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UMC rolls out thick-plated copper process for PWM ICs - related content
Jessie Shen, DIGITIMES, Taipei [Thursday 17 January 2013]
Realtime news
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23-Aug-2017 markets closed

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WCIT 2017
China AMOLED panel capacity expansion forecast, 2016-2020
Global notebook shipment forecast, 2017 and beyond
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    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

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    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.