Taipei, Friday, August 22, 2014 02:43 (GMT+8)
partly cloudy
Taipei
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Surfect Technologies CEO Steve Anderson delivers keynote at SEMICON West 2006
Photo: Stephen Taylor, DigiTimes.com [Jul 13, 2006]

As miniaturization continues, the transition to flip-chip packaging and bumping continues to gain momentum, said Anderson.

The double-digit growth rates are there, but front-end thinking needs to move to the back-end, stated Anderson, adding that the transition is a huge conversion representing a very large opportunity.

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