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News tagged 22nm
  • Last update: Friday 11 August 2017 [55 news items]

ASML upbeat on micro-lithography growth

Oct 12, 15:47

Customers have turned more active in placing orders, according to Antonio Mesquida Kusters, Director of Market Intelligence for ASML. Citing predictions by research firms, Kusters...

Antonio Mesquida Küsters, Director of Market Intelligence for ASML

IMEC, TSMC team up for miniaturized designs

Oct 7, 10:48

IMEC, a Belgium-based research center in nanoelectronics and nanotechnology, and Taiwan Semiconductor Manufacturing Company (TSMC) on October 6 jointly announced the extension of...

Cross-section view of IMEC integrated micro-mirror array

TSMC maintains 18-inch wafer tape-out in 2012

Oct 2, 12:30

Taiwan Semiconductor Manufacturing Company (TSMC) will maintain its plans to begin trial production on 18-inch wafers in 2012 despite a conservative outlook prevailing across most...

UMC focusing R&D on 28nm, 22nm processes

Sep 30, 14:23

United Microelectronics Corporation (UMC) currently focuses its R&D on 28nm and 22nm processes and related key technologies as well as 18-inch wafers, according to company central...

IDF San Francisco: Moore's Law marches on at Intel

Sep 23, 17:08

Intel president and CEO Paul Otellini has displayed a silicon wafer containing its first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory...

KLA-Tencor extends reticle inspection systems to 2Xnm

Sep 15, 14:04

KLA-Tencor has introduced the Teron 600-series reticle defect inspection system to address a major transition in mask design at the 2Xnm logic (3Xnm half-pitch memory) node. The new...

KLA-Tencor keeping up R&D spending despite difficult times

Sep 2, 16:49

R&D expenses are estimated to equal 25% of KLA-Tencor's overall sales in 2009, with the expenditure mainly on the development of next-generation products for 3X/2Xnm and beyond...

KLA Tencor CMO Brian Trafas

Globalfoundries calls for renewed focus on 300mm

Jul 14, 15:20

The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology....

TSMC joins CEA-Leti program on multiple e-beam lithography

Jul 6, 17:03

Taiwan Semiconductor Manufacturing Company (TSMC) has announced it will join a three-year program led by the CEA-Leti research institute on electron-beam (e-beam) maskless lithography...

TSMC to base European R&D at IMEC

Jun 4, 15:05

IMEC, an Belgium-based nanoelectronics research center in nanoelectronics and nanotechnology, has signed an expanded research agreement with Taiwan Semiconductor Manufacturing Company...

TSMC sees delay in e-beam equipment delivery

May 18, 12:08

Taiwan Semiconductor Manufacturing Company (TSMC) has seen a delay in the delivery of 300mm multiple electron-beam (e-beam) maskless lithography equipment from Mapper Lithography...

TSMC beefs up R&D, moving to 22nm by 2011

Apr 23, 11:06

Taiwan Semiconductor Manufacturing Company (TSMC) has said it is on track to increase manpower within its R&D and design service units by 30% and 15%, respectively, while proceeding...

Globalfoundries already finding potential customers in Japan and Taiwan: Q&A with CEO Doug Grose

Mar 25, 17:05

Globalfoundries, the spin-off of AMD's former manufacturing operations, is working to build its customer base in Taiwan and Japan, according to company CEO Doug Grose. Grose, who...

Globalfoundries CEO Doug Grose

Semiconductor lithography sector continues to outperform rest of market, says The Information Network

Mar 23, 11:40

High-priced equipment enabled the semiconductor lithography sector to grow to 25% of entire front-end equipment processing market in 2008, according to market research firm The Information...

ASML to start shipping EUV systems for sub 22nm node by 2010

Dec 25, 16:39

Shipments of semiconductor equipment supplier ASM Lithography's (ASML's) extreme ultraviolet (EUV) systems for 22nm and sub-22nm process nodes are expected to kick off by 2010, according...

KW Cheng, the strategic sales and marketing vice president of Asia Pacific

TSMC to ramp up 32nm production in 2009

Nov 5, 01:15

Taiwan Semiconductor Manufacturing Company (TSMC) will ramp up 32nm production in 2009, with 22nm and 15nm production following in 2011 and 2013 respectively, according to the company's...

TSMC VP Jack Sun

Mapper and TSMC sign agreement for multiple e-beam lithography for 22nm node

Oct 14, 13:09

Mapper Lithography and Taiwan Semiconductor Manufacturing Company (TSMC) have signed an agreement, according to which Mapper will ship its first 300mm multiple-electron-beam maskless...

AMD and Advanced Technology Investment Company of Abu Dhabi to create new leading-edge semiconductor manufacturing company

Oct 8, 01:00

AMD and the Advanced Technology Investment Company (ATIC) of Abu Dhabi have announced the creation of a US-headquartered, leading-edge semiconductor manufacturing company to address...

ARM-based MID products to hit the market in 2009: Q&A with Warren East, CEO of ARM

Sep 30, 15:39

ARM Holdings recently held its annual board meeting for 2008 in Taipei, highlighting the importance of the Taiwan market to its long-term business deployment. Digitimes took the opportunity...

ARM CEO Warren East

IBM looks at mathematical techniques to help overcome lithography obstacles at 22nm

Sep 18, 12:22

In response to ever increasing demands for smaller, more powerful and energy-efficient devices for cloud computing and high-performance servers, IBM has announced the semiconductor...

55 items [2/2]
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  • IDF+San+Francisco+2013%3A+Intel+Xeon+E5%2D2600+v2+product+family+

    IDF San Francisco 2013: Intel Xeon E5-2600 v2 product family

    Intel has introduced the Xeon processor E5-2600 v2 product family (Ivy Bridge-EP), which is based on Intel's 22nm process technology, contributing to energy efficiency improvements...

    Photo: Color Kinetics, Sep 13.

  • Intel+Atom+C2000+processor

    Intel Atom C2000 processor

    Intel has unveiled its second-generation 64-bit Intel Atom C2000 product family of system-on-chip (SoC) designs for microservers and cold storage platforms (Avoton) and for entry...

    Photo: Company, Sep 9.

  • Intel+fourth%2Dgeneration+Core+processor+%28Haswell%29

    Intel fourth-generation Core processor (Haswell)

    Intel has introduced the fourth-generation Intel Core processor family, providing responsive, secure and powerful performance for consumers to create and consume content. With power...

    Photo: Company, Jun 5.

  • Acer+AT110+F2+server

    Acer AT110 F2 server

    In keeping with its aggressive strategy for commercial products, Acer has advanced its server line with a new generation of server products featuring Intel Xeon processor E3-1200...

    Photo: Company, May 17.

  • Intel+Ivy+Bridge%2Dbased+processsor

    Intel Ivy Bridge-based processsor

    Intel has introduced the quad-core third-generation Intel Core processor family, delivering dramatic visual and performance computing gains for gamers, media enthusiasts and mainstream...

    Photo: Company, May 2.

WCIT 2017
Global AP demand forecast, 2017-2020

21-Aug-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.