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SMIC and GAPT cooperate on flip-chip packaging

Complied from outside sources, Shanghai; Esther Lam, DIGITIMES Asia Thursday 8 April 2004 0

China-based Global Advanced Packaging Technology (GAPT) is cooperating with Semiconductor Manufacturing International Corporation (SMIC) to set up a flip-chip packaging line in China, according to industry sources. The move is said to herald the maturing...

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