While introducing several new fabrication tools at the ongoing SEMICON West, Applied Materials indicated that the first ICs manufactured on a 45nm process should be available in 2007, while chips produced at the 32nm node would only be seen after 2007, according to company president and CEO Michael R. Splinter.
Splinter said customer feedback for sub-90nm process production is satisfactory, and production tools for 45nm processes are on their way. The first batch of 45nm-process chips should be available in 2007, with production peaks during 2009-2010. Production at the 32nm node would only be introduced after 2007, said Splinter.




