Winbond signs NT$3.7 billion syndicated loan

Press release; Jessie Shen, DIGITIMES Asia Wednesday 15 July 2009 0

Winbond Electronics, a Taiwan-based memory chipmaker, on July 15 announced that it has signed a NT$ 3.7 billion (US$112.2 million) three-year syndicated loan agreement with nine banks. The loan will be used to repay Winbond's long-term loans and to...

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