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ASE to compete for orders for low pin-count packaging from IDMs

Ingrid Lee, Taipei; Adam Hwang, DIGITIMES Asia Tuesday 30 August 2011 0

Taiwan-based Advanced Semiconductor Engineering (ASE), viewing that global outsourced production value for wire-bonding packaging of low pin-count ICs, including logic and discrete ICs, will grow at a compound annual growth rate of 19% in 2010-2015,...

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