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Thursday 11 May 2023
Most Taiwan OSATs see sales decline in April
Many Taiwan-based OSATs, including ASE Technology Holding (ASEH), have reported declines for April sales, but Powertech Technology (PTI) and Ardentec saw some positive results in...
Wednesday 3 May 2023
OSATs remain cautious about handset IC demand
OSATs remain cautious about handset IC demand despite the emergence of short lead-time orders, according to industry sources.
Tuesday 2 May 2023
OSATs see a delay in capacity demand from MediaTek
With unclear business outlook from Taiwan's mobile SoC vendor MediaTek, its backend partners including ASE Technology, Powertech Technology (PTI), Sigurd Microelectronics and King...
Friday 28 April 2023
ASE expects factory utilization to rebound in 2H23
OSAT ASE Technology (ASE) anticipates a return to 80% plant utilization in the second half of 2023, up from 60% in the first half of the year. After the third quarter, the business...
Wednesday 26 April 2023
OSATs continue to cut prices to maintain utilization rates
Leading Taiwan-based OSATs including Powertech Technology (PTI) and ASE Group are reducing prices amid ongoing cost pressures, according to industry sources.
Tuesday 25 April 2023
ASEH, Amkor expanding production outside of China and Taiwan
ASE Technology (ASEH) and Amkor Technology, the world's top two OSATs, have both expanded production outside of China and Taiwan, according to industry sources.
Friday 21 April 2023
OSATs striving to cut wafer bank inventories
OSATs are striving to offload "wafer bank" inventories stored for customers, and are generally pessimistic about their sales prospects for the second and third quarters, according...
Wednesday 19 April 2023
OSATs see handset IC demand remain sluggish
ASE Technology and other OSATs continue to experience low production utilization rates for flip-chip (FC) packaging, due to sluggish demand for handset ICs, according to industry...
Tuesday 18 April 2023
3D fabric business pushes TSMC into top 3 largest OSATs
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Tuesday 18 April 2023
System-level testing demand rising; TSMC, Intel, and other foundries are in
System-level testing demand for advanced ICs has been rising. Foundries including TSMC, Intel and Samsung Electronics, as well as OSATs such as ASE Technology, are already involved,...
Tuesday 18 April 2023
Chip suppliers see slight pick-up in orders for Android smartphones
Radio-frequency (RF) and power amplifier (PA) chip suppliers have noticed a slight pick-up in orders for Android smartphones as related brand vendors prepare for China's approaching...
Monday 17 April 2023
Japan keen on building chiplet technology and ecosystem
While the Intel-initiated Universal Chiplet Interconnect Express (UCIe) consortium has attracted many participants, Japan's academic and industry players are also stepping up efforts...
Friday 14 April 2023
ASE made wise decision to sell China plants in 2021, say sources
Taiwan-based ASE Group, a global OSAT leader, made a wise decision by selling four plants in China in 2021, judging from the developments of the market since then, according to industry...
Wednesday 12 April 2023
Mobile phone AP supply chain expects recovery in 3Q23
Semiconductor backend packaging and testing and mobile phone power amplifier (PA) companies agree that visibility for large-scale orders is still unclear going into the second quarter...
Friday 31 March 2023
IDMs upbeat about revenue prospects, benefiting Taiwan supply chain partners
Robust demand for Si-IGBT and SiC power modules for automotive and industrial control applications has inspired IDMs such as Infineon to become upbeat about their revenue prospects...
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