7nm+ design libraries are not available yet, and thus design engineers at Apple, Nvidia or Qualcomm (to mention a few) are not expected to have a holistic (to borrow the terminology from ASML) view on cost/ benefits of 7nm+ with EUV.
Samsung plans to adopt 2.5D and fan-out packaging technologies at the new complex. Taiwan's TSMC was the first to commercialize the fan-out packaging, adopting it to Apple's A Series processors.
Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena.
Renesas Electronics will outsource all of its automotive microcontroller production to TSMC as it seeks to cut costly outlays on chipmaking machinery and concentrate on the development of software and semiconductors.
Nikkei Asian Review
Globalfoundries has asked Chinese regulators to probe Taiwan Semiconductor Manufacturing Co. for violating antitrust laws, said two industry sources familiar with the matter.
Nikkei Asian Review
Asian stocks retreated from Friday's record after Morgan Stanley downgraded Samsung Electronics and Taiwan Semiconductor Manufacturing Company, saying their shares had risen too much.
It is heard that the American manufacturer already agreed up to production of test chips and is making preparations accordingly. Chinese manufacturer is a company that develops SoC for mobile devices and is discussing internally about entrusting Samsung rather than Taiwanese companies with production of 7-nano chips.
Apple's acquisition of InVisage is very exciting as iPhone cameras are becoming a key feature to keep their smartphones ahead of the pack.
Apple continues to use a mix of Qualcomm and Intel cellular baseband processors in the iPhone X. Teardowns of the handsets also show that the company employed a combination of new and old tricks to pack features into its new flagship smartphone.
Qualcomm's Snapdragon 855 could be manufactured on the 7nm FinFET architecture, with TSMC expected to be the chief provider.
Globalfoundries has asked European antitrust regulators to investigate market leader TSMC, accusing the Taiwan-based firm of unfair competition, an industry source said on Monday.
Microsoft described Scorpio, the SoC inside its Xbox X One. Scorpio packs 7 billion transistors with 6 TFlops graphics performance in a 359-square millimeter chip made in a 16FF+ TSMC process. The chip, designed in partnership with AMD, also packs eight x86 cores running at 2.3 GHz and sharing 4 Mbytes L2 cache.
Samsung Electronics has decided to reduce its reliance on Qualcomm chips for next year's Galaxy S9 in an apparent tit-for-tat against the US chipmaker for making new foundry orders with its Taiwanese rival TSMC only, industry sources said on Aug. 21.
Samsung Electronics plans to triple the market share of its contract chip manufacturing business within the next five years by aggressively adding clients, a senior company executive said, as it targets new growth drivers for the chips business.
In the second half of 2018, it is planning to deploy the 7-nanometer process, using extreme ultra violet (EUV) lithography for the first time. It will be followed by 6-nanometer and 5-nanometer in 2019.
Samsung Electronics is planning to elevate its market share ranking, which is 4th now to second place this year. As Samsung Electronics can specialize its technology competitiveness ahead of its competitors', the company disclosed its aspiration to overtake Taiwan's TSMC, the industry leader in the future.
Samsung Electronics Foundry Business Department has set up a plan to go straight to 6-nano process based on 7-nano process. This is its strategy to counterattack Taiwan's TSMC as it took a supply of 7-nano chips from major customers such as Qualcomm and others that are consigned.
Samsung Electronics has lost Qualcomm's 7-nanometer (nm) chip order to Taiwan-based Taiwan Semiconductor Manufacturing Company (TSMC).
GlobalFoundries, the world's second largest contract chipmaker, aims to double its revenue from Japan over the next few years by launching cheaper chips for newer uses that will help it claw market share from a dominant Taiwanese rival, a senior executive said.
Samsung Electronics' plan to spin off foundry operations from the system LSI division is expected to increase Samsung's share of global contract chipmaking at the expense of Taiwan Semiconductor Manufacturing Co. (TSMC) and smaller rivals.
Today brings a report from Credit Suisse's John Pitzer, who maintains a Neutral rating on Intel shares, and a $35 price target. He concedes Intel has shown it maintains its manufacturing lead. He's just not sure it will be enough to give the company the edge it needs.
Intel says that when its long-delayed 10-nanometer Cannon Lake chips finally arrive, they'll be a "full generation ahead" of rivals Samsung and TMSC, thanks to "hyper scaling" that squeezes in twice as many transistors.
Samsung appears to be about a quarter ahead of TSMC with the ramp of 10nm process technology, according to a veteran chip analyst.
TSMC reports 76% yields on 256Mbit SRAM modules manufactured on 7nm.
Trying to cover the waterfront, TSMC disclosed plans for new high-, mid- and low-end processes at an annual event here. They included an enhanced 7nm FinFET node using extreme ultraviolet lithography, a 12nm upgrade of its 16nm process and a 22nm planar technology - its answer to fully depleted silicon-on-insulator (FD-SOI).
Samsung is going to make supplemental investments into its 10nm production lines in March 2017 and construct new 7nm semiconductor facilities in 2018. Its strategy is to secure ultra-fine processing technologies faster than its competitors.
One of a handful of startups aiming to attack Broadcom's dominance in Ethernet switching emerges from stealth mode this week. Nephos spun out of Taiwan's Mediatek and will push packaging technology from TSMC to a new level.
Intel split the Cyclone 10 into the performance-oriented GX and low-power optimized LP series. The GX series uses TSMC's 20nm process and is geared for a number of uses in the industrial, automotive, and broadcast markets. These include machine vision, robotics, infotainment, Advanced Driver Assistance Systems, and audiovisual applications.
Tom's Hardware Guide
TSMC's paper described a test chip that could pass for a commercial part and said it had "healthy" yields. Samsung described its use of extreme ultraviolet (EUV) lithography to repair what was clearly a research device, suggesting what it will call 7nm could still be years away.
TSMC is expected to undergo risk production of 7nm chipsets this year, and mass production next year, while Samsung now also cites an aggressive roadmap for "early 2018," meaning that the Galaxy S9 will most likely flaunt a 7nm processor.
After being the first to reach 22nm then subsequently 14nm FinFET, Intel's chip development pace has slowed considerably for the move to 10nm with many losing confidence in Intel's ability to maintain a chip manufacturing advantage over competitors such as TSMC, Samsung, and Globalfoundries.
Intel aims to gain the upper hand in the budding field of artificial intelligence with a new lineup of chip products in 2017, a senior executive said.
Nikkei Electronics Asia
Analysts with BlueFin Research Partners say that Taiwan Semiconductor Manufacturing Company (TSMC) will begin manufacturing Apple's A11 processor in late April.
The competing R&D alliance of Globalfoundries, Samsung Electronics and IBM announced a 7nm process technology, but it is taking a different approach. TSMC is using the current 193nm immersion lithography tools while the alliance's process relies on a new form of lithography, known as EUV or extreme ultra-violet, to pattern some critical layers.
As Linley Gwennap, the head of the eponymous research firm Linley Group, sees it, the "16nm" technology of TSMC and the others "is really 19nm," and the planned 7nm "will be about 13nm relative to Intel processes." Intel, he concludes, is a "a full node" ahead of the foundries, "Just as they have been for the past decade."
If you ask Anthony Yen, who leads EUV lithography development at TSMC, how critical EUV is to Moore's Law, he won't beat around the bush: "Totally critical. 100 percent critical. Very, very critical." TSMC expects to adopt EUV in 2020, when the company aims to begin producing chips on its 5-nm manufacturing line.
Nikkei Electronics Asia
Advances in semiconductor technology will be on display at the International Solid State Circuits Conference (ISSCC). Samsung and TSMC will describe 7nm SRAMs, Mediatek will show a 10nm SoC and STMicroelectronics will unveil a neural network accelerator made in a fully depleted silicon-on-insulator process.
Citigroup chip analysts Roland Shu and Christopher Danely conclude TSMC is a year ahead of Intel in foundry technique, even though Intel overall makes better transistors.