Shanghai Huahong Grace Semiconductor Manufacturing Corporation ("HHGrace"), a wholly owned subsidiary of Hua Hong Semiconductor Limited (stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced successful conclusion of its Technology Symposium in the US on October 26, 2016, where it showcased its advanced manufacturing technologies and green foundry solutions in the era of Internet of Things (IoT), engaging many representatives from the local semiconductor design houses, technical partners, as well as equipment, material and EDA suppliers. This is the first technical event held by the Company outside of China after its incorporation.
Themed on "Smart IoT and Green Innovation", the event was chaired by Dr. Steven Lin, HHGrace VP Sales – North America & Japan. EVP Mr. Heng Fan reviewed HHGrace's track record and milestones in the welcome address, by referring to the company's leadership in the fields of embedded non-volatile memory (eNVM), power discrete and power management technologies. This leadership is based on the Company's continued differentiated innovation developing new projects and technologies and optimizing existing process platforms. Since its inception, the Company has been striving to expand in local and international markets, achieving significant results. In the third quarter just concluded, the Company reported record high revenue of USD185.3 million. Mr. Fan extended gratitude to all the customers and partners for their long-standing confidence in and support for HHGrace, and reaffirmed the company's commitment to empower our customers through continuous innovation to make people's lives better.
Mr. Calvin Hu, director of Strategy, Market and Development, presented the company's business dynamics and technical roadmap. He indicated that HHGrace, now operating three 200mm fabs in Shanghai, delivers a total monthly capacity up to 153,000 wafers. The capacity expansion has achieved remarkable results so far, which, as anticipated, will make the Company better positioned to embrace more opportunities in the market. The Company will further enhance its integration capabilities at different technical levels, especially integration of low-power eNVM and low-lost CMOS RF technologies. Mr. Hu also revealed HHGrace's roadmap to further reduce the size of memory units and IP modules and to optimize its advanced differentiated technologies, delivering efficient and cost-effective value-added solutions to various customers.
At the Symposium, HHGrace's technical team shared with its partners the latest results the Company has achieved in eFlash, BCD & power discrete, Si-based RF and automotive electronics technologies. HHGrace has made new breakthroughs in eNVM technologies, starting risk volume production of 90nm eFlash/eEEPROM. The accumulated shipment of HHGrace Super Junction MOSFET (SJNFET) process platform crosses the 160,000th wafers mark, attributable to the strong market demand for SJNFETs which are well-suited for high-efficiency, high-speed power switching applications. HHGrace is the only foundry in Mainland China possessing a complete set of IGBT backside processing technologies, which provides a full spectrum of solutions ranging from low to high voltage for green energy applications, and tailors various power devices according to customers' requirements. Besides, HHGrace is accelerating R&D of 6500V ultra-high voltage IGBT technologies for high-end industrial and energy applications. Through this technical event, HHGrace elucidated its latest technologies and services for the guests present.
eNVM technology that makes a "smart" difference
With embedded SONOS Flash and SuperFlash technologies as well as two derivative process platforms of eFlash + HV and eFlash + RF covering technical nodes from 0.18-micron to 90nm, the Company is well positioned to integrate its world-class embedded memory and low-power digital-analog mixed signal IC technologies with low-cost CMOS RF technology. Additionally, the Company delivers standard high-performance/density unit libraries, or customizes high-speed, low-power (ultralow static power) embedded Flash and EEPROM (Electrically Erasable Programmable Read Only Memory) IPs to help customers reduce complexity of their low-power designs to gain pre-emptive advantage in the market. HHGrace delivers the optimum smart card IC solutions in China. A security element of a major customer fabricated on the company's 0.11-micron eNVM platform has recently received a Common Criteria EAL5+ certification from an authoritative international certification body, which, as the first smart card IC acquiring the highest Common Criteria approval, marks a major milestone of security chip solutions for bankcard and other financial applications in China.
Power discrete & power management IC technologies that contribute to energy saving and emission reduction
HHGrace provides customers with unique and competitive super-junction MOSFET (SJNFET) and field-stop (FS) IGBT processes. Amongst these, the second-generation SJNFET technology and next-generation 600V-1200V FS IGBT process have achieved volume production to deliver world-class device performance. Soon, HHGrace will roll out the third-generation optimized SJNFET process platform that enables lower on-resistance and smaller chip size, to further cement its leadership in the power discrete field. As anticipated, it will deliver a platform for manufacturing green ICs featuring lower power, higher efficiency and smaller footprint for emerging applications like mobile devices, LED lighting and new energy vehicles.
Outstanding power management ICs (PMICs) are crucial to accommodate customers' increasing demands for environment sustainability and energy efficiency. As a provider of complete power IC foundry solutions, HHGrace delivers field-proven analog CMOS and highly integrated BCD/CMOS process platforms. Covering technical nodes from 1 to 0.13-micron, and voltage from 1.8 to 700V, these high-performance and reliable platforms can be widely used to manufacture chips for PMIC, fast charge, mobile phone/tablet PMU and smart metering applications.
RF technology that enables smart IoT connectivity
The RF SOI technology is ideal for RF front-end chips needed in smart phones, smart home and other smart devices like wearables. HHGrace has announced the 0.2-micron RF SOI (Silicon on Insulator) process design kit (PDK), which helps customers improve design efficiency and deliver high-quality RF components, thus reducing design changes and time-to-market. HHGrace will vigorously promote the RF/SOI technology in its home market to enable its customers to gain pre-emptive opportunities.
Additionally, the Company delivers a range of high-performance and cost-effective RF solutions, including RF CMOS, high-impedance silicon IPD (Integrated Passive Device), and eFlash process platform featuring a RF PDK.
Automotive electronics that secure green mobility
Having acquired the ISO/TS16949 quality management system certification for automobile industry in 2005, and introduced the zero-defect system for automotive electronics in 2008, HHGrace is now the only Chinese supplier of automotive-grade eFlash process platform and high-reliability eFlash technology compliant with AEC-Q100 Grade-1. In addition, the Company has received a VDA 6.3 Grade-A approval for process quality validation, achieved a wealth of experience in automotive technology migration and a zero-return record in volume production.
About HHGrace
Shanghai Huahong Grace Semiconductor Manufacturing Corporation ("HHGrace"), incorporated through the consolidation between Shanghai Hua Hong NEC Electronics Company, Limited ("Hua Hong NEC") and Grace Semiconductor Manufacturing Corporation ("Grace"), is a global leading pure-play 200mm foundry. HHGrace has three 200mm wafer fabrication facilities in Zhangjiang and Jinqiao of Shanghai, HHGrace offers production capacity over 153,000 wafers per month. HHGrace provides professional and highly value-added foundry services covering technology solutions from 1.0-micron to 90nm process nodes, focusing on differentiated technologies including eNVM (embedded Non-Volatile Memory), power management IC, power discrete, RF, as well as standard logic and mixed-signal. HHGrace is also in the process of developing MEMS solutions as one of its up-and-coming technologies. With its headquarters located in Shanghai, China, HHGrace extends its sales and technical supports to Taiwan, Japan, North America and Europe.
For more information about HHGrace, please visit: http://www.huahonggrace.com/
HHGrace's employees at the successful "Smart IoT and Green Innovation" Technology Symposium organized by the company
High attendances at HHGrace's successful "Smart IoT and Green Innovation" Technology Symposium
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