Taipei, Tuesday, September 26, 2017 08:30 (GMT+8)
partly cloudy
Taipei
29°C
VIA ART-3000 embedded box PC
Photo: Company [Mar 8, 2010]

VIA Technologies has announced the VIA ART-3000, a complete, fanless and rugged embedded box system based on the unique I/O-rich Em-ITX form factor motherboard, offering the ideal solution for a variety of industrial applications including kiosk, POI and signage.

Available as a complete system including drives and memory, the fanless VIA ART-3000 combines a number of unique features including diskless booting, excellent vibration and shock resistance, dual Gigabit networking and dual LVDS video support. The VIA ART-3000's low power consumption helps the device to support fanless configurations with no moving parts making it ideal for ultra stable, mission critical implementations.

The VIA ART-3000 supports wall, table, reverse and VESA mounting options and can withstand temperatures of negative 20 to positive 60 Celsius degrees, vibrations of up to 5Gs and shock resistance up to 20Gs in compact flash storage configurations.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.