- 18 May 2011:Disruptions and shortages continue to loom over MCU product suppliers who are already facing severe pressure in the supply chain.
- 22 Apr 2011:Renesas Electronics expects to restart production at a quake-hit factory in east Japan in mid June, about two weeks earlier than initially planned.
- 8 Apr 2011:Consumer electronics giant Sony, chipmakers Elpida Memory and Renesas, and electronics firms Panasonic and Toshiba have all said that production at some plants in northern Japan had been halted again due to power cuts triggered by a major aftershock that shook the region on April 7.
- 31 Mar 2011:Renesas Electronics America will sell its semiconductor wafer fabrication facility in Roseville, California, to Telefunken Semiconductors. The sale price is approximately US$53 million, and the closing for the sale is planned for May 2, 2011. Telefunken also will enter into a supply agreement with Renesas for manufacturing services at the Roseville factory.
- 30 Mar 2011:Renesas may outsource component production to Singapore, Taiwan (Mar 28) - Bloomberg (via San Francisco Chronicle)Renesas is in talks to outsource production of auto microcontrollers to Globalfoundries Singapore, and some mobile phone semiconductor production to Taiwan Semiconductor Manufacturing Co. (TSMC), Shino Inokuma, a spokesman for Renesas, said by telephone.
- 24 Mar 2011:Renesas Electronics has resumed operations at the factory sites in Aomori and Yamagata prefectures, northern Japan. The facilities were shut down following a massive earthquake and resulting tsunami on March 11.
- 22 Mar 2011:Renesas's semiconductor plant in Yonezawa, Yamagata Pref., re-opened on March 19.
- 15 Mar 2011:Renesas Electronics has confirmed that seven out of 22 of its factories in Japan has temporarily shut down production. Among these factories, Renesas Yamagata Semiconductor Tsuruoka Factory is currently beginning its startup procedures to restart its manufacturing.
- 28 Jan 2011:Net income for the fourth quarter of 2010 was US$33.1 million as compared to net losses of US$20.6 million in the prior quarter and losses of US$23.3 million a year ago. Net profits for 2010 were US$150.9 million, compared to losses of US$92.2 million in 2009.
- 28 Dec 2010:This agreement covers the use of Rambus patented innovations in a broad range of logic IC products offered by Renesas Electronics.
- 22 Oct 2010:Rambus saw its results improve in the third quarter of 2010 thanks to a licensing deal signed earlier this year with former legal opponent Samsung Electronics. It is negotiating to renew deals with Toshiba and Renesas Electronics after their patent licenses expired.
- 5 Oct 2010:"Although discussions are ongoing with Sony and Renesas Electronics to secure their continued access to our semiconductor packaging technology through a licensing relationship with us, these discussions have not sufficiently advanced, thus necessitating this lawsuit," said Henry Nothhaft, chairman and CEO of Tessera.
- 30 Jul 2010:Renesas Electronics has announced it will cut about 5,000 jobs mostly in the current fiscal year and completed by March 2013. It also revealed plans to use outside foundries on all of its 28nm and smaller geometry semiconductor products.
- 29 Jul 2010:Renesas Electronics is cutting nearly 10% of its 50,000 employees by the end of 2010 as it outsources production, according to a Nikkei report.
- 6 Jul 2010:Renesas Electronics and Nokia are deepening their collaboration by forming a strategic business alliance to develop modem technologies for HSPA+/LTE and its evolution, according to Renesas. As part of this alliance, the companies have entered into an agreement whereby Renesas is to acquire Nokia's wireless modem business for US$200 million.
- 2 Apr 2010:Completing a merger transaction between the former NEC Electronics and Renesas Technology, the newly established Renesas Electronics has commenced business operations.
- 25 Jan 2010:Hynix Semiconductor has agreed to pay US$3.32 million to settle a claim in the US accusing the company of price-fixing on memory chips, according to a US court record.
- 16 Dec 2009:
- 29 Oct 2009:Renesas Technology has reached a preliminary agreement to transfer its semiconductor manufacturing equipment business to Hitachi High-Technologies.
- 7 Sep 2009:A new super central processing unit (CPU), jointly developed by Japan's big chipmakers and funded by the Tokyo government, is coming up to challenge Intel.
- 27 Aug 2009:The Nikkei reported that Hitachi, Mitsubishi Electric and NEC are in talks to infuse a total of about 200 billion yen into Renesas and NEC Electronics to help smooth the way toward a merger. The merger has been delayed for the second time.
- 28 Jul 2009:
- 6 Jul 2009:
- 23 Jun 2009:
- 1 Jun 2009:
- 28 Apr 2009:NEC Electronics and Renesas Technology have agreed to enter into negotiations to integrate business operations. The two chipmakers plan to sign an agreement at the end of July, 2009 to form Japan's largest semiconductor maker.
- 27 Apr 2009:Chip-making companies Renesas Technology and NEC Electronics have agreed to integrate their operations by April next year, in a move that will form an entity surpassing Toshiba as Japan's largest chip maker, according to reports Friday.
- 26 Dec 2008:
- 23 Oct 2008:
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