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Infineon and ASE forge licensing partnership on new WLB technology
Photo: Company [Nov 14, 2007]

Infineon Technologies and Advanced Semiconductor Engineering (ASE) announced a partnership to introduce new embedded wafer-level ball-grid array (eWLB) technology.

To promote the advantages the new package offers, both parties have also forged a partnership uniting the technology developed by Infineon with the packaging know-how of ASE in a license model.

The first components are expected to be commercially available by the end of 2008.

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