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TSMC may join forces with OSAT firms to build SoIC ecosystem

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Monday 23 September 2019 0

In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D IC packaging field along with Intel and Samsung, but the company is also likely to build an...

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