011, according...

ASE, SPIL to post up to 5% growth in 3Q11 sales

Jul 22, 01:20

Judging from Intel's revenue outlook, market watchers expect Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) to see revenue growth of up to 5%...

Strong growth for semiconductor equipment in advanced packaging market, says Information Network

Jul 20, 10:28

Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...

ASE, SPIL reiterate 2011 capex outlook

Jul 14, 01:10

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have said they currently have no plans to adjust planned capex for 2011. Meanwhile, both IC packagers...

ASE core ATM business posts 4.5% growth in 2Q11 sales

Jul 8, 01:05

Advanced Semiconductor Engineering (ASE) saw sales of its ATM (assembly test and material) division decrease 3.7% sequentially to NT$10.55 billion (US$367 million) in June, due to...

SPIL 2Q11 sales miss guidance

Jul 6, 15:12

IC packaging and testing house Siliconware Precision Industries (SPIL) has reported consolidated revenues of NT$5.1 billion (US$176 million) for June, up 5.1% on month. Consolidated...

ASE says clients working through inventory

Jun 29, 16:47

Clients have slowed down their pace of orders since June, and are working through their chip inventories that were piled up over the previous two months, according to Tien Wu, COO...

ASE aims at global market share of 25-30% in 2014

Jun 29, 01:00

IC packaging/testing service provider Advanced Semiconductor Engineering (ASE) aims to hike its global market share from 17-18% in 2010 to 25-30% in 2014, COO Tien Wu said at the...

Major Taiwan IC backend firms developing copper pillar bumping

Jun 27, 13:54

Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...

ASE subsidiary sells DRAM testing equipment to PTI

Jun 27, 11:30

Power ASE Technology, a subsidiary of Advanced Semiconductor Engineering (ASE) specializing in DRAM packaging and testing, has announced that the company has sold some of its high-speed...

IC packagers post slight growth in May revenues

Jun 8, 10:19

Advanced Semiconductor Engineering (ASE) has announced that sales of its ATM (assembly test and material) division grew 1.8% sequentially to NT$10.95 billion (US$382 million) in May...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

ASE, SPIL April sales down slightly on-month

May 9, 16:11

Chip packaging and testing firms Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential drops of 2.5% and 5.1%, respectively, in...

ASE sees 7-9% growth in 2Q11 shipments; copper wire bonding sales rising

May 2, 14:01

Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...

341 items [5/10]
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