Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders to meet large demand in 2H.
In 2018, global server shipments will grow 8.5% to reach 13.73 million units. Digitimes Research estimates server shipments worldwide will grow at a CAGR of 6.5% during the period 2017-2022, with growth mainly driven by large-scale data centers and the China market.
Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.