Toshiba America Electronic Components (TAEC) announced at CES 2007 that it is offering a selection of four embedded NAND solutions developed by Toshiba: GB NAND, LBA-NAND, GB MCP and Package-on-Package (PoP).
The GB NAND is a single-component solution combining a memory controller with an SD interface, error correction code (ECC), wear-leveling and block management with MLC NAND flash memory.
The LBA-NAND is a single-component solution that combines high-density MLC NAND and a memory controller with logical block addressing, ECC, block management, and a standard NAND interface. The resulting device is a simple write/read memory that enables virtually seamless integration of MLC NAND into new or existing embedded flash applications that support SLC NAND, enabling access to greater storage capacities and improved cost/performance for consumer applications.
The GB MCP is a multi-chip package (MCP) memory that, in addition to standard MCP memory devices such as NAND plus SDRAM or NOR plus PSRAM, integrates a gigabyte or larger NAND flash memory with an SD card interface controller for high-density data storage applications, such as camera- and MP3-equipped cell phones.
The PoP technology is a modified MCP that saves significant circuit board space in cellular handsets and other mobile devices by stacking a high-density memory component on top of the processor so the two components require only one footprint on the board. Toshiba is offering low power SDRAM and high-density NAND flash PoP configurations in 14.0×14mm and 15.0×15.0mm PoP packages.





