Taipei, Wednesday, June 19, 2013 22:29 (GMT+8)
fair
Taipei
28°C
Surfect Technologies CEO Steve Anderson delivers keynote at SEMICON West 2006
Photo: Stephen Taylor, DigiTimes.com [Jul 13, 2006]
As miniaturization continues, the transition to flip-chip packaging and bumping continues to gain momentum, said Anderson.

The double-digit growth rates are there, but front-end thinking needs to move to the back-end, stated Anderson, adding that the transition is a huge conversion representing a very large opportunity.
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19-Jun-2013 markets closed

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