Broadcom and Qualcomm to aggressively grow FC-CSP proportion in 2008

Ingrid Lee, Taipei; Esther Lam, DIGITIMES Asia Thursday 10 January 2008 0

Leading communication chip designers including Broadcom and Qualcomm's plans to aggressively grow their chip packaging methods to flip-chip chip-scale packaging (FC-CSP) in 2008 are expected to boost sales at corresponding substrate makers, including...

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