Taipei, Thursday, July 24, 2014 06:46 (GMT+8)
mostly cloudy
SPIL anticipates 3Q revenues to exceed NT$10 billion
Photo: Allen Lin, DigiTimes [Jul 29, 2005]

Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders to meet large demand in 2H.

DIGITIMES Research Tracker Services
Media news email alerts
2014 global notebook demand forecast