Around the web
Displaying links tagged wafer [back to index]
28 Dec 201212 Dec 201227 Nov 201214 Sep 20125 Sep 201231 Aug 20128 Aug 201216 Jul 201212 Jul 201222 Jun 201219 Jun 201231 May 201223 May 20123 May 201224 Mar 201216 Mar 20125 Mar 201211 Oct 20115 Oct 20118 Sep 201129 Jul 201113 Jul 201127 Jun 20114 May 201128 Apr 201127 Apr 201121 Apr 201115 Apr 201112 Apr 20118 Apr 20117 Apr 201131 Mar 201130 Mar 201124 Mar 201112 Mar 201125 Feb 2011
Some local residents and council representatives showed up December 26 at a meeting to protest against Taiwan Semiconductor Manufacturing Co.'s plan to build its first 450mm wafer fab plant at the Central Taiwan Science Park.
CENS
Memory chipmaker Micron Technology is preparing to lay off about one third of its workforce at its wafer fab in Israel, according to local news reports.
EE Times
Evidence is starting to mount that foundry chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) could be about to follow Globalfoundries in building a wafer fab in up-state New York.
EE Times
STMicroelectronics is planning production stoppages at its wafer fabs in Crolles, France, and Catania, Italy, amid reports that CEO Carlo Bozotti will soon announce a reorganization of the company that may include a change of business model.
EE Times
FormFactor will acquire MicroProbe, a provider of advanced SOC wafer test solutions, for US$100 million in cash and US$16.8 million in stock, subject to customary adjustments. The merger is expected to close in the first half of FormFactor's fiscal quarter ending December 29, 2012.
Company release
SEMI has announced the introduction of 450 Central (www.semi.org/450), a web-based information service to help the semiconductor industry efficiently transition to 450mm-ready solutions and keep the industry informed of important news and perspectives on 450mm wafer processing.
SEMI
The Nikkei Shimbun, Japan's economic newspaper, reported that Nikon is going to work with Intel to develop the next generation semiconductor manufacturing equipment capable of handling 450mm wafers.
EE Times
Aided by recent moves by Intel and some other big chipmakers, momentum seems to be growing for a big technology shift in making semiconductors. But some key players remain wary, based partly on their scars from the last transition.
Wall Street Journal
Future Horizons has said it included the comment "We assume GlobalFoundries will purchase IBM's semiconductor division and that Hynix/Micron will buy up the remaining smaller memory firms," in the conclusions of a report prepared by Future Horizons and Decision SA for the European Commission on the future of 450mm wafer processing in Europe.
EE Times
The company also revised its calendar year 2012 industry forecast for wafer fab equipment spending to US$30-33 billion, compared to its previous expectation of US$32-35 billion, in line with the market changes.
Company release
Micron Technology has acquired Intel's 18% interest in IM Flash Singapore and the assets of IM Flash Technologies located at Micron's Virginia wafer fab. At the same time the scope of the JV between Intel and Micron has been expanded to include certain emerging memory technologies and Intel has prepaid US$300 million against future purchases of NAND flash memory.
EE Times
Fab 1, the 300mm operation of Globalfoundries here, could be used for 20nm process technology and for processing 450mm wafers, according to Rutger Wijburg, vice president and Fab 1 general manager. Wijburg was speaking to a group of journalists being given a tour of the Dresden wafer fab on June 15.
EE Times
The Intel wafer fab complex in Leixlip, Ireland, is set to receive investment to allow it to manufacture 14nm silicon and beyond, the company revealed in a presentation to analysts on May 10. The investment is expected to be more than US$1 billion.
EE Times
EpiGaN NV, a startup spun out of the IMEC research institute in 2010, has officially opened a production facility for gallium nitride on silicon wafers at the Research Campus in Hasselt, Belgium.
EE Times
More companies are being linked to the Indian government's plan to get one or more semiconductor wafer fabs constructed on the sub-continent. At least five chip companies have expressed an interest in supporting the project, according to a Hindu Business Line report.
EDN.com
Globalfoundres announced that its Fab 1 in Dresden, Germany has shipped a quarter of a million semiconductor wafers based on 32nm High-k Metal Gate (HKMG) technology. The milestone represents a significant lead over other foundries in HKMG manufacturing, it claimed.
Company release
Despite an amended wafer supply agreement that gives AMD the right to use other foundries to make its 28nm accelerated processing units (APUs), Globalfoundries expects AMD to increase its business with the firm in 2012.
EE Times
Advanced Micro Devices has said it agreed to a negotiated wafer price mechanism with Globalfoundries for 2012 and also agreed to transfer its remaining ownership interest in that company to the firm itself.
NASDAQ.com
Infineon Technologies has produced the first chips on a 300mm thin wafer for power semiconductors at the Villach site in Austria.
Company release
One reason for the delay in both Q1 and Q2 could have been uncertainty on how to record the loss of manufacturing capacity, and capacity utilization, at Japanese companies affected by the aftermath of the great earthquake and tsunami that struck northern Japan on March 11. This will have had a small but significant effect in the first quarter but is likely to have had a much bigger effect in the second quarter.
EE Times
Japan's Sumco, the world's No.2 supplier of silicon wafers used to make chips, slashed its annual operating profit forecast by 37% on weak PC demand and slower-than-expected growth in smartphones and tablet PCs, and it said the fragile economy could make chip demand retreat further.
Reuters Africa
"We are seeing significant near term declines in wafer fab equipment spending, and as result our September quarter shipments, revenues and earnings per share will be well below our June quarter results," Lam Research CEO Steve Newberry said.
Marketwatch.com (Dow Jones)
Toshiba and SanDisk on July 12 celebrated the opening of Fab 5, the third 300mm wafer NAND fabrication facility at Toshiba's Yokkaichi Operations in Mie Prefecture, Japan.
Company release
3M has announced the opening of the company's application laboratory in Yangmei, Taiwan, for 200mm and 300mm temporary wafer bonding. The addition expands 3M's existing wafer support applications labs in Japan and the US to meet customer demand.
Company release
Applied Materials and Varian Semiconductor Equipment Associates have announced the signing of a definitive merger agreement under which Applied will acquire Varian for US$63 per share in cash. The acquisition will extend Applied's leadership in wafer fabrication equipment with the addition of the technology leader in ion implantation.
Company release
MagnaChip Semiconductor has signed a wafer foundry agreement with Atmel, a major provider of microcontrollers and touch solutions.
EE Times
Energy Business Review
The Indian government has established a committee to identify technology and potential investors that could set up India's first two commercial semiconductor wafer fabs, the country's Ministry of Communications and Information Technology said. The ministry put the rough cost of the two fabs at US$5 billion.
PC World
Shin-Etsu Chemical has said that it will partially resume production at an earthquake-stricken silicon wafer factory in Fukushima Prefecture within a week or two.
Nikkei.com
Chinese silicon wafer producer Jiangsu Huantai, a joint venture partner of MEMC Electronic Materials, aims to go public in 2012, according to company chairman Wang Lubao. Huantai expects to begin manufacturing LED materials later in 2011.
Forbes
LDK Solar has announced a business investment of approximately US$40 million to establish a new manufacturing plant in Nanchang City, Jiangxi Province (China). This new manufacturing facility will have capacity to supply two million 2-inch equivalent pieces of sapphire wafers per year and be positioned to capture the growing opportunities in the LED industry.
Company release
The move leaves some to wonder if the silicon foundry giant is gradually moving into the IC-packaging world, thereby competing against Amkor, ASE and other subcontractors. Rick Cassidy, president of TSMC North America, said TSMC remains focused on the foundry market. But "lines are blurring" between some parts of the wafer manufacturing and packaging processes, Cassidy said.
EE Times
Renesas Electronics America will sell its semiconductor wafer fabrication facility in Roseville, California, to Telefunken Semiconductors. The sale price is approximately US$53 million, and the closing for the sale is planned for May 2, 2011. Telefunken also will enter into a supply agreement with Renesas for manufacturing services at the Roseville factory.
Company release
Hynix CEO OC Kwon said that Hynix had around 45 days of wafer inventory and was reassured by quake-hit Japanese raw materials firms that there wouldn't be any major disruptions in wafer supplies.
Reuters
Citigroup analyst Timothy Arcuri asserted in a research note that that FormFactor has received a "major order" from Elpida Memory for wafer probe cards.
Forbes
Micron Technology is trying to secure its supply of crucial silicon wafers following Japan's devastating earthquake and said it was too soon to gauge the disaster's impact on its business.
Reuters
The two Toshiba-SanDisk JV semiconductor manufacturing plants, Fab 3 and Fab 4, were down for a short period of time due to the earthquake and were back up and operational as of Friday morning, Pacific Time. SanDisk's current assessment is that there has been minimal immediate impact on wafer output due to the earthquake.
Company release
On Semiconductor plans to invest more than US$30 million to expand capacity and capabilities at its 8-inch wafer manufacturing facility in Gresham, Oregon. The facility remains the company's most advanced wafer fab - with current production technologies down to 0.11-micron.
EE Times
2/3 pages