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Winbond plans to raise bank loan; preps introduction of buried Wordline by 2009

Josephine Lien, Taipei; Esther Lam, DIGITIMES Asia Monday 4 August 2008 0

Despite still languishing in red in the second quarter of 2008, Winbond Electronics plans to raise a NT$5 billion (US$162.9 million) loan to fund operations. The company is also preparing to introduce Qimonda-developed buried Wordline technology to...

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