STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed a new high-performance device that punches above its weight by combining the performance, scalability, and security of microprocessor-based systems that are typically more complex with the simplicity and integration of microcontrollers (MCUs).
According to statistics, the global number of connected devices reached 16 billion by 2023, more than double the global population! However, there are many device manufacturers who have yet to adopt security by design principles leading to hacking and privacy risks at the population level. To protect consumers many governments consider device security as a crucial national security issue and are in the process of legislating for its implementation. This trend will impact the entire electronics industry, from IP, chips, software and end devices, posing a challenge for stakeholders to comply with various security regulations and laws.
With net zero carbon emissions becoming a global commitment, an automotive industry revolution gets well underway. TAIPEI AMPA and AUTOTRONICS TAIPEI 2024 will take place April 17-20 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1) in concurrence with 2035 E-Mobility Taiwan at the same venue. The three joint exhibitions will cast a spotlight on Taiwan's all-round automotive industry ecosystem as well as local and foreign iconic manufacturers' product roadmaps and technological strengths to help event participants capture next-generation mobility market opportunities.
Rugged embedded computing brand - Cincoze, will be at Embedded World 2024 (Hall 1, Booth 1-260) in Nuremberg, Germany, on April 9-11, 2024. Cincoze will display its range of world-class industrial embedded computing products around the theme of "Comprehensive AI Edge Computing Solutions," encompassing the full spectrum of industrial application environments in four dedicated zones, including the Rugged Embedded Fanless Computers, Industrial Panel PCs & Monitors, Embedded GPU Computers, and New Products.
Darveen Co., Ltd., a global provider specializing in rugged industrial computer solutions, is set to make a significant debut at Embedded World 2024 (Hall 3, Booth 3-230) in Nuremberg, Germany from April 9th to 11th, 2024. With a thematic focus on 'Embedded Solutions for Resilient Guidance and Steady Progress', Darveen presents a comprehensive display across three exhibition areas, showcasing a diverse range of industrial embedded product solutions meticulously designed for various industrial applications.
SK Hynix Inc. announced today that it has begun volume production of HBM3E, the newest AI memory product with ultra-high performance, for supply to a customer in late March. The company made public its success with the HBM3E development just seven months ago.
NEXCOM, a leading industrial computer manufacturer, has long been dedicated to edge computing and industrial IoT solutions. Its Mobile Computing Solutions Business Unit (MCS) focuses on the Edge AI railway and in-vehicle application fields.
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, has launched season 3 of its "Farm Different" video series.
iCatch Technology, a leading AI image processing IC design company, has recently launched the V77 AI Imaging SoC capable of recording 4K 60fps videos. Despite its enhanced system performance, the V77 maintains low power consumption, delivering a richer user experience for sports cameras and drone applications.
SK Hynix Inc. is ramping up its spending on advanced chip packaging, in hopes of capturing more of the burgeoning demand for a crucial component in artificial intelligence development: high-bandwidth memory.