Taipei, Tuesday, November 21, 2017 22:17 (GMT+8)
partly cloudy
Taipei
22°C
IMEC EUV sensor dies
Photo: Company [Oct 13, 2011]

IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field, improving the tools' overlay and critical dimension (CD) tool performance, IMEC said.

The sensors were processed according to ASML's custom designs and specifications, with focus on superior lifetime and sensitivity to direct and high EUV irradiation doses. Two of the sensors are designed to calibrate, align and focus tool's lens systems. They have been integrated in functional sensor modules, and are being integrated in the NXE:3100 machines in the field. A third sensor is designed to monitor the NXE:3300's EUV dose.

IMEC revealed that the next milestone in progress is to build and qualify the different sensors for the NXE:3300 by the end of 2011.

UMC
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.