Taipei, Wednesday, June 29, 2016 09:11 (GMT+8)
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Semicon Taiwan 2014: Focus on new processing, packaging technologies - related content
Josephine Lien, Taipei; Steve Shen, DIGITIMES [Tuesday 2 September 2014]
Realtime news
  • China market: Subor Electronics teams up with AMD to develop VR gaming chip, says report

    Bits + chips | 11h 46min ago

  • TCL sees smartphone shipments decline nearly 13% on year in May

    Mobile + telecom | Jun 28, 20:49

  • Digitimes Research: Samsung Display AMOLED panel shipments to increase to 560 million units in 2019

    Displays | Jun 28, 20:32

  • Commentary: Samsung Display to continue dominating AMOLED market until 2H17

    Displays | Jun 28, 20:29

  • IC design houses allocating 28/40nm orders to UMC, SMIC

    Before Going to Press | Jun 28, 20:37

  • Fingerprint sensor startup raises nearly NT$200 million

    Before Going to Press | Jun 28, 20:23

  • China market: Foxconn plans to resume retail deployment

    Before Going to Press | Jun 28, 20:17

  • Qualcomm aims to roll out 5G SoC solutions in 2018-2019

    Before Going to Press | Jun 28, 20:14

  • SAS not seeing rebound in China market

    Before Going to Press | Jun 28, 20:13

  • Arcadyan Technology to deal out 2015 dividend of NT$1.60

    Before Going to Press | Jun 28, 20:09

  • LTE Cat-M1, LTE Cat-NB1 to become mainstream IoT technology, says Qualcomm at MWC Shanghai 2016

    Before Going to Press | Jun 28, 20:08

  • Hiwin Technologies to deal out 2015 dividend of NT$2.30

    Before Going to Press | Jun 28, 20:07

  • Wafer Works to not deal out 2015 dividend

    Before Going to Press | Jun 28, 20:06

  • InterServ International to not deal out 2015 dividend

    Before Going to Press | Jun 28, 20:05

  • Egis fingerprint sensor adopted by Samsung

    Before Going to Press | Jun 28, 20:04

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28-Jun-2016 markets closed

 LastChange

TAIEX (TSE)8458.87-18.12-0.21% 

TSE electronic340.25-1.22-0.36% 

GTSM (OTC)125.75+0.81+0.65% 

OTC electronic159.97+1.39+0.88% 

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