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News tagged 3D
  • Last update: Wednesday 15 March 2017 [367 news items]

ASE, Inotera reportedly to set up 3D IC packaging joint venture

Mar 31, 21:48

Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.

Abico to push 3D printers into Taiwan procurement market in 2014

Mar 21, 14:08

Taiwan-based digital camera maker Abico Digital Imaging expects its 3D printer business to achieve good sales in 2014 with orders from the government and education procurement market...

Hong Kong Electronics Fair to push 3D printing, baby electronics and mobile communication products

Mar 19, 21:51

The Hong Kong Trade Development Council (HKTDC) is set to host the Hong Kong Electronics Fair – Spring Edition 2014, from April 13-16 and will promote products such as 3D printing,...

3D printer market expected to reach 6 million units by 2018, says IEK

Feb 18, 15:05

The 3D printer market is expected to grow from 100,000 units in 2014 to about six million units in 2018, according to the Industrial Economics & Knowledge Center (IEK) under Taiwan's...

Global NAND flash output value to top US$27 billion in 2014, says DRAMeXchange

Jan 15, 14:07

Output value for the global NAND flash industry is forecast to exceed US$27 billion in 2014, up from about US$24.6 billion in 2013, as solid-state drives (SSD) are poised for widespread...

3D gesture-sensing technologies in smart devices poised for double-digit growth, says DisplaySearch

Jan 10, 12:32

Nearly 330 million smart devices with gesture-sensing will be shipped in 2015, a nearly 70% increase over the 2014 forecast and a doubling of shipments in 2013. According to DisplaySearch,...

XYZprinting to begin shipments of own-brand 3D printers

Dec 18, 11:58

XYZprinting, a joint venture of Taiwan-based Kinpo Electronics and Thailand-based Cal-Comp Electronics, has launched an in-house-developed own-brand 3D printer, XYZprinting da Vinci...

Aurora unveils first own-brand 3D printer

Dec 4, 11:33

Aurora, a Taiwan-based distributor of office automation machines and office furniture, has unveiled F1, its first own-brand 3D printer, for launch initially in the Taiwan market at...

Aurora 3D printer

China TV vendors look to release glasses-free 3D Ultra HD TVs in 2014

Nov 18, 15:13

China TV vendors are looking to release glasses-free 3D Ultra HD TVs by the Lunar New Year period set to take place in early 2014.

SMIC forms R&D and manufacturing center for sensors, 3D IC

Oct 22, 16:14

China-based IC foundry Semiconductor Manufacturing International (SMIC) has announced the formation of an R&D and manufacturing center for sensors and 3D ICs, the Center for CVS3D...

Xilinx, TSMC reach volume production on 28nm 3D ICs

Oct 21, 15:16

Xilinx and TSMC have jointly announced production release of the Virtex-7 HT family, what the pair claims is the industry's first heterogeneous 3D ICs in production.

NAND flash moves into next dimension as 3D manufacturing technology overtakes the market, says IHS

Oct 4, 11:59

With conventional semiconductor manufacturing technology soon to reach its limit in the NAND flash segment, suppliers of these memory chips are set to adopt 3D production techniques...

China market: Aurora lands exclusive sales agent rights for Stratasys 3D printers

Sep 25, 20:32

Taiwan-based office automation machine and office furniture distributor Aurora on September 25 signed with US-based Stratasys in Shanghai, eastern China, for exclusive sales agent...

TSMC and OIP ecosystem partners deliver 16FinFET and 3D IC reference flows

Sep 17, 21:20

Taiwan Semiconductor Manufacturing Company (TSMC) has released three silicon-validated reference flows within the Open Innovation Platform (OIP) that enable 16FinFET system-on-chip...

G-Tech to expand capacity for 3D forming glass products used in vehicles

Sep 17, 15:40

G-Tech Optoelectronics is reportedly solidifying orders for 3D forming glass products used in the vehicle industry and currently has a monthly production capacity for the technology...

3D NAND, FinFET to drive semiconductor equipment market growth, says Applied Materials

Sep 6, 12:11

With chipmakers engaged in the development of 3D NAND and FinFET technologies, the global semiconductor market is set to expand another 25-35%, said an Applied Materials executive...

Erix Yu, president of Applied Materials Taiwan

Austrian chipmaker ams to set up 3D IC production line

Sep 5, 10:50

Austria-based ams, a provider of high performance analog ICs and sensor solutions, has announced plans to invest over EUR25 million (US$33 million) to install 3D IC production capacity...

NAND flash vendors gearing up for 3D chips

Aug 27, 13:45

Samsung Electronics, Toshiba and Micron Technology have recently disclosed their 3D NAND flash memory developments. The vendors' 3D NAND chips are expected to be in early-stage production...

Kinpo-Compal releases 3D printer

Aug 26, 21:12

Kinpo-Compal Group has recently established a subsidiary to push own-brand consumer 3D printers and announced its first model under the brand name XYZprinting priced only less than...

Taiwan market: Kinpo to launch own-brand 3D printers

Aug 22, 22:12

Taiwan-based Kinpo Electronics plans to launch own-brand 3D printers, targeting the entry-level and mid-range segment initially, according to company chairman Rock Hsu.

Samsung intros 3D V-NAND SSD for enterprise applications

Aug 16, 15:49

Samsung Electronics has introduced a solid state drive (SSD) based on its 3D V-NAND technology. The new SSD, unveiled during a keynote at the Flash Memory Summit 2013 in California,...

Samsung unveils first 3D V-NAND SSD

Young Optics to begin shipping prototype 3D printers in 2H13

Aug 12, 14:00

Optical module maker Young Optics has been cooperating with potential clients to develop 3D printers for use in designing jewels and dentures, and will begin to ship prototypes in...

Samsung starts mass producing 3D vertical NAND flash

Aug 6, 21:35

Samsung Electronics has begun mass producing 3D vertical NAND (V-NAND) flash memory chips, designed for a wide range of consumer electronics and enterprise applications such as embedded...

Samsung 3D V-NAND

Kinpo, Cal-Comp working on landing orders for 3D printers, says paper

Newswatch - Jul 23, 15:20

Taiwan-based Kinpo Electronics and Cal-Comp are together trying to land component or manufacturing orders from 3D printer makers such as 3D Systems and Stratasys, according to a Chinese-language...

Taiwan market: Epson to launch 3D home theater projector

Jul 10, 14:54

Seiko Epson on July 10 unveiled the Epson EH-TW550, a 3D home theater projector featuring a brightness of 3,000lm in both white and color, contrast of 5000:1 and support for Blu-ray...

LED lighting, 3D printing to light up Photonics Festival Taiwan 2013

Jun 14, 10:31

The Photonics Festival in Taiwan will be held at Nangang Exhibition Hall in Taipei from June 18-20. The exhibition features 649 firms and 1,502 booths. Bio-medical optics technology,...

SolidWizard Technology scores points in marketing 3D printers for 3D Systems

Jun 4, 21:24

SolidWizard Technology, a Taiwan-based provider of value-added complete system integration and consultation services for software products developed by US-based Dassault Systems SolidWorks,...

Etron to begin shipping 3D image sensors in July

May 30, 14:23

IC design house Etron Technology has announced the development of a single-chip 3D image sensor, the eSP870, which will be shipped to a China-based TV maker starting July.

Can Ultra HD TVs avoid the fate of 3D sets? asks IHS

May 22, 15:30

TV industry participants gathering at the Society for Information Display (SID) 2013 Display Week event are showcasing the product they hope will rejuvenate the market: the Ultra...

GTOC sees increased performance in 1Q13 due to 3D molded glass sales

May 16, 15:08

Glass substrate processing service provider G-Tech Optoelectronics (GTOC), a subsidiary of Hon Hai Precision Industry (Foxconn Electronics), saw its revenues increase 8% on quarter...

Early 3D printing adopters could gain innovation advantage over rivals, says Gartner

Apr 19, 10:41

3D printing is disrupting the design, prototyping and manufacturing processes in a wide range of industries, according to Gartner. Enterprises should start experimenting with 3D printing...

Globalfoundries demos 3D TSV capabilities on 20nm

Apr 3, 10:07

Globalfoundries on April 2 announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At...

BenQ to release Full HD 3D projectors in 2013

Mar 29, 15:14

BenQ will release Full HD 3D short focal projectors in 2013 and aims to sell them within commercial, education and entertainment segments, according to general manager of BenQ's Technology...

Demand for 3D optical film rises as passive 3D TV competes with shutter glass, says DisplaySearch

Mar 28, 12:04

As 3D TV continues to grow, competition between two main 3D technologies is heating up, and film patterned retarder is finally catching up to the more established shutter glass approach...

Imagination, TSMC extend collaboration to FinFET and 3D ICs

Mar 26, 10:27

Imagination Technologies and contract chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) have announced the next phase of their technology collaboration.

367 items [3/11]
Realtime news
  • Nintendo expects to ship 20 million Switch devices in first year

    IT + CE | 6min ago

  • Lenovo plans to offer 3-5 Mods smartphone accessories a quarter

    Mobile + telecom | 33min ago

  • China Mobile 2016 net profit up 0.2% on year

    Mobile + telecom | 1h 4min ago

  • TEEMA forms automotive alliance

    IT + CE | 1h 51min ago

  • Tencent 2016 net profit up 42.4% on year

    IT + CE | 1h 53min ago

  • Taiwan February manufacturing production index down on month, up on year, says MOEA

    Bits + chips | 1h 55min ago

  • Audio IC firm C-Media 2016 profits fall to 3-year low

    Bits + chips | 1h 56min ago

  • SPIL to pay NT$1.75 cash dividend for 2016

    Bits + chips | 1h 58min ago

  • TSMC to start installing equipment at Nanjing fab in 2H17

    Bits + chips | 2h 2min ago

  • Win Semi to deal out cash dividend of NT$4.50 for 2016

    Bits + chips | 2h 4min ago

  • Samsung, eSilicon tape out 14nm network processor with Rambus 28G SerDes solution

    Bits + chips | Mar 23, 21:14

  • Apple iPhone 6s tops list of best-selling smartphones for 2016, says IHS

    Mobile + telecom | Mar 23, 21:11

  • ASE says no plan to set up local site in US for packaging services

    Bits + chips | Mar 23, 21:09

  • SAS suffers net loss per share of NT$2.77 for 2016

    Before Going to Press | Mar 23, 20:58

  • Digitimes Research: 3G/4G becomes mainstream in India in 2016-2017

    Before Going to Press | Mar 23, 20:57

  • Everlight Electronics nets NT$4.13 per share for 2016

    Before Going to Press | Mar 23, 20:54

  • Chunghwa Telecom procures 4G equipment from Nokia

    Before Going to Press | Mar 23, 20:50

  • AUO procures TFT-LCD equipment

    Before Going to Press | Mar 23, 20:49

  • India market: Handset sales proportion from online channels rises to nearly 35%

    Before Going to Press | Mar 23, 20:49

  • Systex nets NT$4.50 per share for 2016

    Before Going to Press | Mar 23, 20:46

  • Bright Led Electronics to hand out 2016 dividend of NT$0.80

    Before Going to Press | Mar 23, 20:45

  • GMT to deal out 2016 dividend of NT$5

    Before Going to Press | Mar 23, 20:43

  • InterServ International to not hand out 2016 dividend

    Before Going to Press | Mar 23, 20:33

  • Oppo actively tapping overseas markets

    Before Going to Press | Mar 23, 20:32

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  • Samsung+256GB+UFS+card

    Samsung 256GB UFS card

    Samsung Electronics has unveiled removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard for use in high-resolution mobile shooting devices...

    Photo: Company, Jul 13.

  • Apple+iPhone+6s+and+iPhone+6s+Plus

    Apple iPhone 6s and iPhone 6s Plus

    Apple has announced the iPhone 6s and iPhone 6s Plus, the latest iPhone models from the company. The new iPhones introduce 3D Touch, which senses force to access features and interact...

    Photo: Company, Sep 11.

  • Samsung+V%2DNAND+SSDs

    Samsung V-NAND SSDs

    Samsung Electronics has announced that it is adding three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its portfolio of...

    Photo: Company, Aug 27.

  • Intel+fifth%2Dgeneration+Core+%28Broadwell%2DH%29+processors

    Intel fifth-generation Core (Broadwell-H) processors

    The fifth-generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris Pro graphics, Intel's most powerful client processor graphics...

    Photo: Company, Jun 4.

  • Samsung+850+EVO+M%2E2+and+850+EVO+mSATA+SSD

    Samsung 850 EVO M.2 and 850 EVO mSATA SSD

    Samsung Electronics has unveiled the 850 EVO M.2 and 850 EVO mSATA solid state drive (SSD) lineups. The 850 EVO M.2 and mSATA SSDs are new form factors of the 850 EVO SSD that launched...

    Photo: Company, Apr 14.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

23-Mar-2017 markets closed

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TAIEX (TSE)9930.74+8.08+0.08% 

TSE electronic404.77+0.39+0.1% 

GTSM (OTC)137.66+0.04+0.03% 

OTC electronic194.25+0.33+0.17% 

The transition to 4k TV - UHD TV market forecast, 2014-2017
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.