Taipei, Tuesday, June 18, 2013 12:42 (GMT+8)
mostly cloudy
Taipei
34°C
Samsung 0.6mm-thick multi-chip memory package
Photo: Company [Nov 10, 2009]
Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package is just half the thickness of a conventional memory package of eight stacked chips (or dies).

The advanced packaging technology delivers a 40% thinner and lighter memory solution for high-density multimedia handsets and mobile devices, the company said.

The new 0.6mm-thick package, which consists of eight identical dies (called an octa-die package), uses 30nm class, 32Gb NAND flash chips, each measuring just 15micron, to deliver a 32GB NAND solution.

In addition, the new package technology can be adapted to other existing MCPs, configured as system in packages (SiPs), or package on packages (PoPs). The breakthrough technique for 15micron-and-under chip thicknesses will allow for the design of high density solutions with small form factors, the company said.
  • Asus+ZenBook

    Asus ZenBook

    Asustek showcased the ZenBook, an ultrabook with a high definition display at Computex 2013.

    The 13.3-inch ZenBook...

    Photo: Jackie Chang, DIGITIMES, Jun 13.

  • Acer+Wintel%2Dbased+Iconia+W3+tablet

    Acer Wintel-based Iconia W3 tablet

    Acer has unveiled its Iconia W3, an 8.1-inch tablet running Windows 8 with an Intel Atom processor. The Iconia W3 will...

    Photo: Company, Jun 13.

  • Apple+MacBook+Air+with+fouth%2Dgeneration+Intel+processor

    Apple MacBook Air with fouth-generation Intel processor

    Apple has updated MacBook Air and introduced redesigned AirPort Extreme and AirPort Time Capsule base stations featuring...

    Photo: Company, Jun 13.

  • Acer+Liquid+S1+tablet%2Fphone+

    Acer Liquid S1 tablet/phone

    Acer has announced its tablet/phone, the Acer Liquid S1, designed to be a travel companion for consumers. With a 5.7-inch...

    Photo: Company, Jun 11.

18-Jun-2013 11:46 (GMT+8)

 LastChange

TAIEX (TSE)8021.35+28.46+0.36% 

TSE electronic302.08+1.62+0.54% 

GTSM (OTC)119.93+1.08+0.91% 

OTC electronic144.5+1.49+1.04% 

GKB Security Corporation
Trends in China IC design industry in 2013
Trends in China LED chip and packaging sector
  • Trends and shipment forecast for 2H 2012 tablet market

    Digitimes Research remains conservative about the prospects for the period, with half-year shipments projected to reach 49.18 million units and whole-year shipments being revised downward to 88.69 million units.

  • Trends and shipment forecast for 2H 2012 smartphone market

    Smartphone shipments in 2010 and 2011 both enjoyed growth of more than 60%. Growth will decelerate in 2012 due to the high base, as well as a slowdown in consumer spending in Western Europe.

  • 4Q12 trends in the Greater China touch panel industry

    In the second half of 2012, the market focus is on the iPhone 5, which uses in-cell touch screen technology. Due to the integration of display panels and touch panel functions, the high technological threshold will mean Taiwan touch panel makers are unable to enter the iPhone supply chain.