Taipei, Thursday, November 23, 2017 21:28 (GMT+8)
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SPIL anticipates 3Q revenues to exceed NT$10 billion
Photo: Allen Lin, DigiTimes [Jul 29, 2005]

Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders to meet large demand in 2H.

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