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News tagged 3D
  • Last update: Thursday 10 July 2014 [305 news items]

Etron to begin shipping 3D image sensors in July

May 30, 14:23

IC design house Etron Technology has announced the development of a single-chip 3D image sensor, the eSP870, which will be shipped to a China-based TV maker starting July.

Can Ultra HD TVs avoid the fate of 3D sets? asks IHS

May 22, 15:30

TV industry participants gathering at the Society for Information Display (SID) 2013 Display Week event are showcasing the product they hope will rejuvenate the market: the Ultra...

GTOC sees increased performance in 1Q13 due to 3D molded glass sales

May 16, 15:08

Glass substrate processing service provider G-Tech Optoelectronics (GTOC), a subsidiary of Hon Hai Precision Industry (Foxconn Electronics), saw its revenues increase 8% on quarter...

Early 3D printing adopters could gain innovation advantage over rivals, says Gartner

Apr 19, 10:41

3D printing is disrupting the design, prototyping and manufacturing processes in a wide range of industries, according to Gartner. Enterprises should start experimenting with 3D printing...

Globalfoundries demos 3D TSV capabilities on 20nm

Apr 3, 10:07

Globalfoundries on April 2 announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At...

BenQ to release Full HD 3D projectors in 2013

Mar 29, 15:14

BenQ will release Full HD 3D short focal projectors in 2013 and aims to sell them within commercial, education and entertainment segments, according to general manager of BenQ's Technology...

Demand for 3D optical film rises as passive 3D TV competes with shutter glass, says DisplaySearch

Mar 28, 12:04

As 3D TV continues to grow, competition between two main 3D technologies is heating up, and film patterned retarder is finally catching up to the more established shutter glass approach...

Imagination, TSMC extend collaboration to FinFET and 3D ICs

Mar 26, 10:27

Imagination Technologies and contract chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) have announced the next phase of their technology collaboration.

GTOC February 2013 performance down; may expand 3D molded glass production

Mar 18, 16:16

Optical glass processing services provider G-Tech Optoelectronics (GTOC), an affiliate of the Foxconn (Hon Hai Precision Industry) Group, saw its revenues drop 33.7% on month to NT$880...

US consumers gain interest in TVs featuring 3D display and Internet connectivity, says IHS

Mar 7, 13:39

For years, US consumers have had three simple criteria when buying a TV: price, size and picture quality, according to research firm IHS. While those factors remain, American television...

Asustek to add in-house 3D motion sensing technology into Haswell products

Feb 6, 22:18

Asustek Computer plans to add its in-house developed 3D motion sensing technology into its upcoming high-end Haswell-based PC products including all-in-one PCs and notebooks.

Scientech deepens development of 3D IC, wafer-level packaging equipment

Jan 31, 16:04

Taiwan-based semiconductor equipment distributor Scientech has deepened its development of 3D IC packaging and wafer-level packaging equipment, expecting some of its equipment to...

STATS ChipPAC, UMC unveil 3D IC developed under open ecosystem model

Jan 29, 22:11

STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem...

Hisense unveils new Ultra HD 3D Smart TV

Nov 13, 22:25

Hisense USA has unveiled its XT880 3D Smart TV, featuring Ultra HD (3840 by 2160) resolution. The unit combines an ARM dual-core microprocessor with the latest Android Ice Cream Sandwich...

TV to drive global demand for 3D-ready devices, says DisplaySearch

Sep 28, 10:21

The 3D display market is set to grow from 50.8 million units and US$13.2 billion in revenue in 2011 to 226 million units and US$67 billion in revenue in 2019 worldwide, according...

Panel makers speed up glasses free 3D 4Kx2K panel production

Sep 19, 01:10

Japan-, China- and Taiwan-based panel makers are reportedly speeding up production of glasses-free 3D 4Kx2K panels in order to compete better with Korea-based AMOLED panel makers,...

VIA announces first Pico-ITX motherboard with 3D display capabilities

Sep 10, 14:34

VIA Technologies has announced the EPIA-P910 Pico-ITX motherboard, the first VIA motherboard to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-series processor...

Taiwan-based panel makers are still the main providers of TV panels for China-based TV vendors

Sep 7, 01:00

Taiwan-based panel makers are still maintaining their positions as the main TV panel providers for China-based TV vendors. This is because of the panel makers' increased cooperation...

3D IC commercialization to take place in 2015-16, says ASE

Sep 6, 09:33

The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief...

Tong Ho-ming, general manager and chief of R&D at ASE

Industry migration to 3D ICs to take place in 2015-16

Sep 5, 01:05

The industry's gradual migration toward 3D ICs with through-silicon vias (TSV) is unlikely to happen until 2015 or 2016, according to sources at semiconductor companies. Volume production...

AUO to mass produce various sized 3D 4Kx2K TV panels by early 2013

Sep 4, 14:59

AU Optronics (AUO) will most likely mass produce 42- to 55-inch along with 65-inch 3D 4Kx2K TV panels by the beginning of 2013, according to industry sources.

STATS ChipPAC advances TSV capabilities with qualification of mid-end manufacturing

Aug 29, 16:49

STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition...

3D TVs may reach 20 million in sales in China

Jul 24, 01:15

China TV makers predict that as many 20 million 3D TVs will be sold in China this year due to growing TV demand amid increased promotion of the TVs during this year's Summer Olympics,...

Nanya Technology unveils 8Gb QDP DDR3 based on TSV 3D IC technology

Jul 19, 01:20

Nanya Technology debuted prototype 8Gb QDP (quad-die package) DDR3 based on in-house-developed via-middle TSV (through silicon via) 3D IC technology at a July 18 investors conferen...

Taiwan market: Sony launches 3D Blu-ray Disc home theater systems

Jul 12, 12:18

Sony has unveiled four models of its 3D Blu-ray Disc (BD) home theater system, BDV-N990W, BDV-N890W, BDV-E490 and BDV-E290, for immediate launch in the Taiwan market at recommended...

Sony 3D BD home theater system BDV-N990W

Third-generation ultrabooks to features 3D, sensors and HD quality interfaces

Jul 9, 12:42

Intel is expected to provide design suggestions for upcoming third-generation Haswell-based ultrabooks that are aiming for release in the second quarter of 2013, with suggestions...

Third-generation ultrabooks to feature more new designs

3D IC to bring business opportunities for Taiwan semiconductor equipment makers

Jun 20, 01:05

3D IC is expected to afford business opportunities for Taiwan-based makers of semiconductor production equipment because processes and corresponding equipment for 3D ICs have not...

Chairman Hsu Chin-jung for Taiwan-based Hermes Microvision

AUO to begin volume production of naked-eye 3D panels in 2H12

Apr 27, 01:35

AU Optronics (AUO) plans to begin rolling out naked-eye 3D panels in the second half of 2012 and expects its shipments of 65-inch TV panels to reach 700,000 units for the year, according...

3D TV growth momentum to slip in 2012, say sources

Apr 23, 16:06

Although the global market for 3D TVs is expected to continue to expand in 2012, the growth momentum will slow down in the year as most top-tier brand vendors are shifting more focus...

Altera, TSMC develop 3D IC test vehicle

Mar 23, 01:05

Altera and TSMC have announced the joint development of what they claim is the world's first heterogeneous 3D IC test vehicle using TSMC's chip-on-wafer-on-substrate (CoWoS) integration...

Shipments of 3D LCD TV panels reach 21 million units in 2011, says DisplaySearch

Mar 8, 15:23

Shipments of 3D LCD TV panels spiked to 7.8 million units in fourth-quarter 2011, up by 26% on quarter. As a result, total 3D TV panel shipments in 2011 reached 21.2 million, accounting...

STATS ChipPAC intros new 3D eWLB PoP solutions

Mar 7, 11:35

STATS ChipPAC, a semiconductor test and advanced packaging service provider, has announced its next-generation three dimensional (3D) embedded wafer-level ball grid array (eWLB) package-on-package...

China market: Korea, Japan vendors to launch entry-level 3D TVs

Feb 29, 16:28

Branded TV vendors including Samsung Electronics, Sharp and Sony reportedly plan to launch entry-level 3D-enabled TVs in the China market in March-April to cash in on the buying spree...

AUO lands 65-inch naked-eye 3D TV panels from LG and Vizio, says paper

Newswatch - Feb 23, 15:12

AU Optronics (AUO) has landed orders for 65-inch naked-eye full HD 3D TV panels from LG Electronics and Vizio, with combined shipments to the two companies to reach 100,000 units,...

Penetration rates of 3D and LED TVs continue to rise in January

Feb 8, 15:03

Recently published market research indicates that in January 2012, among all TV models marketed, 40% supported 3D and 70% of models were LED TVs.

3D TVs
305 items [2/9]
  • Samsung+3D+V%2DNAND+SSD

    Samsung 3D V-NAND SSD

    Samsung Electronics has introduced a solid state drive (SSD) based on its 3D V-NAND technology. The new SSD, unveiled during a keynote at the Flash Memory Summit 2013 in California,...

    Photo: Company, Aug 19.

  • Samsung+30nm+2GB+LPDDR3+mobile+memory

    Samsung 30nm 2GB LPDDR3 mobile memory

    Samsung Electronics has begun mass producing 2GB and low power double-data-rate 3 (LPDDR3) memory using 30nm-class technology for next-generation mobile devices. The new LPDDR3,...

    Photo: Company, Sep 21.

  • VIA+EPIA%2DP910+Pico%2DITX+motherboard

    VIA EPIA-P910 Pico-ITX motherboard

    VIA Technologies has announced the EPIA-P910 Pico-ITX motherboard, the first VIA motherboard to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-series processor...

    Photo: Company, Sep 11.

  • Nvidia+Quadro+K5000+graphics+card

    Nvidia Quadro K5000 graphics card

    Based on Nvidia Kepler architecture, the Nvidia's Quadro K5000 for Mac is a professional-class GPU for the Macintosh, delivering visualization and computation capabilities for designers...

    Photo: Company, Sep 11.

  • Computex+2012%3A+Nvidia+GeForce+GTX+680M+mobile+graphics+card

    Computex 2012: Nvidia GeForce GTX 680M mobile graphics card

    Nvidia brings its next-generation Kepler graphics architecture to the top of the GeForce notebook GPU lineup, with the launch of the Nvidia GeForce GTX 680M. GeForce 600M Series...

    Photo: Company, Jun 6.

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