The VIA QSM-8Q90 module measures just 70x70mm and is based on the new embedded QSeven form factor developed to meet the demands of various low-power and mobile applications. Featuring a VIA 1.0GHz VIA Nano E-series processor and the VIA VX900 MSP, the VIA QSM-8Q90 module is a building block for power constrained handheld application segments, including medical, advanced gaming, military and test and measurement equipment.
The VIA QSM-8Q90's on-board system memory includes 1GB of DDR3 RAM as well as support for two 1-lane PCIe expansion and an18/24-bit LVDS connector with resolutions up to 1366x768.
Gigabyte GV-R799D5-6GD-B graphics card
Gigabyte Technology has introduced its latest Radeon HD 7990-based graphics card, GV-R799D5-6GD-B featuring the Graphics...
Photo: Company, Apr 30.
Samsung Electronics has announced the Galaxy Mega - a 6.3-inch smartphone. The device is also light and thin, portable...
Photo: Company, Apr 16.
Samsung Electronics has announced that the Galaxy Note 8.0 is coming to the US market on April 11. Unveiled globally at...
Photo: Company, Apr 12.
AU Optronics (AUO) is exhibiting a 65-inch Ultra HD TV panel at the China Information Technology Expo & China Optoelectronics...
Photo: Company, Apr 10.
2013 Taiwan Internationbal Lighting Show
LED firms around the world are participating in the Taiwan International Lighting Show from March 26-29.
Date: Mar 29.
The exhibit is taking place at Nangang Exhibition Hall from June 19-21.
Date: Jun 21.
2012 Taiwan International Lighting Show
The 2012 Taiwan International Lighting Show was held on March 13-16 at the Taipei World Trade Center.
Date: Apr 19.
24-May-2013 markets closed
| Last | Change |
| TAIEX (TSE) | 8209.78 | -28.05 | -0.34% |
| TSE electronic | 310.89 | -0.43 | -0.14% |
| GTSM (OTC) | 118.64 | -0.71 | -0.59% |
| OTC electronic | 143.77 | -0.29 | -0.2% |
- Infineon ships security chips to Taiwan electronic passport program (May 23) - Company release
- Toshiba shrinks 64Gbit flash chips, but still lags Samsung (May 21) - PC World
- RFMD announces flexible gallium arsenide sourcing strategy (March 19) - Company release
- Samsung takes top spot in 28-32 nm chip foundry business: data (May 20) - Yonhap News
- Did Allwinner outsell Intel, Qualcomm? (May 8) - EE Times
- Imec and Renesas collaborate on ultra-low power short range radios (May 16) - Company release
- AMD announces memory modules designed for gaming (May 8) - x-bit Labs
- Fabless suppliers play increasing role in IC market (May 1) - IC Insights
- AUO aims at 20% market share for eTP touch panels for notebooks in 2013
- Digitimes Research: US new solar installations may only reach 3.5GW in 2013
- Solar cell prices may increase to US$0.43/W in Taiwan
- Sony Mobile to extend cooperation with ODM firms, says marketing executive
- Senao expanding retail chain in eastern China
- UDE likely to obtain orders from 2 game console vendors
- Lenovo 1Q13 net profit hikes 90% on year
- Phison warns several backend firms of possible patent infringement
- Facebook sets up OCP Taiwan
- Computex 2013: Memory module firms to showcase new SSDs
- Asia to be largest LTE market, says Nokia Siemens Networks greater China head
- ABB to produce PV inverters in South Africa
- TPV Technology suffers 1Q13 net loss of over US$10 million
- Digitimes Research: Seoul Semiconductor may see 2013 revenues up 40.3% on year
- Taiwan April manufacturing production index down, says MOEA
- Polarizer makers under price-cut pressure from clients
- AUO to supply panels for use in 2nd-gen Nexus 7, say sources
- US fab-tool book-to-bill stays above parity, says SEMI
- Intel, MediaTek and Elan taking up 60% of global touchscreen controller market
- HannStar to reach 95% utilization in 2Q13
- Windows 8 expected to take up 5-8% of global tablet shipments in 2013, say Taiwan makers
- Digitimes Research: Global LED tube light shipments to reach 220 million units in 2013
- Nvidia introduces GeForce GTX 780 GPU for gaming
- Quartz component maker TXC expects sales to rise through 4Q13
- Global LCD monitor OEM shipments down 14% on year in 1Q13, says TPV
- Releases
- White papers
- Bulletin
- Imagination says third party IP becoming a key driving force for silicon vendors
- Enriching multiple MEMS applications for mobile devices
- Dialog Semiconductor expands into ultrabooks and all-in-one PCs with a new generation of multi-touch display sensor ICs
- Altera Cyclone V GT FPGA is industry first low-power FPGA to achieve compliance for PCIe Gen2 at 5 Gbps
- Digi-Key adds Califia Lighting to line card of more than 650 global suppliers
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Chilisin at 2012 electronics Munich A5/159 & 260
- Chilisin sunken-type molded power inductor for MXM Graphic application
- Coto Technology claims industry's smallest MEMS reed switch
- Silicon Labs introduces single-chip digital radio receivers for CE devices
- Memory makers see better profits as chip pricing improves
- Globalfoundries quietly becoming a threat to competitors
- Digitimes Research: Mobile devices to drive 2013 DRAM market
Samsung reportedly to outsource more chips
Samsung Electronics reportedly is looking to expand the purchase of memory products, including mobile DRAM chips and eMMC NAND devices, from outside.
Micron reaches deal to acquire Elpida
Micron Technology and Elpida Memory's trustees have reached an agreement for Micron to acquire Elpida. Micron also announced a separate agreement with...
Taiwan DRAM firms mull fab sales
Taiwan-based DRAM chipmakers including Powerchip Technology and ProMOS Technologies are considering selling fabs in order to preserve cash and strengthen...
Specializing in the manufacture of memory chips and LCD panels, Samsung's component operations are undergoing a focus shift to advanced process design...
Opportunity lies for MEMS energy harvesting: Q&A with Holst Centre general manager Bert Gyselinckx
Digitimes recently interviewed Bert Gyselinckx, general manager of the Holst Centre in Eindhoven, to...
MEMS-enabled energy harvesting: Q&A with MIG executive director Karen Lightman
Digitimes recently spoke with Karen Lightman, the executive director of MEMS Industry Group (MIG),...
Complete mobile platform solutions: Q&A with Broadcom executive VP Robert Rango
In a relentless competition against rivals including Qualcomm, Nvidia and Media in the smartphone chipset...
Focused on embedded flash: Q&A with Spansion EVP Glenda Dorchak
Spansion recently announced a joint development with United Microelectronics (UMC) to integrate its...
- Taiwan DRAM module industry overview - Jun 2011
The year 2010 represented a peak in recent years for the DRAM module industry. Optimism surfaced in the second half of 2009 thanks to a return of demand on the...
- Taiwan DRAM-module industry overview - May 2010
Back to 2006 when total revenues for the third-party module market reached US$12.2 billion, Taiwan had over 15 vendors shipping DRAM modules under their own brand...
- Taiwan semiconductor equipment industry overview - Aug 2008
Worries about a global economic downturn have taken a toll on a number of industries, with the semiconductor industry being no exception. Players in the semiconductor...
- Foundry overview - Sep 2006
Taiwan's semiconductor industry has begun to out-run its global peers, once more, in 2006. This followed a trough in 2004, caused by over-inventory, plus volatility...
- 2H 2012 global TFT panel market forecast
Digitimes Research predicts there will be a total of 389 million large-sized TFT LCD panels shipped in 2H12, with 195 million in the third quarter and 194 million in the fourth quarter - with the total representing a 7.6% increase over the first half of this year.
- Trends and shipment forecast for 2H 2012 smartphone market
Smartphone shipments in 2010 and 2011 both enjoyed growth of more than 60%. Growth will decelerate in 2012 due to the high base, as well as a slowdown in consumer spending in Western Europe.
- Trends in Asia LED chip manufacturing industry
Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.