12-inch
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350 news items tagged 12-inch

  • winbond
    Winbond Electronics plans to expand its 12-inch fab capacity to 48,000 wafers per month by the end of 2017 from the current 44,000 units, according to the memory maker. The monthly...
  • Semiconductor Manufacturing International (SMIC) is aiming to become a global top-3 pure-play foundry chipmaker by 2020, according to the China-based company. In addition to advanced...
  • TSMC+installed+capacity+for+2017+to+rise+10%25
    Taiwan Semiconductor Manufacturing Company's (TSMC) new 12-inch plant in Nanjing, China will be ready for equipment move-in in September 2017, according to the Taiwan-based foundry...
  • Hefei Chang Xin's ambition to grow its DRAM business has seen some progress though the China-based firm has now chosen to keep a low profile. The company has been quietly renamed...
  • Taiwan-based Ardentec, which specializes in testing services for logic and memory chips, has reported net profits surged 115% on year to NT$228 million (US$7.6 million) in the first...
  • Sumco has reportedly cut its wafer shipments to Wuhan Xinxin Semiconductor Manufacturing (XMC), and given priority to Taiwan Semiconductor Manufacturing Company (TSMC), Intel and...
  • Specialty-IC packaging specialist XinTec has reported a seventh consecutive quarterly loss in the first quarter of 2017, in which net losses came to NT$248 million (US$8.23 million)...
  • Specialty DRAM and NOR flash memory maker Winbond Electronics is planning a new 12-inch wafer plant which will be located in Tainan, southern Taiwan or Singapore.
  • Acer+Switch+3+2%2Din%2D1+device
    Acer has announced two new 2-in-1 devices under its Switch series, the Switch 5 and 3, both using Windows 10. Both 2-in-1 devices feature Acer’s Active Pen, allowing users to...
  • UMC expects flat performance in 2Q17

    Thursday 27 April 2017
    United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2017, when the foundry chipmaker's capacity utilization rate...
  • Wayne+Allan%2C+VP+of+global+manufacturing+at+Micron
    Micron Technology has been actively allocating its global resources to enhance its DRAM and NAND flash product lines, according to Wayne Allan, VP of global manufacturing at the US-based...
  • Demand for semiconductor-grade silicon wafers has been robust, according to GlobalWafers, which expects the market to see tight supply through the end of 2018.
  • Taiwan-based Ardentec, which specializes in testing services for logic and memory chips, has recently broken ground for a new plant in Nanjing, China where Taiwan Semiconductor Manufacturing...
  • Silicon wafer suppliers have advised their semiconductor customers to sign long-term contracts amid tight supply, according to industry sources.
  • Several 12-inch fab projects implemented by China-based emerging chipmakers have been put on hold raising speculation about the country's overambitious plans to revamp the local chipmaking...
  • The supply of DRAM memory is likely to stay tight for a substantial period of time, according to Frank Huang, chairman for Taiwan-based pure-play foundry Powerchip Technology.
  • United Microelectronics' (UMC) recently-opened 12-inch wafer fab in Xiamen, China has obtained 40nm chip orders from MediaTek and Spreadtrum Communications, according to industry...
  • Powerchip Technology's joint venture fab in Hefei, China will be ready for trial production in June 2017, according to Frank Huang, CEO for the Taiwan-based pure-play foundry.
  • Taiwan Semiconductor Manufacturing Company (TSMC) will soon strike deals with a number of equipment, materials and components companies that will support production at its new 12-inch...
  • Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solution products and wafer handling equipment, has enjoyed a pull-in...
  • HLMC+VP+Jack+Shu
    China-based 12-inch wafer foundry Shanghai Huali Microelectronics (HLMC) has seen its Fab 1 run at full capacity with order visibility extended to the second half of 2017, according...
  • With major China-based chipmakers set to build new 12-inch fabs, the overall 12-inch fab capacity in China is expected to peak over the next two to three years.
  • Winbond Electronics has been approached by the Singapore government to set up a manufacturing site locally, and the Taiwan-based maker of specialty DRAM and flash memory is considering...
  • Globalfoundries' plan to construct a new 300mm wafer fab in Chengdu, China to satisfy demand for the foundry's 22FDX technology is well on track, with production at the facility set...
  • Prices for 12-inch blank silicon wafers are set to continue rising, driven by robust demand from foundries and memory chipmakers, according to industry sources.
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Related photos
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Acer Switch 5 2-in-1 device

Photo: Company, Thursday 4 May 2017

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Winbond SpiStack memories

Photo: Company, Wednesday 30 March 2016

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Apple new 12-inch ultra-thin MacBook

Photo: Company, Thursday 12 March 2015

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