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ChipMOS to increase driver IC, flash and DRAM-related capacity (update)

Amy Lee, Taipei; Jack Lu, DIGITIMES Asia Friday 2 January 2004 0

Having signed a four-year NT$2 billion loan on Wednesday, ChipMOS Technologies plans to expand its packaging and testing capacity for LCD driver ICs, flash memory and DRAM produced on 12-inch wafers, according to SJ Cheng, deputy chairman and CEO of...

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