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News tagged 3D
  • Last update: Monday 18 December 2017 [467 news items]

Supply of NAND flash for new iPhone falling short

Jul 5, 22:17

SK Hynix and Toshiba have both experienced lower-than-expected yield rates for their 3D NAND technologies resulting in fewer supplies for Apple's 2017 series of iPhones, according...

3D printing may sharply alter production mode, says HP executive

Jul 5, 11:18

Extensive application of 3D printing technologies is very likely to trigger a drastic change in the manufacturing sector in the foreseeable future, with customized production of personalized...

HP 3D printing

Tong Hsing starts shipments for 3D sensing products

Jun 30, 15:56

Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, started shipments for 3D sensing products in small...

Micron posts profit growth on record revenues in fiscal 3Q17

Jun 30, 14:30

Micron Technology has announced revenues for its third quarter of fiscal 2017 climbed to a record US$5.57 billion, 20% higher compared to the second quarter and 92% higher compared...

Talks to sell Toshiba Memory continue; announces new products

Jun 30, 11:01

Toshiba has disclosed the company continues to negotiate the sale of its memory chip business, Toshiba Memory, with Innovation Network of Japan, Bain Capital Private Equity and Development...

Digitimes Research: Japan government boosts development of high-precision 3D maps

Jun 29, 13:48

The Japan government, in line with the goal of realizing autonomous driving in Japan before the 2020 Tokyo Olympic Games, is promoting development and production of high-precision...

CMOS image sensor sales to reach another record high in 2017, says IC Insights

Jun 28, 22:22

CMOS image sensor sales are on pace to reach a seventh straight record high in 2017, and nothing ahead should stop this semiconductor product category from breaking more annual records...

Intel intros 64-layer, 3D NAND SSD

Jun 28, 14:24

Intel has announced the delivery of what the company claims is the world’s first commercially available 64-layer, TLC 3D NAND SSD.

Intel 64-layer, 3D NAND SSD

Samsung ramps up 64-layer V-NAND memory production

Jun 20, 15:54

Samsung Electronics has begun volume production of 64-layer, 256Gb V-NAND flash memory for use with an expanding line-up of storage solutions for server, PC and mobile applications,...

Global Unichip rolls out HBM2 total solution

Jun 19, 19:38

Global Unichip has successful taped out a 16nm, second-generation high bandwidth memory (HBM) PHY and controller with verified interposer design and CoWoS package. The ultra-high...

Toppan welcomes partnership with China firms

Jun 13, 15:22

Toppan Printing welcomes the potential for China-based companies to become partners, according to the Japan-based photomask vendor. Toppan is looking to work closely with China-based...

PTI optimistic about memory-dominated packaging

Jun 2, 10:30

The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...

Fifteen chipmakers to spend more than US$1 billion on capex, says IC Insights

Jun 2, 10:29

There are 15 companies forecast to have semiconductor capital expenditures of more than US$1 billion in 2017, up from 11 in 2016 and only eight in 2013, according to IC Insights.

3S teaming up with Marvell to develop 28nm controller chips

May 23, 22:40

Solid State System (3S) has announced it is teaming up with Marvell to develop DRAM-less SSD controller solutions.

TPK hikes 3D Touch price for iPhone with OLED, says paper

Newswatch - May 19, 11:43

Touch panel maker TPK Holdings has quoted US$18-22 for 3D Touch solution for use in a new iPhone equipped with OLED panel to be launched later in 2017 and Apple has accepted the quote,...

Sumco says new capacity to arrive in 2019

May 15, 21:59

Sumco expects its additional new capacity to come online in 2019 at the earliest, according to the Japan-based silicon wafer vendor, adding that it will enhance and optimize its existing...

Sumco lowering wafer shipments to XMC, say sources

May 11, 11:01

Sumco has reportedly cut its wafer shipments to Wuhan Xinxin Semiconductor Manufacturing (XMC), and given priority to Taiwan Semiconductor Manufacturing Company (TSMC), Intel and...

YMTC 64-layer 3D NAND technology ready for mass production in 2019, says acting chairman

May 8, 15:52

Yangtze River Storage Technology's (YMTC) 64-layer 3D NAND technology will be ready for mass production in 2019, according to Charles Kau, company acting chairman and executive VP...

Charles Kau, executive VP of Tsinghua Unigroup and acting chairman of YMTC

Semiconductor wafer-level manufacturing equipment revenues up 11% in 2016, says Gartner

May 3, 11:13

Worldwide semiconductor wafer-level manufacturing equipment (WFE) revenues totaled US$37.4 billion in 2016, an 11.3% increase from 2015, according to final results by Gartner. The...

ITRI unveils PBF 3D large-size printing platform

Apr 28, 15:44

The Laser and Additive Manufacturing Technology Center under the government-sponsored Industrial Technology Research Institute (ITRI) has unveiled an in-house-developed PBF(powder...

LMD 3D large-size printing platform developed by the Laser and Additive Manufacturing Technology Cen

Macronix developing 3D NAND technology for SSDs

Apr 28, 15:19

Macronix International has been engaged in the development of 3D NAND technology, and expects to enter volume production of chips built using the technology for SSDs in 2018, according...

Macronix chairman Miin Wu

Micron talks about its integrated global operations

Apr 26, 15:37

Micron Technology has been actively allocating its global resources to enhance its DRAM and NAND flash product lines, according to Wayne Allan, VP of global manufacturing at the US-based...

Wayne Allan, VP of global manufacturing at Micron

PTI looks to sequential revenue growth through 4Q17

Apr 26, 11:09

Packaging and testing company Powertech Technology (PTI) expects to post mid single-digit sequential growth in revenues for the second quarter of 2017, said company president JY Hung...

SK Hynix posts record revenues and profits for 1Q17

Apr 25, 11:46

SK Hynix has reported operating profits of KRW2.47 trillion (US$2.2 billion) on consolidated revenues of KRW6.29 trillion for the first quarter of 2017, with both results hitting...

Silicon wafer suppliers seeking long-term contracts

Apr 25, 11:18

Silicon wafer suppliers have advised their semiconductor customers to sign long-term contracts amid tight supply, according to industry sources.

Samsung completes qualification of 2nd-gen 10nm process technology

Apr 21, 13:57

Samsung Electronics has announced that its second-generation 10nm FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. With further enhancement...

PTI to enjoy robust demand for NAND flash

Apr 20, 10:25

Robust demand for NAND flash memory will boost revenues at packaging and testing company Powertech Technology (PTI) in the second half of 2017, according to industry sources.

3D NAND flash output set to expand in 2H17

Apr 18, 21:16

The global output of 3D NAND flash memory chips is set to expand substantially in the second half of 2017, and will exceed that of 2D NAND chips in the fourth quarter of the year,...

SK Hynix intros 72-layer 3D NAND flash

Apr 10, 15:00

SK Hynix has introduced 72-layer 256Gb 3D NAND flash memory chips based on its triple-level cell (TLC) arrays and own technologies.

Himax reportedly cuts into supply chain for iPhone

Mar 30, 21:09

Taiwan-based Himax Technologies will be among the component suppliers of Apple for its OLED iPhone that will feature a built-in 3D-sensing module to enable augmented reality (AR)...

Yangtze River Storage 3D NAND flash development on track

Mar 15, 09:54

Yangtze River Storage Technology's (YMTC) development of 3D NAND flash technology is well on track, and equipment for the production of 3D NAND chips will be installed at its fab...

YMTC CEO

Taiwan market: SolidWizard to distribute Markforged 3D printing products

Mar 8, 16:05

Taiwan-based SolidWizard Technology, a distributor of Solidworks' 3D CAD design software in the local market, has signed a contract to also distribute Markforged's 3D printing products...

SolidWizard president Hsu Tai-yuan

GIS, TPK preparing to make 3D touch panels for new iPhone

Mar 8, 15:27

Touch panel makers General Interface Solution (GIS) and TPK Holding have set aside capex budgets of NT$5.03 billion (US$163 million) and NT$4.7 billion respectively to set up capacity...

TSMC seeking stake in Toshiba chip business to expand into 3D NAND sector

Mar 1, 21:17

Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) is looking to expand into the 3D NAND sector through investing in Toshiba's memory business, according to industry...

China and Taiwan fabs gearing up for next-gen memory production

Feb 21, 10:51

China- and Taiwan-based pure-play foundries are partnering with their fabless clients to fabricate next-generation memory types, such as 3D NAND, MRAM and ReRAM, while memory chipmakers...

467 items [3/14]
Realtime news
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    Before Going to Press | 43min ago

  • Huxen opens demonstration center for smart office applications

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  • MRS sees AI becoming trend for many industries

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  • MediaTek and ITRI unveil new transmission technology

    Before Going to Press | 1h 2min ago

  • Colorful expects rising revenues in 2017

    Before Going to Press | 1h 18min ago

  • Taiwan MLCC suppliers take conservative approach to handle shortages

    Before Going to Press | 1h 18min ago

  • Taiwan LCD packaging and testing houses eye business opportunities from China

    Before Going to Press | 1h 19min ago

  • Greatek expected to see rising orders in 1Q18

    Before Going to Press | 1h 19min ago

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  • Samsung+1Tb+V%2DNAND

    Samsung 1Tb V-NAND

    Samsung has announced a 1Tb V-NAND chip that it expects to be available next year. Since first mentioning it in 2013, during unveiling of the industry's first 3D NAND, Samsung has...

    Photo: Company, Aug 11.

  • Samsung+256GB+UFS+card

    Samsung 256GB UFS card

    Samsung Electronics has unveiled removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard for use in high-resolution mobile shooting devices...

    Photo: Company, Jul 13.

  • Apple+iPhone+6s+and+iPhone+6s+Plus

    Apple iPhone 6s and iPhone 6s Plus

    Apple has announced the iPhone 6s and iPhone 6s Plus, the latest iPhone models from the company. The new iPhones introduce 3D Touch, which senses force to access features and interact...

    Photo: Company, Sep 11.

  • Samsung+V%2DNAND+SSDs

    Samsung V-NAND SSDs

    Samsung Electronics has announced that it is adding three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its portfolio of...

    Photo: Company, Aug 27.

  • Intel+fifth%2Dgeneration+Core+%28Broadwell%2DH%29+processors

    Intel fifth-generation Core (Broadwell-H) processors

    The fifth-generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris Pro graphics, Intel's most powerful client processor graphics...

    Photo: Company, Jun 4.

UMC
Global AP demand forecast, 2017-2020

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.