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NXP integrated mobile solutions enable security and connectivity

Press release [Monday 5 May 2014]

NXP Semiconductors (NXP Semiconductors N.V.), the global leader in integrated mobile solutions, showcased an expanded portfolio of cutting edge technology for total mobile solutions that reflect the company's long-term commitment and dedication to enable security and connectivity for a smarter world.

Mobile devices are dramatically changing the way people interact with both the physical and cyber world, while also bringing endless opportunities in terms of convenience, comfort and efficiency for end users. A growing number of top-of-the-line smartphones come built with an increasing number of security, sensor and audio chips, as phone makers look for innovative and intuitive user interface technologies to differentiate their product offerings from the competition.

NXP is a developer of contactless NFC, or near field communication chips, which are now widely used in mobile phones as well as banking and transportation cards. NXP's NFC solution has already been adopted by major mobile phone brands in Greater China. Among these design wins, the PN650 chip has been selected by OPPO, the leading smartphone supplier in China, for its latest smartphone Find 7 to initiate a wide range of mobile applications, including payments, loyalty programs, card access, transit passes and other customized services.

NXP is also the world's largest supplier of secure technology that successfully enables billions of transactions in peoples' daily lives, ensuring interoperability and security in a connected ecosystem.

In China, NXP Semiconductors' strategic partner Wuhan Tianyu Information Industry Co., Ltd (Tianyu) has been appointed as the supplier for the home-banking reader project by the Industrial & Commercial Bank of China (ICBC). NXP has a long-term close cooperation with Tianyu providing high quality Integrated Circuit (IC) chips for applications in banking card readers. Under the ICBC agreement with Tianyu, NXP will co-design and provide an advanced intelligent identification solution for the ICBC project. This is a breakthrough design that is driven in part by the increased demand for a more secure online shopping experience by Chinese consumers, and is expected to change our payment means in the future.

The NXP home-banking reader provides a more convenient and efficient mobile payment solution which can verify security authentication data with any professional reader or other devices such as cell phones, computers or set top-boxes which are enabled to read the financial IC card embedded with NXP chips. As such the security verification can be done without the need for an additional U-key dongle. The home-banking reader device is connected via a USB port or similar interconnectivity port and can support extensive-use dual-interface cards to safeguard online financial activities.

As smartphone makers continue to seek innovations to enhance user experience, NXP expects new market opportunities in its smart sensor platform solution. Coming complete with smart audio, the sensor hub is both a sensor fusion software and an environmental sensor. The platform can be used with a smartphone to read ambient temperature around phone users in real time and display it on the screen. Key to this system is a software algorithm that can calculate internal temperature of a smart phone and then reference it to an external temperature sensor to automatically extrapolate to get real ambient temperature.

Furthermore, NXP's new audio system transforms the listening experience, enabling louder, richer sound quality from virtually any mobile device. The improvement allows consumers, handset makers and operators to immediately hear the difference. NXP's TFA9895, second-generation speaker booster solution further improves the sound quality of handsets and tablets via a new multi-band compression feature that enhances the way music and voice sound, even at louder speaker volumes.

"Being fully aware of the increasing growth of mobile devices, NXP has been collaborating with partners globally to modernize the way people connect and interact with the world," said Steve Owen, Executive Vice President, NXP Semiconductors. "Security and connectivity has been part of NXP's core value for a long time. The collaborations represent our determination to lead and develop the ecosystem in the market. We're excited to work together with like-minded partners and are committed to continue these success stories with even more exciting applications and innovations ahead of us."


The DIGITIMES editorial staff was not involved in the creation or production of any sponsored content or press release provided in the commercial news wire service. Companies looking to contribute commercial news or press releases are welcome to contact us.

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