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News tagged 3D
  • Last update: Friday 17 November 2017 [453 news items]

Lextar to ship IR LED devices for 3D facial recognition

Sep 6, 15:23

Vertically-integrated LED firm Lextar Electronics has revealed it has cooperated with clients to develop infrared (IR) LED devices for 3D facial recognition, with such devices being...

lextar

Most of 2017 capital spending will go to foundry and flash memory, says IC Insights

Sep 1, 11:28

Following a substantial increase in semiconductor capital expenditures during the first half of 2017, IC Insights raised its annual semiconductor capex forecast to a record high of...

Qualcomm, Himax jointly develop 3D depth sensing solution

Aug 30, 19:04

Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...

Samsung seeking long-term supply contracts with wafer firms

Aug 30, 13:34

Samsung Electronics is striving to sign long-term supply contracts with multiple wafer makers to ensure sufficient silicon wafer supplies for the manufacture of memory chips and logic...

A new Samsung fab in Pyeongtaek to focus on 64-layer 3D NAND flash production

GigaDevice draws investment from China state-backed fund

Aug 30, 13:25

China-based GigaDevice Semiconductor has obtained investment from China's National IC Industry Investment Fund, commonly known as the Big Fund, according to the maker of flash memory...

Samsung to expand NAND chip capacity in China

Aug 29, 13:57

Samsung Electronics has disclosed plans to expand production capacity at its NAND flash memory wafer fab in Xian, northwest China for a total of US$7 billion over the next three ye...

Chipbond, ChipMOS see rising orders for TDDI chips

Aug 25, 12:19

Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...

Xintec loss widens in 1H17

Aug 25, 11:34

Image sensor packaging specialist Xintec saw its losses widen to NT$609 million (US$20 million) in the first half of 2017, with EPS reaching negative NT$2.25.

China to phase in 14nm semiconductor process in 2018, says top tech master

Aug 22, 15:47

China is proceeding with systematic deployments in 14nm semiconductor fabrication equipment, process, packaging and materials, which will be fully industrialized in 2018. And the...

Ye Tianchun, director of Institute of Microelectronics, Chinese Academy of Science

Qualcomm developing 3D depth sensing technology

Aug 22, 11:14

Qualcomm is partnering with its ecosystem partners to develop 3D depth sensing technology, which will be applied to Andriod smartphones powered the Snapdragon mobile chips, according...

Qualcomm is developing 3D depth sensing technology

Global 2Q17 NAND flash market posts 8% growth, says DRAMeXchange

Aug 22, 10:51

The worldwide NAND flash memory market posted revenues of US$13.22 billion in the second quarter of 2017, up 8% sequentially, according to DRAMeXchange.

ChipMOS to enter production for 3D sensing components in 3Q17, says report

Aug 14, 12:20

Backend house ChipMOS Technologies will enter production for 3D sensing components for new consumer electronics devices in the third quarter of 2017, according to a report by Taiwan's...

ChipMOS obtains backend orders from Novatek

Aug 10, 11:46

ChipMOS Technologies has obtained backend orders for touch display driver ICs (TDDI) from Novatek Microelectronics, with shipments set to kick off in the fourth quarter of 2017, according...

ChipMOS gearing up for robust demand for TDDI chips

Samsung announces 1Tb V-NAND memory

Aug 10, 11:41

Samsung Electronics has announced a 1Tb vertical NAND (V-NAND) memory chip. The arrival of the chip in 2018 will enable 2TB of memory in a single V-NAND package by stacking 16 1Tb...

Samsung 1Tb V-NAND

Himax to start producing 3D sensing solutions as early as 2018

Aug 8, 10:34

Himax Technologies has expressed optimism about the growth prospects for its non-driver IC business, most notably with its structure light integrated solution for 3D sensing and wafer-level...

Himax enhancing its product mix for profit improvement

Worldwide semiconductor capital spending to grow 10.2% in 2017, says Gartner

Aug 4, 14:22

Worldwide semiconductor capital spending is projected to increase 10.2% to US$77.7 billion in 2017, according to Gartner. This growth rate is up from Gartner's previous forecast of...

TSMC, UMC offer higher prices to secure wafer supplies

Jul 27, 15:09

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have recently secured 1-2 year supply contracts with Shin-Etsu and Sumco and offered higher prices...

SK Hynix delivers another quarter of record results

Jul 25, 13:19

SK Hynix saw its revenues, operating profits and net profits reach record-high levels for the second consecutive quarter in the second quarter of 2017.

NOR flash supply to remain tight in 2018, says Macronix president

Jul 24, 21:56

Supply of NOR flash memory is expected to remain tight in 2018, as demand will continue to outpace supply, according to Macronix International president CY Lu.

Macronix president CY Lu

Toshiba develops 3D flash memory with TSV technology

Jul 14, 15:48

Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC)...

Toshiba 3D NAND flash with TSV

Brewer Science, Arkema partner to develop high-chi DSA materials for advanced node patterning

Jul 12, 22:35

Brewer Science has announced the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copo...

Supply of NAND flash for new iPhone falling short

Jul 5, 22:17

SK Hynix and Toshiba have both experienced lower-than-expected yield rates for their 3D NAND technologies resulting in fewer supplies for Apple's 2017 series of iPhones, according...

3D printing may sharply alter production mode, says HP executive

Jul 5, 11:18

Extensive application of 3D printing technologies is very likely to trigger a drastic change in the manufacturing sector in the foreseeable future, with customized production of personalized...

HP 3D printing

Tong Hsing starts shipments for 3D sensing products

Jun 30, 15:56

Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, started shipments for 3D sensing products in small...

Micron posts profit growth on record revenues in fiscal 3Q17

Jun 30, 14:30

Micron Technology has announced revenues for its third quarter of fiscal 2017 climbed to a record US$5.57 billion, 20% higher compared to the second quarter and 92% higher compared...

Talks to sell Toshiba Memory continue; announces new products

Jun 30, 11:01

Toshiba has disclosed the company continues to negotiate the sale of its memory chip business, Toshiba Memory, with Innovation Network of Japan, Bain Capital Private Equity and Development...

Digitimes Research: Japan government boosts development of high-precision 3D maps

Jun 29, 13:48

The Japan government, in line with the goal of realizing autonomous driving in Japan before the 2020 Tokyo Olympic Games, is promoting development and production of high-precision...

CMOS image sensor sales to reach another record high in 2017, says IC Insights

Jun 28, 22:22

CMOS image sensor sales are on pace to reach a seventh straight record high in 2017, and nothing ahead should stop this semiconductor product category from breaking more annual records...

Intel intros 64-layer, 3D NAND SSD

Jun 28, 14:24

Intel has announced the delivery of what the company claims is the world’s first commercially available 64-layer, TLC 3D NAND SSD.

Intel 64-layer, 3D NAND SSD

Samsung ramps up 64-layer V-NAND memory production

Jun 20, 15:54

Samsung Electronics has begun volume production of 64-layer, 256Gb V-NAND flash memory for use with an expanding line-up of storage solutions for server, PC and mobile applications,...

Global Unichip rolls out HBM2 total solution

Jun 19, 19:38

Global Unichip has successful taped out a 16nm, second-generation high bandwidth memory (HBM) PHY and controller with verified interposer design and CoWoS package. The ultra-high...

Toppan welcomes partnership with China firms

Jun 13, 15:22

Toppan Printing welcomes the potential for China-based companies to become partners, according to the Japan-based photomask vendor. Toppan is looking to work closely with China-based...

PTI optimistic about memory-dominated packaging

Jun 2, 10:30

The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...

Fifteen chipmakers to spend more than US$1 billion on capex, says IC Insights

Jun 2, 10:29

There are 15 companies forecast to have semiconductor capital expenditures of more than US$1 billion in 2017, up from 11 in 2016 and only eight in 2013, according to IC Insights.

3S teaming up with Marvell to develop 28nm controller chips

May 23, 22:40

Solid State System (3S) has announced it is teaming up with Marvell to develop DRAM-less SSD controller solutions.

453 items [2/13]
  • Samsung+1Tb+V%2DNAND

    Samsung 1Tb V-NAND

    Samsung has announced a 1Tb V-NAND chip that it expects to be available next year. Since first mentioning it in 2013, during unveiling of the industry's first 3D NAND, Samsung has...

    Photo: Company, Aug 11.

  • Samsung+256GB+UFS+card

    Samsung 256GB UFS card

    Samsung Electronics has unveiled removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard for use in high-resolution mobile shooting devices...

    Photo: Company, Jul 13.

  • Apple+iPhone+6s+and+iPhone+6s+Plus

    Apple iPhone 6s and iPhone 6s Plus

    Apple has announced the iPhone 6s and iPhone 6s Plus, the latest iPhone models from the company. The new iPhones introduce 3D Touch, which senses force to access features and interact...

    Photo: Company, Sep 11.

  • Samsung+V%2DNAND+SSDs

    Samsung V-NAND SSDs

    Samsung Electronics has announced that it is adding three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its portfolio of...

    Photo: Company, Aug 27.

  • Intel+fifth%2Dgeneration+Core+%28Broadwell%2DH%29+processors

    Intel fifth-generation Core (Broadwell-H) processors

    The fifth-generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris Pro graphics, Intel's most powerful client processor graphics...

    Photo: Company, Jun 4.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

17-Nov-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.