Taipei, Wednesday, August 23, 2017 16:19 (GMT+8)
thunderstorms
Taipei
35°C
Winbond to hike 2014 capex for capacity ramps - related content
Josephine Lien, Taipei; Steve Shen, DIGITIMES [Tuesday 29 April 2014]
Realtime news
  • Digitimes Research: AR players shift focus to platform products

    IT + CE | 4min ago

  • Taiwan denies rumors about ending feed-in tariffs scheme

    Green energy | 54min ago

  • Another reform implementation drops India PC market to all-time low in 2Q17, says IDC

    IT + CE | 1h 7min ago

  • Taiwan market: Taiwan Mobile to launch smartphone-based affinity credit card

    Mobile + telecom | 1h 11min ago

  • Winbond announces equipment purchases

    Bits + chips | 1h 14min ago

  • Semiconductor market to grow 17% in 2017, says WSTS

    Bits + chips | 1h 45min ago

  • Taiwan July unemployment rate down on year, says DGBAS

    Bits + chips | 1h 46min ago

Pause
 | 
View more

23-Aug-2017 markets closed

 LastChange

TAIEX (TSE)10406.81+14.74+0.14% 

TSE electronic442.16+1.16+0.26% 

GTSM (OTC)136.79+0.35+0.26% 

OTC electronic200.36+0.50+0.25% 

WCIT 2017
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • The 10nm competition

    TSMC and Samsung have been competing for clients for the 10nm node.

  • Memory price rally

    DRAM prices have been rising amid tight supply.

  • ASE-SPIL merger

    A proposed merger between Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) has yet to receive approval from the US...

  • Japan earthquake

    Earthquakes in Japan often cause huge damage. They have had strong impacts on the country's electronics industry.

  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.