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Computex 2010: Winchip to showcase new line of DRAM modules

Press release; Jessie Shen, DIGITIMES [Tuesday 25 May 2010]

Taiwan-based Winchip Technologies will debut its brand-new DRAM modules, which include high-capacity DDR2 and DDR3 products, low-voltage DDR3 modules and overclocking-orient DDR3 series, at the upcoming Computex Taipei 2010 (June 1-5).

Winchip said it is now extending its Calligraphy-series high-capacity memory kit up to 24GB (4GBx6pcs) of DDR3 1333MHz LO-DIMM and 8GB (4GBx2pcs) dual-channel kit of DDR3 1600MHz for SO-DIMM to fulfill increasing demand for high-density solutions. The series targets research centers, design studios and other data-intensive users.

Winchip will also showcase an eco-friendly series that operates on DDR3 standard 1.35V supply voltage, which is designed for the Intel P55 platforms. In addition, its Robust-series modules overclocked to 2133MHz will be highlighted at the Computex booth (Nangang Hall, I0501).

Founded in 1996, Winchip already has years of OEM/ODM experience in motherboard, VGA card and notebook memory module manufacturing. In 2007, it began marketing DRAM modules - ranging from DDR, DDR2 up to DDR3 for both desktops and notebooks - under the Winchip brand.

Winchip Calligraphy-series DDR2 and DDR3 modules

Winchip Calligraphy-series DDR2 and DDR3 modules
Photo: Company


The DIGITIMES editorial staff was not involved in the creation or production of any sponsored content or press release provided in the commercial news wire service. Companies looking to contribute commercial news or press releases are welcome to contact us.

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