Taipei, Wednesday, April 16, 2014 23:10 (GMT+8)
partly cloudy
Taipei
24°C
MSI launches WindBOX III with Intel Core 2 Duo for fanless system
Press release, September 17; Joseph Tsai, DIGITIMES [Friday 17 September 2010]

Micro-Star International (MSI) has announced the launch of an upgrade version of its WindBOX III (MS-9A35) for the industrial PC (IPC) market. This is the latest ultra-low power system with a fanless solution.

Following the fanless design of the WindBOX series, MSI debuts the WindBOX III based on the Intel Core 2 Duo processor and the Intel GS45 + ICH9M chipset to provide the latest ultra-low power and slim form factor into solid embedded applications. For clients' strong demand of supporting high resolution video, MSI debuts WindBOX III (MS-9A35) with great 3D graphics performance up to 1080P. It supports DirectX 10, shader model 4.0 and Intel clear video technology. MSI enhances I/O connectivity with six USB 2.0 ports, two powered COM ports, and multiple video output (DVI-I for VGA and DVI-D, HDMI) for dual independent displays. To fulfill expansion demand, WindBOX III has two mini-PCIe slots. For the Internet demand, WindBOX III comes with a module that has built-in Wi-Fi 802.11b/g/n and Bluetooth.

MSI WindBOX III supports a VESA wall-mount interface for easily mounting flat panel monitors and TVs and various scenarios like digital signage, thin-client, and POS.

MSI WindBOX III (MS-9A35) IPC

MSI WindBOX III (MS-9A35) IPC
Photo: Company

2014 China smartphone market and industry
TD-LTE market developments and forecast, 2014-2016
Global AMOLED market analysis and forecast, 2011-2015
  • China flat panel display industry outlook, 2013-2016

    This Digitimes Research Special Report outlines and analyzes the key trends and players that are influencing the continued development of China large-size and small-to medium size TFT LCD panel industry, while providing related growth forecasts for the industry through 2016.

  • TD-LTE market developments and forecast, 2014-2016

    TD-LTE has become the mainstream global choice for the construction of 4G asymmetric frequency spectrum networks. This Digitimes Research Special Report examines the current global status of TD-LTE, and forecasts developments in the TD-LTE supply chain in China and worldwide through 2016.

  • ASPs of TD-LTE chips to remain stable initially as suppliers are limited

    While a number of IC vendors have begun shipping chips supporting TD-LTE, including base band chips, radio frequency chips, APs, SoC solutions and soft modems, shipments of base band chips account for a majority share of total TD-LTE chip shipments currently, according to Digitimes Research.