Taiwan TSIA strengthen ties with India semiconductor association
The Taiwan Semiconductor Industry Association (TSIA) and the India Semiconductor Association...
Photo: TSIA
Applied Materials' new carina system overcomes barriers to etching high-k/metal gates
Applied Materials announced that it has turned up the heat in etching the world's most advanced...
Photo: Applied Materials
SUSS MicroTec unveils new ProbeShield technology for wafer-level testing
By implementing its ProbeShield technology, SUSS MicroTec said it has improved the way in...
Photo: SUSS MicroTec
East-West Center professor Dieter Ernst
Professor Dieter Ernst in his recently published paper 'Upgrading through innovation in a...
Photo: East-West Center
This prototype eDRAM, or Embedded Dynamic Random Access Memory chip, contains over 12 million bits and high-performance logic
IBM announced a breakthrough in microchip design that will more than triple the amount of...
Photo: Company
DLP exhibits slim DLP RPTV with 100,000:1 contrast ratio at CES
Texas Instruments (TI) is demonstrating A new DLP (digital light processing) rear-projection...
Photo: Company
Infineon's E-GOLDvoice chip will help reduce handset-manufacturing costs to below US$16
Infineon Technologies will start volume production of its E-GOLDvoice chip, a single-chip...
Photo: Company
Tricent AVD 300mm Reactor Chamber
Tricent AVD 300mm Reactor Chamber
Photo: Company
AIX 2800G4 HT (42x2") for high through-put and high yield manufacturing of GaN based LEDs
AIX 2800G4 HT (42x2") for high through-put and high yield manufacturing of GaN based LEDs
Photo: Company
Tricent AVD Deposition System for Advanced Metals and Dielectrics
Tricent AVD Deposition System for Advanced Metals and Dielectrics
Photo: Company
Aixtron's Lynx-iXP 300mm CVD System (back)
Aixtron's Lynx-iXP 300mm CVD System (back)
Photo: Company
Aixtron's Lynx-iXP 300mm CVD System (front)
Aixtron's Lynx-iXP 300mm CVD System (front)
Photo: Company
Freescale to showcase industrial, automotive and consumer electronics innovations at Electronica 2006
Freescale Semiconductor will have more than 20 hands-on demonstrations at the Electronica...
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NXP claims to have slashed smart card IC thickness by 50%
NXP Semiconductors claimed that its new SmartMX smart card IC can now be manufactured to...
Photo: NXP
ProMOS secures NT$20 billion fund for DRAM expansion
ProMOS Technologies signed a five-year syndicated loan agreement worth NT$20 billion with...
Photo: Company
