Taipei, Sunday, January 22, 2017 01:35 (GMT+8)
mostly cloudy
Taipei
16°C
UMC rolls out thick-plated copper process for PWM ICs - related company info
Jessie Shen, DIGITIMES, Taipei [Thursday 17 January 2013]
  • Chipbond Technology
  • Performance
    The company's stock price closed at NT$46.05 on the TSE on Thursday, January 19, 2017.
    The company has reported consolidated revenues of NT$1,629 million for December 2016, representing a 0.3% increase on month and 43.5% increase on year.
    For the third quarter of 2016, the company totaled NT$4,660 million in consolidated revenues, up 16.8% sequentially and up 8% on year.
    Brief

    Full name: Chipbond Technology

    Chinese name: 頎邦科技股份有限公司

    Short name: Chipbond

    Stock code: 6147

    Tax ID: 16130009

    Market: OTC

    Established: 2 Jul 1997

    Paid in capital: NT$6.49 billion

    Listed on OTC: 31 Jan 2002

    Listed on ESB: 2 Jan 2002

    Public since: 16 Jan 1999

    Website: www.chipbond.com.tw

  • Latest stock
    Chipbond [6147] historical stock price (NT$)
    DateVolume (k)TransactionsValueOpenHighLowCloseChangeAskBid
    20-Jan 2,871 1,750 131,512,200 46.10 46.20 45.60 45.60-0.45-0.98% 45.55 45.60
    19-Jan 3,279 1,920 151,498,050 46.05 46.40 45.90 46.05+0.20+0.44% 46.05 46.10
    18-Jan 2,988 2,051 137,378,100 45.35 46.15 45.35 45.85+0.20+0.44% 45.80 45.85
    17-Jan 2,634 1,664 119,810,650 45.45 45.70 45.30 45.65+0.05+0.11% 45.60 45.65
    16-Jan 1,769 1,080 80,350,450 45.20 45.65 45.15 45.60+0.20+0.44% 45.55 45.60
    13-Jan 4,826 2,577 219,992,700 45.55 46.05 45.35 45.40-0.20-0.44% 45.40 45.45
    • Source: TSE, compiled by Digitimes
    Latest sales

    Chipbond: Consolidated revenues, Dec 2015 - Dec 2016 (NT$m)

    Month

    Sales

    M/M

    Y/Y

    YTD

    Y/Y

    Dec-16

    1,629

    0.3%

    43.5%

    17,256

    2.3%

    Nov-16

    1,625

    0.5%

    17.1%

    15,627

    (0.6%)

    Oct-16

    1,617

    0.5%

    14.1%

    14,002

    (2.4%)

    Sep-16

    1,609

    3.8%

    14.9%

    12,385

    (4.2%)

    Aug-16

    1,550

    3.3%

    6.1%

    10,775

    (6.5%)

    Jul-16

    1,501

    5.7%

    3.2%

    9,225

    (8.3%)

    Jun-16

    1,420

    (0%)

    2.6%

    7,725

    (10.2%)

    May-16

    1,420

    23.4%

    (1.4%)

    6,305

    (12.7%)

    Apr-16

    1,151

    (11.5%)

    (21.4%)

    4,885

    (15.5%)

    Mar-16

    1,301

    19.9%

    (13.5%)

    3,734

    (13.5%)

    Feb-16

    1,085

    (19.6%)

    (17%)

    2,433

    (13.5%)

    Jan-16

    1,349

    18.8%

    (10.5%)

    1,349

    (10.5%)

    Dec-15

    1,136

    (18.2%)

    (22.6%)

    16,863

    (4.6%)

    *Figures are consolidated
    Source: TSE, compiled by Digitimes, January 2017

    Chipbond: Consolidated revenues, 3Q15 - 3Q16 (NT$m)

    Quarter

    Sales

    Q/Q

    Y/Y

    YTD

    Y/Y

    3Q-16

    4,660

    16.8%

    8%

    12,385

    (4.2%)

    2Q-16

    3,991

    6.9%

    (6.9%)

    7,725

    (10.2%)

    1Q-16

    3,734

    (5.3%)

    (13.5%)

    3,734

    (13.5%)

    4Q-15

    3,941

    (8.7%)

    (12.4%)

    16,863

    (4.6%)

    3Q-15

    4,317

    0.7%

    (7.9%)

    12,922

    (2%)

    *Figures are consolidated
    Source: TSE, compiled by Digitimes, January 2017

    Latest balance sheet and income statement

    Chipbond: Consolidated balance sheet, 3Q15 - 3Q16 (NT$k)

    Item

    3Q-2016

    2Q-2016

    1Q-2016

    4Q-2015

    3Q-2015

    Current assets

    11,943,677

    13,106,961

    13,577,686

    15,658,352

    16,860,841

    Intangible assets

    7,222,294

    7,206,783

    7,213,407

    7,220,111

    7,225,302

    Non-current assets

    21,981,284

    22,277,203

    22,652,430

    22,820,992

    22,908,453

    Assets

    33,924,961

    35,384,164

    36,230,116

    38,479,344

    39,769,294

    Current liabilities

    5,689,520

    8,218,918

    7,632,464

    10,027,000

    11,981,090

    Non-current liabilities

    4,531,780

    3,865,266

    4,219,879

    4,208,937

    3,797,091

    Liabilities

    10,221,300

    12,084,184

    11,852,343

    14,235,937

    15,778,181

    Stockholders' equity

    23,703,661

    23,299,980

    24,377,773

    24,243,407

    23,991,113

    *Figures are consolidated
    Source: TSE, compiled by Digitimes, January 2017

    Chipbond: Consolidated income statement, 3Q15 - 3Q16 (NT$k)

    Item

    3Q-2016

    2Q-2016

    1Q-2016

    4Q-2015

    3Q-2015

    NT$k

    % of sales

    NT$k

    % of sales

    NT$k

    % of sales

    NT$k

    % of sales

    NT$k

    % of sales

    Operating revenue

    4,660,109

     

    3,990,646

     

    3,733,921

     

    3,941,211

     

    4,316,760

     

    Gross profit (loss) from operations

    1,265,657

    27.2%

    950,508

    23.8%

    761,218

    20.4%

    792,397

    20.1%

    1,017,880

    23.6%

    Operating expenses

    338,231

    7.3%

    391,041

    9.8%

    364,298

    9.8%

    320,926

    8.1%

    317,818

    7.4%

    Operating income (loss)

    927,426

    19.9%

    559,467

    14%

    396,920

    10.6%

    471,471

    12%

    700,062

    16.2%

    Non-operating expenses and losses

    -141,536

    -3%

    -13,736

    -0.3%

    -109,366

    -2.9%

    10,731

    0.3%

    155,142

    3.6%

    Income from continuing operations before income tax

    785,890

    16.9%

    545,731

    13.7%

    287,554

    7.7%

    482,202

    12.2%

    855,204

    19.8%

    Net income (loss)

    597,112

    12.8%

    408,915

    10.2%

    211,250

    5.7%

    407,305

    10.3%

    667,034

    15.5%

    Diluted earnings per share (NT$)

    0.9

     

    0.6

     

    0.3

     

    0.6

     

    1.1

     

    *Figures are consolidated
    Source: TSE, compiled by Digitimes, January 2017

  • Chipbond Technology full profile

20-Jan-2017 markets closed

 LastChange

TAIEX (TSE)9331.46+13.34+0.14% 

TSE electronic375.79+0.66+0.18% 

GTSM (OTC)125.16-0.23-0.18% 

OTC electronic170.79-0.63-0.37% 

China smartphone touch-panel industry 2016 forecast
Display panels for wearable devices
Analysis of China revised domestic semiconductor industry goals
  • The 10nm competition

    TSMC and Samsung have been competing for clients for the 10nm node.

  • Japan earthquake

    Earthquakes in Japan often cause huge damage. They have had strong impacts on the country's electronics industry.

  • China: Big plans for homegrown chips

    A CNY120 billion (US$19 billion) national industry investment fund has been set up to help local foundries finance the build-up of advanced manufacturing...

  • ASE seeking to take up major stake in SPIL

    Advanced Semiconductor Engineering (ASE) is seeking to acquire an up to 25% stake in fellow packaging house Siliconware Precision Industries (SPIL).

  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.