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Applied Materials to accelerate TSV adoption in 3-dimensional ICs
Photo: Company [Dec 2, 2008]
Applied Materials to accelerate TSV adoption in 3-dimensional ICs

Applied Materials has announced that it is leading a major effort to enable the widespread adoption of through-silicon vias (TSVs), an approach for vertically stacking integrated circuits (ICs) to boost chip performance and functionality in a smaller area.

TSVs enable applications such as DDR4 DRAM memories and future communications and mobile internet chips.

Since the biggest roadblock to implementing TSVs is cost, Applied is working internally and with other equipment suppliers to develop an integrated, high-performance on-wafer process flow to lower the cost, reduce the risk and accelerate time to market for customers.

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