- 23 Sep 2013:Two consortiums, including IBM and STMicroelectronics, have proposed building semiconductor wafer plants in India costing a total of $8 billion, a minister said after the government approved concessions to lure chipmakers.
- 30 Aug 2013:While showing production values of less than 3nm wavelength uniformity, the 1.0nm result came straight from development. The record 1.0 nm result demonstrates the capability to achieve "1 bin" GaN-on-Si LED wafers with Azzuro's technology.
- 20 Aug 2013:The construction of Intel's first wafer fab for processing 450mm diameter wafers is "well underway," having started in January 2013, an Intel spokesperson tells EE Times.
- 22 Jan 2013:Intel has presented Professor Stephen Hawking with a birthday gift, a 300mm wafer with the message "Happy Birthday Stephen Hawking" inscribed hundreds of times in copper letters defined using Intel's 32nm manufacturing procress.
- 28 Dec 2012:Some local residents and council representatives showed up December 26 at a meeting to protest against Taiwan Semiconductor Manufacturing Co.'s plan to build its first 450mm wafer fab plant at the Central Taiwan Science Park.
- 12 Dec 2012:Memory chipmaker Micron Technology is preparing to lay off about one third of its workforce at its wafer fab in Israel, according to local news reports.
- 27 Nov 2012:Evidence is starting to mount that foundry chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) could be about to follow Globalfoundries in building a wafer fab in up-state New York.
- 14 Sep 2012:STMicroelectronics is planning production stoppages at its wafer fabs in Crolles, France, and Catania, Italy, amid reports that CEO Carlo Bozotti will soon announce a reorganization of the company that may include a change of business model.
- 5 Sep 2012:FormFactor will acquire MicroProbe, a provider of advanced SOC wafer test solutions, for US$100 million in cash and US$16.8 million in stock, subject to customary adjustments. The merger is expected to close in the first half of FormFactor's fiscal quarter ending December 29, 2012.
- 31 Aug 2012:SEMI has announced the introduction of 450 Central (www.semi.org/450), a web-based information service to help the semiconductor industry efficiently transition to 450mm-ready solutions and keep the industry informed of important news and perspectives on 450mm wafer processing.
- 8 Aug 2012:The Nikkei Shimbun, Japan's economic newspaper, reported that Nikon is going to work with Intel to develop the next generation semiconductor manufacturing equipment capable of handling 450mm wafers.
- 16 Jul 2012:Aided by recent moves by Intel and some other big chipmakers, momentum seems to be growing for a big technology shift in making semiconductors. But some key players remain wary, based partly on their scars from the last transition.
- Future Horizons has said it included the comment "We assume GlobalFoundries will purchase IBM's semiconductor division and that Hynix/Micron will buy up the remaining smaller memory firms," in the conclusions of a report prepared by Future Horizons and Decision SA for the European Commission on the future of 450mm wafer processing in Europe.
- 12 Jul 2012:Applied Materials revises FY2012 business outlook on lower foundry equipment demand (July 10) - Company releaseThe company also revised its calendar year 2012 industry forecast for wafer fab equipment spending to US$30-33 billion, compared to its previous expectation of US$32-35 billion, in line with the market changes.
- 22 Jun 2012:Micron Technology has acquired Intel's 18% interest in IM Flash Singapore and the assets of IM Flash Technologies located at Micron's Virginia wafer fab. At the same time the scope of the JV between Intel and Micron has been expanded to include certain emerging memory technologies and Intel has prepaid US$300 million against future purchases of NAND flash memory.
- 19 Jun 2012:Fab 1, the 300mm operation of Globalfoundries here, could be used for 20nm process technology and for processing 450mm wafers, according to Rutger Wijburg, vice president and Fab 1 general manager. Wijburg was speaking to a group of journalists being given a tour of the Dresden wafer fab on June 15.
- 31 May 2012:The Intel wafer fab complex in Leixlip, Ireland, is set to receive investment to allow it to manufacture 14nm silicon and beyond, the company revealed in a presentation to analysts on May 10. The investment is expected to be more than US$1 billion.
- 23 May 2012:EpiGaN NV, a startup spun out of the IMEC research institute in 2010, has officially opened a production facility for gallium nitride on silicon wafers at the Research Campus in Hasselt, Belgium.
- 3 May 2012:More companies are being linked to the Indian government's plan to get one or more semiconductor wafer fabs constructed on the sub-continent. At least five chip companies have expressed an interest in supporting the project, according to a Hindu Business Line report.
- 24 Mar 2012:Globalfoundres announced that its Fab 1 in Dresden, Germany has shipped a quarter of a million semiconductor wafers based on 32nm High-k Metal Gate (HKMG) technology. The milestone represents a significant lead over other foundries in HKMG manufacturing, it claimed.
- 16 Mar 2012:Despite an amended wafer supply agreement that gives AMD the right to use other foundries to make its 28nm accelerated processing units (APUs), Globalfoundries expects AMD to increase its business with the firm in 2012.
- 5 Mar 2012:Advanced Micro Devices has said it agreed to a negotiated wafer price mechanism with Globalfoundries for 2012 and also agreed to transfer its remaining ownership interest in that company to the firm itself.
- 11 Oct 2011:Infineon succeeds in producing chips on new 300mm thin wafer technology for power semiconductors (October 10) - Company releaseInfineon Technologies has produced the first chips on a 300mm thin wafer for power semiconductors at the Villach site in Austria.
- 5 Oct 2011:One reason for the delay in both Q1 and Q2 could have been uncertainty on how to record the loss of manufacturing capacity, and capacity utilization, at Japanese companies affected by the aftermath of the great earthquake and tsunami that struck northern Japan on March 11. This will have had a small but significant effect in the first quarter but is likely to have had a much bigger effect in the second quarter.
- 8 Sep 2011:Japan's Sumco, the world's No.2 supplier of silicon wafers used to make chips, slashed its annual operating profit forecast by 37% on weak PC demand and slower-than-expected growth in smartphones and tablet PCs, and it said the fragile economy could make chip demand retreat further.
- 29 Jul 2011:"We are seeing significant near term declines in wafer fab equipment spending, and as result our September quarter shipments, revenues and earnings per share will be well below our June quarter results," Lam Research CEO Steve Newberry said.
- 13 Jul 2011:Toshiba and SanDisk on July 12 celebrated the opening of Fab 5, the third 300mm wafer NAND fabrication facility at Toshiba's Yokkaichi Operations in Mie Prefecture, Japan.
- 27 Jun 2011:3M has announced the opening of the company's application laboratory in Yangmei, Taiwan, for 200mm and 300mm temporary wafer bonding. The addition expands 3M's existing wafer support applications labs in Japan and the US to meet customer demand.
- 4 May 2011:Applied Materials and Varian Semiconductor Equipment Associates have announced the signing of a definitive merger agreement under which Applied will acquire Varian for US$63 per share in cash. The acquisition will extend Applied's leadership in wafer fabrication equipment with the addition of the technology leader in ion implantation.
- 28 Apr 2011:MagnaChip Semiconductor has signed a wafer foundry agreement with Atmel, a major provider of microcontrollers and touch solutions.
- 27 Apr 2011:
- 21 Apr 2011:The Indian government has established a committee to identify technology and potential investors that could set up India's first two commercial semiconductor wafer fabs, the country's Ministry of Communications and Information Technology said. The ministry put the rough cost of the two fabs at US$5 billion.
- 15 Apr 2011:Shin-Etsu Chemical has said that it will partially resume production at an earthquake-stricken silicon wafer factory in Fukushima Prefecture within a week or two.
- 12 Apr 2011:Chinese silicon wafer producer Jiangsu Huantai, a joint venture partner of MEMC Electronic Materials, aims to go public in 2012, according to company chairman Wang Lubao. Huantai expects to begin manufacturing LED materials later in 2011.
- 8 Apr 2011:LDK Solar has announced a business investment of approximately US$40 million to establish a new manufacturing plant in Nanchang City, Jiangxi Province (China). This new manufacturing facility will have capacity to supply two million 2-inch equivalent pieces of sapphire wafers per year and be positioned to capture the growing opportunities in the LED industry.
- 7 Apr 2011:The move leaves some to wonder if the silicon foundry giant is gradually moving into the IC-packaging world, thereby competing against Amkor, ASE and other subcontractors. Rick Cassidy, president of TSMC North America, said TSMC remains focused on the foundry market. But "lines are blurring" between some parts of the wafer manufacturing and packaging processes, Cassidy said.
- 31 Mar 2011:Renesas Electronics America will sell its semiconductor wafer fabrication facility in Roseville, California, to Telefunken Semiconductors. The sale price is approximately US$53 million, and the closing for the sale is planned for May 2, 2011. Telefunken also will enter into a supply agreement with Renesas for manufacturing services at the Roseville factory.
- 30 Mar 2011:Hynix CEO OC Kwon said that Hynix had around 45 days of wafer inventory and was reassured by quake-hit Japanese raw materials firms that there wouldn't be any major disruptions in wafer supplies.
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