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News tagged 3D
  • Last update: Thursday 18 December 2014 [316 news items]

Austrian chipmaker ams to set up 3D IC production line

Sep 5, 10:50

Austria-based ams, a provider of high performance analog ICs and sensor solutions, has announced plans to invest over EUR25 million (US$33 million) to install 3D IC production capacity...

NAND flash vendors gearing up for 3D chips

Aug 27, 13:45

Samsung Electronics, Toshiba and Micron Technology have recently disclosed their 3D NAND flash memory developments. The vendors' 3D NAND chips are expected to be in early-stage production...

Kinpo-Compal releases 3D printer

Aug 26, 21:12

Kinpo-Compal Group has recently established a subsidiary to push own-brand consumer 3D printers and announced its first model under the brand name XYZprinting priced only less than...

Taiwan market: Kinpo to launch own-brand 3D printers

Aug 22, 22:12

Taiwan-based Kinpo Electronics plans to launch own-brand 3D printers, targeting the entry-level and mid-range segment initially, according to company chairman Rock Hsu.

Samsung intros 3D V-NAND SSD for enterprise applications

Aug 16, 15:49

Samsung Electronics has introduced a solid state drive (SSD) based on its 3D V-NAND technology. The new SSD, unveiled during a keynote at the Flash Memory Summit 2013 in California,...

Samsung unveils first 3D V-NAND SSD

Young Optics to begin shipping prototype 3D printers in 2H13

Aug 12, 14:00

Optical module maker Young Optics has been cooperating with potential clients to develop 3D printers for use in designing jewels and dentures, and will begin to ship prototypes in...

Samsung starts mass producing 3D vertical NAND flash

Aug 6, 21:35

Samsung Electronics has begun mass producing 3D vertical NAND (V-NAND) flash memory chips, designed for a wide range of consumer electronics and enterprise applications such as embedded...

Samsung 3D V-NAND

Kinpo, Cal-Comp working on landing orders for 3D printers, says paper

Newswatch - Jul 23, 15:20

Taiwan-based Kinpo Electronics and Cal-Comp are together trying to land component or manufacturing orders from 3D printer makers such as 3D Systems and Stratasys, according to a Chinese-language...

Taiwan market: Epson to launch 3D home theater projector

Jul 10, 14:54

Seiko Epson on July 10 unveiled the Epson EH-TW550, a 3D home theater projector featuring a brightness of 3,000lm in both white and color, contrast of 5000:1 and support for Blu-ray...

LED lighting, 3D printing to light up Photonics Festival Taiwan 2013

Jun 14, 10:31

The Photonics Festival in Taiwan will be held at Nangang Exhibition Hall in Taipei from June 18-20. The exhibition features 649 firms and 1,502 booths. Bio-medical optics technology,...

SolidWizard Technology scores points in marketing 3D printers for 3D Systems

Jun 4, 21:24

SolidWizard Technology, a Taiwan-based provider of value-added complete system integration and consultation services for software products developed by US-based Dassault Systems SolidWorks,...

Etron to begin shipping 3D image sensors in July

May 30, 14:23

IC design house Etron Technology has announced the development of a single-chip 3D image sensor, the eSP870, which will be shipped to a China-based TV maker starting July.

Can Ultra HD TVs avoid the fate of 3D sets? asks IHS

May 22, 15:30

TV industry participants gathering at the Society for Information Display (SID) 2013 Display Week event are showcasing the product they hope will rejuvenate the market: the Ultra...

GTOC sees increased performance in 1Q13 due to 3D molded glass sales

May 16, 15:08

Glass substrate processing service provider G-Tech Optoelectronics (GTOC), a subsidiary of Hon Hai Precision Industry (Foxconn Electronics), saw its revenues increase 8% on quarter...

Early 3D printing adopters could gain innovation advantage over rivals, says Gartner

Apr 19, 10:41

3D printing is disrupting the design, prototyping and manufacturing processes in a wide range of industries, according to Gartner. Enterprises should start experimenting with 3D printing...

Globalfoundries demos 3D TSV capabilities on 20nm

Apr 3, 10:07

Globalfoundries on April 2 announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At...

BenQ to release Full HD 3D projectors in 2013

Mar 29, 15:14

BenQ will release Full HD 3D short focal projectors in 2013 and aims to sell them within commercial, education and entertainment segments, according to general manager of BenQ's Technology...

Demand for 3D optical film rises as passive 3D TV competes with shutter glass, says DisplaySearch

Mar 28, 12:04

As 3D TV continues to grow, competition between two main 3D technologies is heating up, and film patterned retarder is finally catching up to the more established shutter glass approach...

Imagination, TSMC extend collaboration to FinFET and 3D ICs

Mar 26, 10:27

Imagination Technologies and contract chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) have announced the next phase of their technology collaboration.

GTOC February 2013 performance down; may expand 3D molded glass production

Mar 18, 16:16

Optical glass processing services provider G-Tech Optoelectronics (GTOC), an affiliate of the Foxconn (Hon Hai Precision Industry) Group, saw its revenues drop 33.7% on month to NT$880...

US consumers gain interest in TVs featuring 3D display and Internet connectivity, says IHS

Mar 7, 13:39

For years, US consumers have had three simple criteria when buying a TV: price, size and picture quality, according to research firm IHS. While those factors remain, American television...

Asustek to add in-house 3D motion sensing technology into Haswell products

Feb 6, 22:18

Asustek Computer plans to add its in-house developed 3D motion sensing technology into its upcoming high-end Haswell-based PC products including all-in-one PCs and notebooks.

Scientech deepens development of 3D IC, wafer-level packaging equipment

Jan 31, 16:04

Taiwan-based semiconductor equipment distributor Scientech has deepened its development of 3D IC packaging and wafer-level packaging equipment, expecting some of its equipment to...

STATS ChipPAC, UMC unveil 3D IC developed under open ecosystem model

Jan 29, 22:11

STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem...

Hisense unveils new Ultra HD 3D Smart TV

Nov 13, 22:25

Hisense USA has unveiled its XT880 3D Smart TV, featuring Ultra HD (3840 by 2160) resolution. The unit combines an ARM dual-core microprocessor with the latest Android Ice Cream Sandwich...

TV to drive global demand for 3D-ready devices, says DisplaySearch

Sep 28, 10:21

The 3D display market is set to grow from 50.8 million units and US$13.2 billion in revenue in 2011 to 226 million units and US$67 billion in revenue in 2019 worldwide, according...

Panel makers speed up glasses free 3D 4Kx2K panel production

Sep 19, 01:10

Japan-, China- and Taiwan-based panel makers are reportedly speeding up production of glasses-free 3D 4Kx2K panels in order to compete better with Korea-based AMOLED panel makers,...

VIA announces first Pico-ITX motherboard with 3D display capabilities

Sep 10, 14:34

VIA Technologies has announced the EPIA-P910 Pico-ITX motherboard, the first VIA motherboard to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-series processor...

Taiwan-based panel makers are still the main providers of TV panels for China-based TV vendors

Sep 7, 01:00

Taiwan-based panel makers are still maintaining their positions as the main TV panel providers for China-based TV vendors. This is because of the panel makers' increased cooperation...

3D IC commercialization to take place in 2015-16, says ASE

Sep 6, 09:33

The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief...

Tong Ho-ming, general manager and chief of R&D at ASE

Industry migration to 3D ICs to take place in 2015-16

Sep 5, 01:05

The industry's gradual migration toward 3D ICs with through-silicon vias (TSV) is unlikely to happen until 2015 or 2016, according to sources at semiconductor companies. Volume production...

AUO to mass produce various sized 3D 4Kx2K TV panels by early 2013

Sep 4, 14:59

AU Optronics (AUO) will most likely mass produce 42- to 55-inch along with 65-inch 3D 4Kx2K TV panels by the beginning of 2013, according to industry sources.

STATS ChipPAC advances TSV capabilities with qualification of mid-end manufacturing

Aug 29, 16:49

STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition...

3D TVs may reach 20 million in sales in China

Jul 24, 01:15

China TV makers predict that as many 20 million 3D TVs will be sold in China this year due to growing TV demand amid increased promotion of the TVs during this year's Summer Olympics,...

Nanya Technology unveils 8Gb QDP DDR3 based on TSV 3D IC technology

Jul 19, 01:20

Nanya Technology debuted prototype 8Gb QDP (quad-die package) DDR3 based on in-house-developed via-middle TSV (through silicon via) 3D IC technology at a July 18 investors conferen...

316 items [2/10]
Realtime news
  • Computex 2015 out of booths

    IT + CE | 2h 49min ago

  • Taiwan attracts foreign direct investment of over US$4.4 billion in January-November, says MOEA

    Bits + chips | 2h 51min ago

  • Taiwan November export order value down sequentially, up on year, says MOEA

    Bits + chips | 2h 53min ago

  • Panasonic said to shut down last PCB factory

    Bits + chips | 3h ago

  • HLMC said to invest NT$100 billion to build new fab

    Bits + chips | 3h 11min ago

  • Taiwan November export order value down sequentially, up on year, says MOEA

    Before Going to Press | 3h 24min ago

  • Sugon unveils new China-developed cloud computing operating system

    Before Going to Press | 3h 24min ago

  • Lof Solar sues Sunshine PV for patent infringement

    Before Going to Press | 3h 24min ago

  • Mitsui Chemical and SKC to merge polyurethane material businesses

    Before Going to Press | 3h 25min ago

  • Digitimes Research: China OGS touch panel makers hiking GFF capacity

    Before Going to Press | 3h 26min ago

  • Panasonic said to shut down last PCB factory

    Before Going to Press | 3h 27min ago

  • Taiwan attracts foreign direct investment of over US$4.4 billion in January-November, says MOEA

    Before Going to Press | 3h 28min ago

  • China market: LeTV aims to ship 3.0-4.0 million own-brand LCD TVs in 2015

    Before Going to Press | 3h 28min ago

  • China government tightens tax-cut, subsidy offerings to enterprises

    Before Going to Press | 3h 29min ago

  • Server PCB specialist Allied Circuit positive about 2015

    Before Going to Press | 3h 31min ago

  • UTAC to set up 12-inch wafer level packaging line in Taiwan

    Before Going to Press | 3h 31min ago

  • G-Tech to expand 3D-forming glass capacity

    Before Going to Press | 3h 33min ago

  • MediaTek shipments for 4G smartphones to exceed 30 million units in 2014, says report

    Before Going to Press | 3h 36min ago

  • Xiaomi may adopt sapphire for covers of 5.7-inch smartphone

    Before Going to Press | 3h 36min ago

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  • Samsung+850+EVO

    Samsung 850 EVO

    Samsung Electronics has launched the 850 EVO, the latest addition to its branded solid state drive (SSD) line-up. Based on Samsung's 3-bit 3D Vertical NAND (V-NAND) technology, the...

    Photo: Company, Dec 16.

  • VIA+ARTiGO+A900+Android+system

    VIA ARTiGO A900 Android system

    VIA Technologies has launched the VIA ARTiGO A900 Android system. With its 3D graphics and HD video performance, I/O connectivity options, and software development tools, the VIA...

    Photo: Company, Sep 24.

  • Samsung+3D+V%2DNAND+SSD

    Samsung 3D V-NAND SSD

    Samsung Electronics has introduced a solid state drive (SSD) based on its 3D V-NAND technology. The new SSD, unveiled during a keynote at the Flash Memory Summit 2013 in California,...

    Photo: Company, Aug 19.

  • Samsung+30nm+2GB+LPDDR3+mobile+memory

    Samsung 30nm 2GB LPDDR3 mobile memory

    Samsung Electronics has begun mass producing 2GB and low power double-data-rate 3 (LPDDR3) memory using 30nm-class technology for next-generation mobile devices. The new LPDDR3,...

    Photo: Company, Sep 21.

  • VIA+EPIA%2DP910+Pico%2DITX+motherboard

    VIA EPIA-P910 Pico-ITX motherboard

    VIA Technologies has announced the EPIA-P910 Pico-ITX motherboard, the first VIA motherboard to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-series processor...

    Photo: Company, Sep 11.

Wireless broadband developments in Southeast Asia markets
DIGITIMES Marketing Services

22-Dec-2014 markets closed

 LastChange

TAIEX (TSE)8999.52+120.89+1.36% 

TSE electronic358.2+5.73+1.63% 

GTSM (OTC)134.27-1.41-1.04% 

OTC electronic170.33-1.64-0.95% 

DIGITIMES Translation Services
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • Greater China touch panel shipment forecast through 2015

    This Special Report provides forecasts through 2015 for Greater China touch panel shipments with breakdowns based on technology (glass, film, resistive), application (smartphone, NB and tablet) and by firm.

  • 2014 global tablet demand forecast

    This report analyzes the main players, their strategies and shipments forecasts for 2014, as well as other factors contributing to either growth or decline in various segments within the tablet market, with a particular focus on Apple, Google, Samsung, and Microsoft, along with whitebox vendors.