CONNECT WITH US

IST merger to further lighten non-operating investment burden for Compal

Yen-Shyang Hwang, Taipei; Joseph Tsai, DIGITIMES Asia 0

The merger of Chipbond Technology and International Semiconductor Technology (IST) is expected to help the Compal Group turn its investment in IST from a loss to profit, according to industry sources.

The article requires paid subscription. Subscribe Now