Taipei, Wednesday, September 20, 2017 03:15 (GMT+8)
partly cloudy
Taipei
27°C
Applied Producer InVia dielectric deposition system
Photo: Company [Mar 31, 2010]
Applied Producer InVia dielectric deposition system

Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system.

Using a proprietary CVD process, the InVia system delivers an innovative method for depositing the critical oxide liner film layer in high aspect ratio (HAR) through-silicon via (TSV) structures.

Implemented on Applied's Producer GT platform, the InVia system has much higher throughput than batch furnaces, with the capability to process up to eight times more wafers per hour at less than half the cost, especially when depositing very thick liners for high performance applications, the company said.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.