Taipei, Wednesday, April 16, 2014 21:11 (GMT+8)
partly cloudy
Taipei
24°C
Samsung 30nm 32GB RDIMM
Photo: Company [Aug 22, 2011]

Samsung Electronics has announced the development of 32GB DDR3 registered dual Inline memory modules (RDIMMs) that use 3D through silicon via (TSV) package technology.

Its 30nm-class technology leverages module performance and power features to deliver what it calls a greener memory solution than the preceding 40nm-class based modules. Engineering samples have been released for evaluation.

The new 32GB RDIMM with 3D TSV package technology is based on Samsung's 30nm-class 4Gb DDR3. It can transmit at speeds of up to 1,333Mbps, a 70% gain over preceding quad-rank 32GB RDIMMs with operational speeds of 800Mbps.

The 32GB-module consumes a mere 4.5 watts per hour - the lowest power consumption level among memory modules adopted for use in enterprise servers, Samasung said.

Compared to the 30nm-class 32GB load-reduced, dual-inline memory module (LRDIMM), which offers advantages in constructing 32GB or higher memory solutions, the new 32GB module provides approximately 30% additional energy savings.

DIGITIMES Research Data Services
China touch tracker
2014 global smartphone market forecast
  • Trends in the upstream LED equipment and materials industries, 2H13

    This report examines the outlook for upstream, which includes MOCVD equipment, rare earth materials and sapphire substrates, is also particularly significant as an indicator of trends in the LED industry as a whole over the next year.

  • Global AMOLED market analysis and forecast, 2011-2015

    This report analyzes the current state of development and strategies of the two largest AMOLED panel makers, Samsung and LG Display, examines the potential of the AMOLED handset panel and OLED TV markets, and takes an in-depth look at the competitiveness of S. Korea in the AMOLED sector.