- 26 Jun 2012:Sony has announced plans to invest in Sony Semiconductor's Nagasaki Technology Center from the first half of the fiscal year ending March 31, 2013 through the first half of the fiscal year ending March 31, 2014, to increase the production capacity for stacked CMOS image sensors.
- 22 Jun 2012:Freescale selects Spansion flash memory for auto and industrial solutions (June 20) - Company releaseSpansion announced that Freescale Semiconductor has selected Spansion serial peripheral interface flash memory to provide its new Vybrid automotive and industrial solutions platforms with a simplified, high-bandwidth memory subsystem.
- 20 Jun 2012:Renesas Electronics said its alliance with Taiwan Semiconductor Manufacturing Company (TSMC) will help boost market share and operating margin.
- 12 Jun 2012:Chipmaker Cypress Semiconductor has offered to buy smaller rival Ramtron International for about US$87.6 million in cash, revamping a bid it made last year.
- 6 Jun 2012:Wieberneit has spent more than twenty years in the consumer and communication semiconductor space, serving in different R&D, CTO and GM positions at Trident Microsystems, Micronas and Infineon Technologies.
- Multinational semiconductor companies are no longer able to compete with China's fabless chips vendors in the consumer electronics IC business, according to Vincent Tai, CEO of RDA Microelectronics. "It's game over" for them, Tai asserted in a recent interview.
- Freescale Semiconductor shares are trading sharply higher after the company this morning named Greg Lowe as CEO effective immediately. He comes to the company from Texas Instruments, where he was senior VP of the analog business.
- 31 May 2012:Texas Instruments (TI) announced it has shipped nearly 6.5 billion units of copper wire bonding technology in its analog, embedded processing and wireless products. This milestone underscores TI's confidence in copper as a viable replacement to gold in its semiconductor product roadmaps.
- 30 May 2012:Standalone versus integrated dilemma is major theme of US$37 billion mobile handset semiconductor market (May 25) - ABI ResearchRevenues for core semiconductor components used in mobile handsets, including platform ICs and wireless connectivity ICs, are expected to reach almost US$37 billion per annum in 2012.
- With the investment from Intel Capital, Trigence Semiconductor will expand integration of Dnote to computing devices including Intel architecture-based PCs, Ultrabook and smartphones, and also expects to expand its LSI and licensing businesses.
- 10 May 2012:Its semiconductor unit ATIC had an accumulated deficit of 4.1 billion dirhams (US$1.12 billion)as of the end of 2011 and made losses in the past two years, Mubadala said in the filing. "No assurance is given that ATIC will be profitable in 2012 or in subsequent years," Mubadala said.
- 9 May 2012:Altair Semiconductor has released a cost and feature-optimized chipset tailored for the Indian TD-LTE market, which is expected to become one of the fastest-growing LTE markets in the world.
- 3 May 2012:Toshiba has announced that it will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand to a new manufacturing facility.
- China's Hony Capital plans to sell or outsource the operations at Elpida Memory's Hiroshima DRAM plant to Semiconductor Manufacturing International Corp (SMIC) if its bid for the bankrupt Japanese chipmaker is successful, the Nikkei business daily said on Tuesday.
- Globalfoundries Fab 8 adds tools to enable 3D chip stacking at 20nm and beyond (April 26) - Company releaseAt its Fab 8 campus in New York, Globalfoundries has begun installation of a special set of production tools to create TSVs in semiconductor wafers processed on the company's leading-edge 20nm technology platform.
- More companies are being linked to the Indian government's plan to get one or more semiconductor wafer fabs constructed on the sub-continent. At least five chip companies have expressed an interest in supporting the project, according to a Hindu Business Line report.
- 2 May 2012:RF chip maker TriQuint Semiconductor cut about 70 jobs in Florida last week after issuing a disappointing quarterly report and sales forecast, according to a report by the South Florida Sun Sentinel.
- 30 Apr 2012:Samsung Electronics has announced revenues of 45.27 trillion Korean won on a consolidated basis for the first quarter ended March 31, 2012, a 22-percent increase year-on-year.
- 24 Apr 2012:Chipmaker Freescale Semiconductor said that its first-quarter loss narrowed from last year as the company cut costs in the face of declining revenue.
- 19 Apr 2012:ASML dropped the most in six months after Europe's biggest semiconductor equipment maker didn't provide guidance for future orders in its first-quarter results.
- 18 Apr 2012:Taiwan Semiconductor Manufacturing Company (TSMC) will offer only one process at the 20nm node, a change from the multiple processes that the foundry giant has offered customers for the past several nodes, said Shang-yi Chiang, company executive VP and co-COO.
- 17 Apr 2012:Barclays Capital is raising its total lithography units forecast by more than 10 systems, from 234 to 251 in 2012. As many as 260 litho tools could be purchased for semiconductor manufacturing, as foundries are seeing high demand for 28nm chips.
- 11 Apr 2012:Although only 2% growth was registered in the worldwide semiconductor market in 2011, several companies posted results that were far different, according to IC Insights.
- The global semiconductor materials market increased 7% in 2011 compared to 2010, with record revenues in 2011 of US$47.86 billion.
- 10 Apr 2012:Taiwan Semiconductor Manufacturing Company (TSMC) has unveiled a new plant in the mountains of central Taiwan - not to make computer chips, but tea.
- 30 Mar 2012:Hynix Semiconductor has submitted an initial proposal to bid for Elpida Memory, the Japanese chipmaker that filed for bankruptcy last month. Hiynix said in a regulatory filing that it will decide whether to make a final bid after due diligence.
- Dialog Semiconductor has announced it is working closely with TSMC to develop its next generation of bipolar-CMOS-DMOS (BCD) technology specifically tailored to high-performance power management ICs (PMICs) for portable devices.
- 28 Mar 2012:InvenSense announces dual-source supply capability from TSMC, Globalfoundries (March 27) - Company releaseInvenSense has announced dual-source capability for its CMOS-MEMS supply from the two leading semiconductor foundries in the world.
- 24 Mar 2012:Globalfoundres announced that its Fab 1 in Dresden, Germany has shipped a quarter of a million semiconductor wafers based on 32nm High-k Metal Gate (HKMG) technology. The milestone represents a significant lead over other foundries in HKMG manufacturing, it claimed.
- 20 Mar 2012:Chang-Sik Choi, former executive vice president of Samsung Electronics, has been named president and CEO while Chan-Hee Lee, former executive vice president of MagnaChip Semiconductor, has been named president in charge of Dongbu HiTek's foundry business.
- 13 Mar 2012:Hynix Semiconductor said the chip industry is set to recover from the second half of this year as the prices of DRAM chips have been rebounding following news of Japanese chip maker Elpida Memory's bankruptcy protection filing late last month.
- 1 Mar 2012:SMIC, Brite Semiconductor tape out low leakage 40nm test chip on dual-core ARM Cortex-A9 processor (February 27) - Company releaseBrite Semiconductor, Semiconductor Manufacturing International (SMIC) and ARM have jointly announced the first tape out of a dual-core ARM Cortex-A9 MPCore test chip using SMIC's 40nm low leakage process technology.
- Clearly, this action tends to cast doubt on the validity of all future data published by WSTS. That sort of uncertainty has a huge ripple effect. It will impact chip companies doing planning and forecasting, market research analysts who depend on WSTS numbers - interpret them and predict market trends, and broad-spectrum media outlets.
- 24 Feb 2012:
- 22 Feb 2012:The US Supreme Court Tuesday refused to consider a Hynix Semiconductor appeal that argued Rambus shouldn't be able to enforce certain patents because it misled an organization that sets industry-wide standards for computer memory chips.
- 17 Feb 2012:Hynix Semiconductor said Thursday a US court has ruled in its favor in an antitrust claim filed by Rambus against the South Korean chipmaker.
- Applied Materials reached the highest in more than eight months after predicting higher profit than estimated, signaling that semiconductor makers are pulling out of a spending slump.
- 15 Feb 2012:Hynix Semiconductor jumped to an eight-month high in Seoul trading after Hyundai Securities said contract prices for DRAM chips increased and as financing delays at Japan's Elpida Memory raised the prospect of less competition.
- Atomic Precision Systems (APS), a little-known semiconductor equipment vendor specializing in deposition technology, has filed a patent infringement suit against Intel, IBM and Micron Technology claiming that they willfully infringed on an atomic layer deposition (ALD) patent held by APS, according to a statement issued by the company's law firm Tuesday.
- MagnaChip ramps 0.35-micron mixed-signal process for MEMS accelerometers (February 13) - Company releaseMagnaChip Semiconductor has announced its 0.35um mixed-signal process is in production for MEMS accelerometer applications.
- Indium Corporation features high-reliability, low-voiding flux coating for solder preforms at IMAPS
- Iceleads announces opening of Taiwan Branch Office to grasp local opportunities
- U-Reach delivers the largest and highest scalability standalone HDD/SSD Duplicator
- EverFocus will exhibit at Security Essen 2014 for showcasing the brand new solutions
- Photoimageable coverlay: A new FPCB non-rigid material that enhances hole-plugging with no glue overflow and 0.025mm alignment accuracy
- AccuTouch Five Wire Resistive Touchscreens
- Getting the Most Out Of Your Next Generation Digital Security Surveillance System
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Digitimes Research: iPhone ASP falls in 2Q14
- Digitimes Research: On-cell touch panels unlikely to win favor in high-end smartphones in 2014
- Digitimes Research: Hisilicon AP to give Huawei cost advantage in high-end mobile device market
- Commentary: Panel makers need to be more active in developing products
- Digitimes Research: Google looking to clean up Android device mess in emerging markets
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