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News tagged 12-inch
  • Last update: Friday 24 October 2014 [199 news items]

ProMOS fails again to sell 12-inch fab

Dec 12, 22:09

ProMOS Technologies failed, for the second time, on December 12 to sell its 12-inch fab located in Taichung, central Taiwan, through an open bid despite offerings from Vanguard International...

Mirle in talks to ink supply contracts with China-based panel makers

Dec 4, 14:26

Mirle Automation reportedly is accelerating its talks with two major China-based panel makers in order to ink TFT LCD equipment supply contracts for 2013. The equipment maker is also...

Opening bids for ProMOS 12-inch fab delayed

Newswatch - Nov 29, 15:18

ProMOS Technologies was originally scheduled to determine a buyer for its 12-inch fab located in Taichung, central Taiwan, in an open bid held today (November 29). However, as bidders...

VIS likely to win bid to take up ProMOS 12-inch fab

Nov 28, 22:04

ProMOS Technologies will hold an open bid to liquidate its 12-inch fab at the Central Taiwan Science Park (CTSP) on November 29. Some industry watchers believe that Vanguard International...

Powerchip may sell 12-inch fab equipment and land separately

Nov 28, 21:31

Powerchip Technology may tear down its P3 12-inch fab and sell the production equipment and land separately if it cannot liquidate the plant in one lot. Potential buyers including...

VIS in bid to acquire ProMOS 12-inch fab

Nov 26, 10:39

Faced with increased competition from Powerchip Technology in the LCD driver IC foundry sector, Vanguard International Semiconductor (VIS) is actively pursuing a bid to acquire ProMOS...

ProMOS to sell fab by year-end, become fabless

Nov 6, 11:11

ProMOS Technologies has announced plans to sell its 12-inch wafer plant and related facilities through open bidding by the end of 2012, in a move to become a fabless memory-IC comp...

ProMOS to become fabless

Chipbond 12-inch gold bumping lines to operate at full capacity in September

Sep 11, 16:33

LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...

Chipbond 3Q12 sales driven by demand for small-size panel driver ICs

Aug 21, 01:15

Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...

Samsung, Toshiba consider slowing capacity expansion to hold NAND flash prices

Jul 6, 02:00

Samsung Electronics and Toshiba reportedly are mulling plans to decelerate capacity expansion at their 12-inch fabs in order to stop NAND chip prices from falling further, according...

TSMC has no plans to purchase Renesas 12-inch fab, says chairman

Jul 5, 01:45

Taiwan Semiconductor Manufacturing Company (TSMC) has no plans to take up Renesas Electronics' 12-inch fab in Tsuruoka, Yamagata prefecture, but will continue to maintain a close...

Microsoft, Intel expect Windows 8 to help energize the netbook market

Jun 19, 01:40

As Microsoft is aggressively preparing its Windows 8 and Windows RT for launch in October to compete against Apple, sources from notebook players pointed out that Microsoft and Intel...

microsoft

Samsung to build new 12-inch fab for logic ICs

Jun 8, 14:42

Samsung Electronics has unveiled plans to build a new fabrication line in Hwaseong, South Korea, to meet the growing demand for logic products.

UMC holds groundbreaking ceremony for new facilities at 12-inch fab

May 24, 16:26

United Microelectronics (UMC) on May 24 held a groundbreaking ceremony for the fifth and sixth phase (P5 and P6) construction of its 12-inch plant located in southern Taiwan. Equipment...

UMC to break ground for new factories at Fab 12A

May 15, 12:09

United Microelectronics (UMC) will soon break ground for the fifth and sixth phase construction of its 12-inch fab located at the Southern Taiwan Science Park (STSP), according to...

UMC to break ground for new factory buildings at 12-inch fab in May

Apr 10, 01:30

United Microelectronics (UMC) is scheduled to hold a groundbreaking ceremony for new factory buildings (Phase 5 and 6) at its 12-inch Fab 12A located at the Southern Taiwan Science...

UMC is set to break ground for new facilities at its 12-inch fab in southern Taiwan

Aptos expanding 12-inch wafer level packaging business

Mar 14, 14:30

Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will...

Globalfoundries to acquire ProMOS for NT$20-30 billion, say sources

Feb 24, 01:45

Globalfoundries reportedly has agreed to take over financially-troubled ProMOS Technologies for NT$20-30 billion (US$0.7-1 billion), according to industry sources. By adding ProMOS'...

ProMOS to delist from Taiwan stock market on March 26

DRAM firms' entry into foundry market could lead to oversupply, says VIS chair

Feb 21, 12:20

With Taiwan-based DRAM chipmakers allocating more of their 12-inch capacities to produce non-memory products on an OEM basis, oversupply might surface in some foundry segments of...

VIS chairman Chang Ching-chu

Chip fab spending set to decline in 2012, says SEMI

Jan 11, 15:47

Semiconductor fab equipment spending is expected to decline by approximately 11% in 2012, according to SEMI's preliminary forecast. Spending is projected to drop in the first half...

STATS ChipPAC Taiwan to post sales growth in 1Q12 on short lead-time orders, says report

Newswatch - Jan 5, 14:00

Revenues at STATS ChipPAC Taiwan Semiconductor are expected to register slight sequential growth in the first quarter of 2012, thanks to a pull-in of testing orders for logic ICs...

Samsung Austin Semiconductor ramps new 12-inch fab

Dec 6, 12:05

Samsung Austin Semiconductor, Samsung Electronics' only wafer fabrication plant located outside Korea, has announced the completion of its 300mm automated fab, S2.

Powerchip mass producing driver ICs at 90nm

Dec 6, 11:02

Powerchip Technology has announced mass production of the foundry segment's 90nm high-voltage process technology for small- to medium-size driver ICs used in mobile device applications,...

Taiwan should not waste 12-inch capacity and manpower, says Winbond chairman

Dec 6, 01:45

While Taiwan's DRAM industry has been in serious trouble, the established 12-inch fab capacity and corresponding manpower in Taiwan should not be wasted and instead can be shifted...

TSMC board passes budget for advanced capacity expansion

Nov 9, 10:30

Taiwan Semiconductor Manufacturing Company's (TSMC) board of directors on November 8 approved a capex appropriation of US$1.06 billion specifically for increasing advanced technology...

Intel faces dropping Atom revenues

Oct 20, 01:25

Intel's Atom processor and chipset business revenues dropped 32% on year to only US$269 million in the third quarter of 2011, indicating that the netbook market has been strongly...

Rexchip might ramp R2 for Elpida

Sep 16, 01:20

Elpida Memory is likely to remove some of its production lines from Japan to Rexchip Electronics's second 12-inch fab, R2, which has been left idle since the shell construction was...

Semiconductor output on 12-inch wafers to nearly double by 2015, says IHS

Aug 24, 09:42

Semiconductor manufacturing using 12-inch wafers will see production nearly double from 2010 to 2015 as chip producers increasingly employ them for older, more mature products, according...

Macronix allocates more capacity to flash production

Jul 28, 17:00

Macronix International has said that capacity at its newly-opened 12-inch fab has almost all shifted to NOR flash production to meet demand for new orders. The capacity was originally...

VIS reportedly offers to buy ProMOS 12-inch fab

Jul 4, 11:46

Vanguard International Semiconductor (VIS), a Taiwan Semiconductor Manufacturing Company (TSMC) affiliate specializing in analog/mixed-signal and logic ICs, has offered to acquire...

ProMOS 12-inch fab at CTSP, central Taiwan

Elpida shifts partial capacity back to PC DRAM

Jun 17, 01:10

Elpida Memory has recently moved 20,000 to 30,000 12-inch wafers of capacity at its Hiroshima plant back to PC DRAM chips due to an unexpected slowing in orders for mobile DRAM used...

Rexchip revises 2011 capex

May 27, 01:15

Rexchip Electronics has budgeted NT$9 billion (US$311 million) in capex for 2011 to ramp a new 12-inch DRAM fab and upgrade to 30nm-class process technology, according to company...

Rexchip president Stephen Chen

Fujitsu to launch 7-inch Android tablet PC in 3Q11

May 19, 01:00

Japan-based notebook brand Fujitsu has recently launched its self-developed 10.1-inch LifeBook TH40/D tablet PC featuring Windows 7 in Japan, the US and Europe, and the company is...

TSMC receives more requests to produce analog chips using 12-inch, advanced processes

May 13, 01:10

A number of international analog IC companies have been in talks with Taiwan Semiconductor Manufacturing Company (TSMC) for allocation of 12-inch wafer production capacity to put...

TSMC to ramp new 12-inch fab ahead of schedule

May 6, 01:35

Taiwan Semiconductor Manufacturing Company (TSMC) has begun equipment move-in for the phase 1 facility of a new 12-inch fab (Fab 15) with volume production of 28nm technology products...

199 items [2/6]
  • Asustek+C300+Chromebook

    Asustek C300 Chromebook

    Asustek Computer has announced its Chromebook family powered by latest Intel Bay Trail-M processors. Available in two screen sizes - the 12-inch C200 model and 13-inch C300 - Asustek's...

    Photo: Company, Jun 26.

  • Microsoft+Surface+Pro+3+tablet%2Fnotebook

    Microsoft Surface Pro 3 tablet/notebook

    Microsoft has introduced the Surface Pro 3, a tablet and also a notebook. The device has multiple processor, RAM and storage options intersect with a design that, with a simple snap...

    Photo: Company, May 22.

  • Canon+202x205mm+image+sensor

    Canon 202x205mm image sensor

    Canon has developed what it claims is the world's largest CMOS image sensor, with a chip size measuring 202x205mm. The newly-developed CMOS sensor is among the largest chips that...

    Photo: Company, Sep 10.

  • FormFactor+300mm+full%2Dwafer+test+solution+for+DRAM

    FormFactor 300mm full-wafer test solution for DRAM

    FormFactor has introduced its next-generation 300mm (12-inch) full-wafer-contact probe card for DRAM devices - the SmartMatrix 100 probe solution. Incorporating a proprietary probe...

    Photo: Company, Dec 11.

  • Samsung+12%2E1%2Dinch+NC20+mini%2Dnote

    Samsung 12.1-inch NC20 mini-note

    VIA Technologies has announced that Samsung has adopted the VIA Nano processor in the new Samsung NC20 mini-notebook. The NC20 adopts the power efficient 1.3GHz VIA Nano processor...

    Photo: Company, Mar 4.

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