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TSMC leads supplier partners to complete first IC supply chain carbon footprint verification for Taiwan

Press release, Staff reporter, DIGITIMES [Friday 25 March 2011]

Taiwan Semiconductor Manufacturing Company (TSMC) has announced that it led 15 supplier partners in jointly completing Taiwan's first semiconductor supply chain carbon footprint verification. The project was completed with assistance from the Taiwan Ministry of Economic Affairs' Industrial Development Bureau (IDB), and is part of the IDB's "Semiconductor Supply Chain Carbon Footprint Assistance and Promotion Plan". It follows TSMC's successful completion of the IDB's "Supply Chain Carbon Inventory Assistance Plan" in June 2009.

Taiwan Semiconductor Manufacturing Company (TSMC) has announced that it led 15 supplier partners in jointly completing Taiwan's first semiconductor supply chain carbon footprint verification. The project was completed with assistance from the Taiwan Ministry of Economic Affairs' Industrial Development Bureau (IDB), and is part of the IDB's "Semiconductor Supply Chain Carbon Footprint Assistance and Promotion Plan". It follows TSMC's successful completion of the IDB's "Supply Chain Carbon Inventory Assistance Plan" in June 2009.

In this project, TSMC led 15 supplier partners to verify the carbon emissions of IC products produced by wafer fabs and packaging and testing facilities according to the PAS2050 standard. The manufacturing process was examined in great detail, going as far as emissions for each layer of an IC product, and final data was further verified by a third party. This project not only set records in terms of the number of participating companies and level of detail, it also shows that Taiwan's semiconductor supply chain is actively carrying out the government's carbon reduction policies and answering the global call for product carbon footprint labeling and eco-labeling. The results of this project will help the semiconductor industry establish the capability to provide carbon footprint and eco-labels to satisfy the future requirements of customers and consumers.

"As we face the challenges of global climate change, energy conservation and carbon reduction, TSMC will continue to collaborate with our suppliers, share our experience in cutting emissions, and do our part to protect the environment and fight global warming." said TSMC Senior VP Stephen Tso.

Participants in this project include Advanced Semiconductor Engineering (ASE), Taisil Electronic Materials, Air Products, Air Liquide Far Eastern, United Industrial Gases, Boclh Industrial Gases, Siliconware Precision Industries (SPIL), Basf Electronic Materials Taiwan, Tokyo Ohka Kogyo Taiwan, Cabot Microelectronics, Dow Electronic Materials, Asia Union Electronic Chemical, ProsperChem, Topco Quartz Products and Ardentec. Each company has completed personnel training, facility inventory and on-site surveys, data compilation and calculation, as well as checks for data accuracy. Third-party verification was completed at the end of January 2011.


The DIGITIMES editorial staff was not involved in the creation or production of any sponsored content or press release provided in the commercial news wire service. Companies looking to contribute commercial news or press releases are welcome to contact us.

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