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    NEWS TAGGED AMD NEO
    Friday 16 January 2009
    AMD adds new CPUs, a chipset and packaging technology to its embedded lineup
    AMD has added two new CPUs (Sempron 200U and 210U), a new chipset (780E) and ASB1 ball grid array packaging technology to its embedded lineup.
    Wednesday 7 January 2009
    AMD delivers new platform for ultra-thin notebooks
    AMD has announced the availability of an new AMD platform for ultra-thin notebooks.
    megawin
    BIZ FOCUS
    Apr 18, 16:28
    Connections Summit 2024 gathers RFID industry to discuss market trends, technical developments and future use cases for technology
    Thursday 18 April 2024
    GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
    Wednesday 17 April 2024
    DigiKey and NXP unveil MCX MCU Design Contest at Embedded World 2024
    Wednesday 17 April 2024
    FPT Software's major partnerships in Taiwan: Driving expansion, empowering talent acquisition, and spearheading digital transformation
    Summary of Tech Supply Chain News!
    RESEARCH INSIGHTS
    Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research
    Global smartphone shipments hit 2023 peak in 4Q23, but decelerate in 1Q24 due to seasonality, says DIGITIMES Research
    Meet the analyst: Operating system in AI era will be king, says DIGITIMES Research