Applied Materials has announced a suite of new defect review and classification technologies for its SEMVision family of products to accelerate time to yield for leading-edge chip manufacturing at 1Xnm and beyond.
The Applied SEMVision G6 defect analysis system combines high-resolution, multi-dimensional imaging capabilities with machine learning intelligence of the Purity automatic defect classification (ADC) system.
The SEMVision G6 system's resolution is a 30% improvement over the previous generation, making it the highest available in the industry, the company claimed. The system's detection assembly and processing make possible high-quality topographical images of tiny and shallow defects. High dynamic range detection, collection of back-scattered electrons, and energy filtering enable high aspect ratio imaging.