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Winbond adopts SpringSoft Laker for mobile memory

Press release; Jessie Shen, DIGITIMES [Wednesday 25 August 2010]

SpringSoft on August 24 announced Winbond Electronics has adopted its Laker layout tools and design flows for its mobile memory devices such as SDR, low power DDR and cellular RAM.

The Laker system provides easy-to-use, automated tools including routing solutions that enable Winbond design teams to achieve significant time savings at both the block and chip level, schematic-driven layout (SDL) flow to increase user productivity, and built-in scriptable cells that dramatically reduce cell library development time, SpringSoft said in a statement.

"Using Laker, our design teams have been able to drastically cut routing and verification cycles for 65nm designs compared to other layout tools, while also continuously modifying designs to ensure the optimum power and highest quality implementation," said Mu-Tsai Lo, deputy director of the DRAM Design Department III at Winbond.

SpringSoft claimed that more than 300 companies have adopted its Laker layout system for designs down to 28 nanometers.


The DIGITIMES editorial staff was not involved in the creation or production of any sponsored content or press release provided in the commercial news wire service. Companies looking to contribute commercial news or press releases are welcome to contact us.

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