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News tagged 0.18-micron
  • Last update: Friday 13 October 2017 [21 news items]

ACTT complete IoT solutions available on SMIC 55nm eFlash platform

Oct 13, 10:54

Semiconductor Manufacturing International (SMIC) and Chengdu Analog Circuit Technology (ACTT) have jointly announced the availability of ACTT's analog IP solutions on SMIC's 55nm...

Faraday MFP ASIC shipments rise at CAGR of 38%

Jun 22, 21:20

Faraday Technology has announced that its MFP (Multi-Function Printer) ASIC solutions have surpassed 50 design wins since its introduction 10 years ago, and the MFP ASIC shipment...

UMC qualifies 0.18-micron BCD process for auto chips

Aug 1, 21:53

United Microelectronics (UMC) has verified on silicon its 0.18-micron Bipolar CMOS DMOS (BCD) process for the most stringent AEC Q100 grade-0 automotive chips, according to the foundry...

NewEdge Technology shipping wireless charging ICs in volume

Apr 7, 11:53

China-based NewEdge Technology has started shipping its wireless charging ICs in volume. The chips are being manufacturing using TSMC's 0.18-micron technology, according to industry...

Wireless charging set to take off in 2015

Hua Hong, eMemory partner to develop MCUs for IoT

Mar 24, 20:43

Hua Hong Semiconductor and eMemory Technology have jointly announced they will further strengthen their strategic partnership and work together in the field of microcontrollers (MCU),...

More IC vendors seeking wafer production capacity at foundry houses other than TSMC

Aug 12, 13:53

More fabless IC design houses are seeking wafer production capacity at Samsung Electronics, Globalfoundries, United Microelectronics Corporation (UMC) and Semiconductor Manufacturing...

Silterra 0.18-micron embedded flash technology enters mass production

Oct 16, 16:12

Malaysia-based IC foundry Silterra has announced the production release of its 0.18-micron embedded flash technology, dubbed C18E. Silterra has licensed SuperFlash technology from...

UMC develops 0.18-micron MTP technology

Sep 14, 14:40

United Microelectronics (UMC) has announced that under a joint development with IC design house Yield Microelectronics (YMC), it has developed a new 0.18-micron multiple-time programmable...

UMC launches 1.8-5V embedded EEPROM processes

Sep 1, 14:37

United Microelectronics Corporation (UMC) has announced breakthroughs in its development of embedded EEPROM (eEEPROM) process technologies, which deliver an I/O voltage range of 1.8V-5V...

Dongbu HiTek launches 180nm processes for analog, power and mixed-signal chips

Aug 30, 17:01

Dongbu HiTek, a South Korea-based contract chipmaker, has announced the availability of two new specialized process technologies at the 180nm node for implementing advanced analog,...

X-Fab, Micronas sign foundry deal

Aug 25, 14:40

Analog/mixed-signal IC foundry X-Fab Silicon Foundries and Micronas, a supplier of application-focused sensor and IC system solutions for automotive electronics, have announced the...

eMemory, Maxchip work on consumer ICs built using 0.18-micron OTP process

Aug 22, 10:56

Taiwan-based eMemory Technology, a provider of IP for logic embedded non-volatile memory (NVM), has announced that it is working with 8-inch foundry Maxchip Electronics to provide...

UMC to terminate merger deal with Hejian

Nov 19, 01:05

United Microelectronics Corporation's (UMC) board of directors has decided to terminate the company's merger agreement with Hejian Technology, according to the Taiwan-based contract...

VIS 2Q10 results beat guidance; raises capex

Aug 17, 11:23

Vanguard International Semiconductor (VIS) has announced that shipments, utilization rates and gross margins in the second quarter beat its guidance. The specialty IC foundry expects...

VIS chairman Chang Ching-chu

eMemory develops 0.18-micron 3.3V OTP solution

Jul 8, 14:35

Non-volatile memory IP developer eMemory Technology has announced the availability of a 0.18-micron 3.3V one-time-programmable (OTP) solution, developed using the company's proprietary...

TSMC announces automotive-qualified 0.25-micron OTP IP

Jun 30, 16:57

Taiwan Semiconductor Manufacturing Company (TSMC) has announced that its 0.25-micron one-time programmable (OTP) IP now meets Automotive Electronics Council (AEC) standard AEC-Q100...

TSMC announces 0.18-micron automotive embedded flash IP

May 27, 13:25

Taiwan Semiconductor Manufacturing Company (TSMC) has announced its 0.18-micron automotive embedded flash IP that passed AEC-Q100 product qualification requirements for a wide range...

CSMC inks licensing deal with IBM for 0.18-micron RF CMOS process

Oct 21, 15:57

CSMC Technologies, a China-based specialty foundry provider, has signed an agreement with IBM to license its proprietary 0.18-micron radio frequency (RF) CMOS process. The process...

Taiwan government denies report of relaxed rules on fab investment in China

Jul 30, 10:10

Officials from the Industrial Development Bureau (IDB) under Taiwan's Economics Ministry have denied a recent Chinese-language Economic Daily News (EDN) report that indicated...

SMIC and Chingis announce availability of 0.18-micron embedded flash process and IP

Jun 2, 12:10

Semiconductor Manufacturing International Corporation (SMIC) and Chingis Technology, a fabless chipmaker of embedded non-volatile memory (NVM) solutions, have announced the availability...

TSMC introduces 0.18-micron made embedded flash process

Apr 1, 10:41

Taiwan Semiconductor Manufacturing Company (TSMC) has recently announced that it has qualified its new 0.18-micron embedded flash (embFlash) process technology family that targets...

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